Patents by Inventor Yasuhisa Sekiya

Yasuhisa Sekiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7695353
    Abstract: In a grinding wheel in which abrasive tips for rough grinding and abrasive tips for finish grinding are alternately bonded to a periphery of a disk type base rotating about a rotation axis, each abrasive tip includes the abrasive layer formed by bonding abrasive grains and a lower layer overlaid and integrally for led with the abrasive layer. The abrasive tip is attached to the periphery of the base at the lower layer. A Young's modulus of the lower layer of the abrasive tip for finish grinding relative to a load acting on the grinding surface of the abrasive tip in an inward direction of the grinding wheel is less than that of the abrasive tip for rough grinding. Thereby, the surface of a workpiece can be both rough-ground and finish-ground with superhigh-precision surface roughness with using one grinding wheel.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: April 13, 2010
    Assignees: Toyoda Van Moppes Ltd., JTEKT Corporation
    Inventors: Takayuki Moroto, Kunihiko Unno, Masato Kitajima, Tomoyasu Imai, Yasuhisa Sekiya, Tomohiro Inagaki, Noboru Hiraiwa, Hiroshi Takehara, Toshiaki Sakurai, Shinji Soma
  • Publication number: 20090011198
    Abstract: In a vitrified bonded grinding wheel having superabrasive grains 11 such as CBN, diamond or the like bonded with a vitrified bond 12, pores 16 of the vitrified bonded grinding wheel has impregnated thereinto a resin 17 consisting of any resin selected from, e.g., unsaturated polyester, vinyl ester and allyl ester which are in a liquid state at the normal temperature and which have a thermosetting property, and being capable of radical polymerization. Thus, any separation gas or the like is not generated when the impregnated resin is hardened, whereby the strength of the grinding wheel can be enhanced.
    Type: Application
    Filed: December 27, 2005
    Publication date: January 8, 2009
    Applicants: TOYODA VAN MOPPES LTD., JTEKT Corporation
    Inventors: Yasuhisa Sekiya, Tomohiro Inagaki, Hiroshi Takehara, Toshiaki Sakurai, Hiroshi Imaike, Shinji Soma
  • Publication number: 20080299884
    Abstract: In a grinding wheel in which abrasive tips for rough grinding and abrasive tips for finish grinding are alternately bonded to a periphery of a disk type base rotating about a rotation axis, each abrasive tip includes the abrasive layer for ed by bonding abrasive grains and a lower layer overlaid and integrally for led with the abrasive layer. The abrasive tip is attached to the periphery of the base at the lower layer. A Young's modulus of the lower layer of the abrasive tip for finish grinding relative to a load acting on the grinding surface of the abrasive tip in an inward direction of the grinding wheel is less than that of the abrasive tip for rough grinding.
    Type: Application
    Filed: November 14, 2005
    Publication date: December 4, 2008
    Applicants: TOYODA VAN MOPPES LTD., JTEKT CORPORATION
    Inventors: Takayuki Moroto, Kunihiko Unno, Masato Kitajima, Tomoyasu Imai, Yasuhisa Sekiya, Tomohiro Inagaki, Noboru Hirawa, Hiroshi Takehara, Toshiaki Sakurai, Shinji Soma
  • Patent number: 5364422
    Abstract: A CBN grinding wheel having a circular core and an abrasive layer formed on the peripheral surface of the core. The abrasive layer comprises high toughness CBN grains and medium toughness CBN grains, wherein the high toughness CBN grains are incorporated into the abrasive layer in a ratio of 10-80% by weight with respect to the total amount of the CBN grains.
    Type: Grant
    Filed: February 9, 1993
    Date of Patent: November 15, 1994
    Assignees: Toyoda Koki Kabushiki Kaisha, Toyoda Van Moppes Kabushiki Kaisha
    Inventors: Masato Kitajima, Shinji Soma, Akimitsu Kamiya, Akira Suzuki, Yasuhisa Sekiya, Tomohiro Inagaki
  • Patent number: 4671021
    Abstract: A grinding tool has diamond superabrasive grains as the abrasive and a bond to retain the abrasive grains. The bond is made of organic polymer or metal and contains as a filler both a solid film-forming lubricant and finely divided diamond superabrasive grains having a grain size smaller than one-third that of the diamond superabrasive grains as the abrasive. The grinding tool of this invention is suitable for grinding a hard cutting material such as cutting tools made of titanium nitride cermet and exhibits outstanding cutting performance and durability.
    Type: Grant
    Filed: October 21, 1985
    Date of Patent: June 9, 1987
    Assignee: Toyoda Van Moppes Limited
    Inventors: Kunio Takahashi, Yasuhisa Sekiya