Patents by Inventor Yasuhiro SASSA

Yasuhiro SASSA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic substrate with first and second wirings supplied with same potential
    Patent number: 11769720
    Abstract: An electronic substrate connects to a semiconductor component via a plurality of front surface terminals disposed in an array on a front surface and connects to a main substrate via a plurality of back surface terminals disposed in an array on a back surface. The electronic substrate includes: a first wiring that electrically connects the front surface terminals and the back surface terminals in the electronic substrate and is supplied with power supply from the main substrate via the back surface terminals; and a second wiring that electrically connects the front surface terminals and the back surface terminals in the electronic substrate, is supplied with power supply having the same potential as the first wiring from the main substrate via the back surface terminals, and is not electrically connected to the first wiring in the electronic substrate.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: September 26, 2023
    Assignee: AISIN CORPORATION
    Inventors: Takanobu Naruse, Yasuhiro Sassa
  • ELECTRONIC SUBSTRATE
    Publication number: 20220084929
    Abstract: An electronic substrate connects to a semiconductor component via a plurality of front surface terminals disposed in an array on a front surface and connects to a main substrate via a plurality of back surface terminals disposed in an array on a back surface. The electronic substrate includes: a first wiring that electrically connects the front surface terminals and the back surface terminals in the electronic substrate and is supplied with power supply from the main substrate via the back surface terminals; and a second wiring that electrically connects the front surface terminals and the back surface terminals in the electronic substrate, is supplied with power supply having the same potential as the first wiring from the main substrate via the back surface terminals, and is not electrically connected to the first wiring in the electronic substrate.
    Type: Application
    Filed: October 31, 2019
    Publication date: March 17, 2022
    Applicant: AISIN CORPORATION
    Inventors: Takanobu NARUSE, Yasuhiro SASSA