Abstract: A processing method of forming a through-hole in a workpiece by means of a pulsed laser beam includes the steps of providing a removable sacrifice layer on the workpiece, forming a through-hole in the workpiece by the laser beam in a state where the sacrifice layer is provided, and removing the sacrifice layer from the workpiece after the step of forming the through-hole.

Abstract: An object is to obtain a module in which an optical fiber can be inserted after a ferrule has been mounted on a circuit board. There is provided an optical module (100) in which at least a ferrule (33) and an electric component (57) are mounted on a circuit board (35) on which external electrodes (63) have been mounted; a fiber through-hole is formed in the ferrule (33) in a position in which the optoelectric conversion device (31) is mounted on one end surface and that corresponds to an active layer of an optoelectric conversion device (31); and the optoelectric conversion device (31) of the ferrule (33) is electrically connected to the electric component (57). In the ferrule (33), an opening in the one end face of the fiber through-hole that faces the optoelectric conversion device (31) is blocked by a transparent substance (61), and a portion that excludes the fiber through-hole at the other end surface is are monolithically covered with a molding resin (55).

Abstract: By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.

Abstract: A production process of a perforated porous resin base, comprising Step 1 of impregnating the porous structure of a porous resin base with a liquid or solution; Step 2 of forming a solid substance from the liquid or solution impregnated; Step 3 of forming a plurality of perforations extending through from the first surface of the porous resin base having the solid substance within the porous structure to the second surface in the porous resin base; and Step 4 of melting or dissolving the solid substance to remove it from the interior of the porous structure, and a production process of a porous resin base with the inner wall surfaces of the perforations made conductive, comprising the step of selectively applying a catalyst only to the inner wall surfaces of the perforations to apply a conductive metal to the inner wall surfaces.

Abstract: An anisotropic conductive film 2 contains electrically conductive particles 6 dispersed in an adhesive agent 30 for electrode connection, the adhesive agent containing an epoxy resin, which is an insulating thermosetting resin, as a main component, a phenoxy resin having a molecular weight of 30,000 or more, a latent hardener, a polyvinyl butyral resin having a glass-transition temperature of 100° C. or higher, and a polyvinyl butyral resin having a glass-transition temperature of 90° C. or lower. There is provided the high-heat-resistant anisotropic conductive film which suppresses a reduction in repairability and which can be used for electrodes having a finer pitch, i.e., having a minimum pitch of 150 ?m or less, when electrodes are connected with the anisotropic conductive film.

Abstract: Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate 1 for a printed wiring board includes an insulating base 11, a first conductive layer 12 that is stacked on the insulating base 11, and a second conductive layer 13 that is stacked on the first conductive layer 12, in which the first conductive layer 12 is a coating layer composed of a conductive ink containing metal particles, and the second conductive layer 13 is a plating layer.

Abstract: A processing method of forming a through-hole in a workpiece by means of a pulsed laser beam includes the steps of providing a removable sacrifice layer on the workpiece, forming a through-hole in the workpiece by the laser beam in a state where the sacrifice layer is provided, and removing the sacrifice layer from the workpiece after the step of forming the through-hole.

Abstract: Provided is a film adhesive that has a high flexibility and a high adhesion strength and is easy to prepare by mixing. The film adhesive contains, as essential components, a bisphenol A phenoxy resin having a molecular weight of 30,000 or more, an epoxy resin having a molecular weight of 500 or less, a glycidyl methacrylate copolymer, a rubber-modified epoxy resin, and a latent hardener. Preferably, the weight of the glycidyl methacrylate copolymer per epoxy equivalent is 1000 or less.

Abstract: There is provided a connecting structure with high reliability produced at low cost through the production process simplified by connecting connection electrodes, each including an organic film as an oxidation preventing film, to each other using a conductive adhesive. An electrode-connecting structure in which a first connection electrode 2 and a second connection electrode 10 are connected to each other with a conductive adhesive layer 9 therebetween includes organic films 6 and 11 formed on at least the first connection electrode and conductive particles 8 contained so that major axes of the particles are oriented in a thickness direction of the conductive adhesive layer and the average length of the major axes is larger than the total thickness of at least the organic films and the conductive adhesive layer, wherein the conductive particles pierce the organic films and contact the first connection electrode and the second connection electrode.

Abstract: An expanded porous polytetrafluoroethylene film having residual strain of at most 11.0% as measured after a load required to indent a rod, which is in a columnar form that its outer diameter is at least 2 mm and at least 1.9 times as much as the thickness of the film, and has a smooth plane perpendicular to its axis at a free end surface thereof and a modulus of longitudinal elasticity of at least 1.0×104 kgf/mm2, up to 20% of the film thickness at a strain rate of 100%/min from the free end surface is applied repeatedly 20 times, and a production process of the porous film, in which a step of compressing an expanded porous polytetrafluoroethylene film having a high draw ratio is provided.

Abstract: The invention offers an anisotropic electroconductive sheet suitable for connecting with pin electrodes of a through-hole-mounting type. The sheet has electrical conductivity in the direction of thickness. The sheet comprises a base film formed using a porous film (1) that is made of synthetic resin and that has electrically insulating property. The porous film (1) is provided with a plurality of holes (3) that are formed in the direction of thickness so that pin electrodes (2) can be through-hole-mounted. The inner walls of the holes (3) are coated with metals (4). The inserted pin electrodes (2) become electrically continuous, through the metals (4), with the surface opposite to the surface from which the pin electrodes (2) are inserted.

Abstract: An anisotropic conductive film 2 contains electrically conductive particles 6 dispersed in an adhesive agent 30 for electrode connection, the adhesive agent containing an epoxy resin, which is an insulating thermosetting resin, as a main component, a phenoxy resin having a molecular weight of 30,000 or more, a latent hardener, a polyvinyl butyral resin having a glass-transition temperature of 100° C. or higher, and a polyvinyl butyral resin having a glass-transition temperature of 90° C. or lower. There is provided the high-heat-resistant anisotropic conductive film which suppresses a reduction in repairability and which can be used for electrodes having a finer pitch, i.e., having a minimum pitch of 150 ?m or less, when electrodes are connected with the anisotropic conductive film.

Abstract: There is provided an anisotropic conductive film that contains a radically polymerizable substance, a polymerization initiator that generates a radical by heating, a phenoxy resin having a molecular weight of 30,000 or more, and electrically conductive particles, wherein the anisotropic conductive film has a DSC exothermic onset temperature of 100° C. or lower and a DSC peak temperature of 120° C. or lower when measurement is performed at a rate of temperature increase of 10° C./min. The film is capable of establishing a sufficient electrical connection between circuit boards by heating at a low mounting temperature for a short time and is free from problems such as a reduction in connection performance with time in a high temperature and humidity atmosphere.

Abstract: A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.

Abstract: The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.

Abstract: An object is to obtain a module in which an optical fiber can be inserted after a ferrule has been mounted on a circuit board. There is provided an optical module (100) in which at least a ferrule (33) and an electric component (57) are mounted on a circuit board (35) on which external electrodes (63) have been mounted; a fiber through-hole is formed in the ferrule (33) in a position in which the optoelectric conversion device (31) is mounted on one end surface and that corresponds to an active layer of an optoelectric conversion device (31); and the optoelectric conversion device (31) of the ferrule (33) is electrically connected to the electric component (57). In the ferrule (33), an opening in the one end face of the fiber through-hole that faces the optoelectric conversion device (31) is blocked by a transparent substance (61), and a portion that excludes the fiber through-hole at the other end surface is are monolithically covered with a molding resin (55).

Abstract: Disclosed are expanded polytetrafluoroethylene products, such as porous polytetrafluoroethylene tubes, having high axial tear strength and a process for their production. Each expanded polytetrafluoroethylene product has a microstructure, which comprises fibrils and nodes interconnected with each other by the fibrils, and has an axial tear strength of not lower than 6,000 gf/mm as calculated in accordance with the following formula: L/[T×(V/100)] where L (gf) is an axial tear load, T (mm) is a wall thickness, and V (%) is a volume ratio of resin. The process for the production of the expanded polytetrafluoroethylene product includes a high-speed extrusion step.

Abstract: Provided is an anisotropic conductive sheet (8) having heat resistance and cold resistance and suitable for connection of electrodes. The anisotropic conductive sheet of the present invention has conductivity in the thickness direction, wherein the base film (1), which is a film made of synthetic resin having an electrical insulation property, has a plurality of holes (3) formed in the thickness direction, and the holes (3) are open to one main surface of the base film and closed to the other main surface, wherein a metal is adhered to the closed parts (2a) and the inner walls (2b) of the holes (3) so that by contacting electrodes (7) with the closed parts (2a) respectively from the outside, the electrodes (7) can electrically be connected through the adhered metal to the main surface where the holes (3) are open.

Abstract: The invention offers an anisotropic electroconductive sheet suitable for connecting with pin electrodes of a through-hole-mounting type. The sheet has electrical conductivity in the direction of thickness. The sheet comprises a base film formed using a porous film (1) that is made of synthetic resin and that has electrically insulating property. The porous film (1) is provided with a plurality of holes (3) that are formed in the direction of thickness so that pin electrodes (2) can be through-hole-mounted. The inner walls of the holes (3) are coated with metals (4). The inserted pin electrodes (2) become electrically continuous, through the metals (4), with the surface opposite to the surface from which the pin electrodes (2) are inserted.

Abstract: A porous resin substrate and a manufacturing method thereof. The substrate comprises a porous resin film having at least one functional part including electrodes or circuits, or both of them, and the porous resin film has a height-altered part, the height of which is different from the height of the functional part.