Patents by Inventor Yasuji Takenaka
Yasuji Takenaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9276179Abstract: There is provided a light emitting device highly resistant to the environment, and having good heat resistance, light resistance and gas barrier property, and a method for producing same. With the light emitting device, a substrate 2 and interconnect patterns 5A, 5B formed on the surface thereof are covered with an acrylic resin primer 10 having better gas barrier property than a silicone resin sealing resin part 3. Light resistance is ensured by the silicone resin sealing resin portion 3 and the gas barrier property can be ensured by the acrylic resin primer 10.Type: GrantFiled: August 5, 2013Date of Patent: March 1, 2016Assignee: Sharp Kabushiki KaishaInventors: Yasuji Takenaka, Masashi Takemoto, Nobuaki Aoki
-
Publication number: 20150034983Abstract: There is provided a light emitting device highly resistant to the environment, and having good heat resistance, light resistance and gas barrier property, and a method for producing same. With the light emitting device, a substrate 2 and interconnect patterns 5A, 5B formed on the surface thereof are covered with an acrylic resin primer 10 having better gas barrier property than a silicone resin sealing resin part 3. Light resistance is ensured by the silicone resin sealing resin portion 3 and the gas barrier property can be ensured by the acrylic resin primer 10.Type: ApplicationFiled: August 5, 2013Publication date: February 5, 2015Applicant: Sharp Kabushiki KaishaInventors: Yasuji TAKENAKA, Masashi TAKEMOTO, Nobuaki AOKI
-
Patent number: 8288936Abstract: A light emitting apparatus is provided, and the light emitting apparatus has a light emitting device mounted on a substrate or a resin package where a substrate surface or the resin package is resin-encapsulated by an encapsulating resin section added with a phosphor in such a manner to cover the light emitting device. A surface resin layer of a different color from that of the encapsulating resin section is provided on a surface side of the encapsulating resin section.Type: GrantFiled: June 5, 2008Date of Patent: October 16, 2012Assignee: Sharp Kabushiki KaishaInventors: Masayuki Ohta, Masahiro Konishi, Yasuji Takenaka
-
Publication number: 20110108875Abstract: There is provided a light emitting device highly resistant to the environment, and having good heat resistance, light resistance and gas barrier property, and a method for producing same. With the light emitting device, a substrate 2 and interconnect patterns 5A, 5B formed on the surface thereof are covered with an acrylic resin primer 10 having better gas barrier property than a silicone resin sealing resin part 3. Light resistance is ensured by the silicone resin sealing resin portion 3 and the gas barrier property can be ensured by the acrylic resin primer 10.Type: ApplicationFiled: June 5, 2009Publication date: May 12, 2011Applicant: SHARP KABUSHIKI KAISHAInventors: Yasuji Takenaka, Masashi Takemoto, Nobuaki Aoki
-
Patent number: 7938550Abstract: A light emitting device includes: a first and second LED chips for emitting light with a first and second wavelengths which are different from each other; and a translucent sealing resin for sealing the first and second LED chips; wherein the sealing resin contains a fluorescent material which is excited by light with the first wavelength but is not excited by light with the second wavelength, so that the light with the second wavelength and white light resulted from color mixture of the light with the first and second wavelengths and light emitted from the fluorescent material can be selectively emitted. The above light emitting device is adapted for a camera-equipped cellular phone.Type: GrantFiled: June 9, 2008Date of Patent: May 10, 2011Assignee: Sharp Kabushiki KaishaInventor: Yasuji Takenaka
-
Publication number: 20080304262Abstract: A light emitting device includes: a first and second LED chips for emitting light with a first and second wavelengths which are different from each other; and a translucent sealing resin for sealing the first and second LED chips; wherein the sealing resin contains a fluorescent material which is excited by light with the first wavelength but is not excited by light with the second wavelength, so that the light with the second wavelength and white light resulted from color mixture of the light with the first and second wavelengths and light emitted from the fluorescent material can be selectively emitted. The above light emitting device is adapted for a camera-equipped cellular phone.Type: ApplicationFiled: June 9, 2008Publication date: December 11, 2008Applicant: SHARP KABUSHIKI KAISHAInventor: Yasuji TAKENAKA
-
Publication number: 20080303411Abstract: A light emitting apparatus is provided, and the light emitting apparatus has a light emitting device mounted on a substrate or a resin package where a substrate surface or the resin package is resin-encapsulated by an encapsulating resin section added with a phosphor in such a manner to cover the light emitting device. A surface resin layer of a different color from that of the encapsulating resin section is provided on a surface side of the encapsulating resin section.Type: ApplicationFiled: June 5, 2008Publication date: December 11, 2008Applicant: SHARP KABUSHIKI KAISHAInventors: Masayuki OHTA, Masahiro Konishi, Yasuji Takenaka
-
Patent number: 7455423Abstract: A semiconductor light emitting device of the present invention includes four elements provided on a substrate and having different light emitting colors of red, green, blue, and white, respectively; a resin covering each of the elements; and a reflector provided to surround a circumference of the resin. With this structure, a semiconductor light emitting device having high brightness and excellent color rendering properties can be provided.Type: GrantFiled: April 27, 2006Date of Patent: November 25, 2008Assignee: Sharp Kabushiki KaishaInventor: Yasuji Takenaka
-
Publication number: 20060245188Abstract: A semiconductor light emitting device of the present invention includes four elements provided on a substrate and having different light emitting colors of red, green, blue, and white, respectively; a resin covering each of the elements; and a reflector provided to surround a circumference of the resin. With this structure, a semiconductor light emitting device having high brightness and excellent color rendering properties can be provided.Type: ApplicationFiled: April 27, 2006Publication date: November 2, 2006Applicant: SHARP KABUSHIKI KAISHAInventor: Yasuji Takenaka
-
Patent number: 7012277Abstract: A semiconductor light emitting device includes an LED chip, a first lead frame on which the LED chip is mounted, a second lead frame electrically connected to the LED chip via a bonding wire, and a resin portion surrounding the circumference of the LED chip, and fastening the first and second lead frames. A metal body is located under the region of the first lead frame where the LED chip is mounted.Type: GrantFiled: December 23, 2003Date of Patent: March 14, 2006Assignee: Sharp Kabushiki KaishaInventor: Yasuji Takenaka
-
Patent number: 6803606Abstract: A semiconductor light device includes a light emitting element, a reflector for reflecting a light beam outgoing from the light emitting element and a resin disposed between the light emitting element and the reflector, which are formed on a substrate. A face of the reflector is formed into a rough surface to improve adherence between the reflector and the resin for preventing detachment of the reflector from the resin.Type: GrantFiled: March 18, 2003Date of Patent: October 12, 2004Assignee: Sharp Kabushiki KaishaInventor: Yasuji Takenaka
-
Publication number: 20040159850Abstract: A semiconductor light-emitting device includes a lead frame having a main surface, a LED chip, an epoxy resin provided to completely cover the LED chip, and a resin portion provided to surround the LED chip. The epoxy resin includes a top surface. The resin portion includes a top surface at a position where a distance from the main surface is greater than a distance from the main surface to the top surface, and an inner wall provided on the side where the LED chip is located and extending in a direction away from the main surface to reach the top surface. Thus, the semiconductor light-emitting device excellent in heat radiation and permitting appropriate control of directivity of the light, a manufacturing method thereof, and an electronic image pickup device are provided.Type: ApplicationFiled: February 18, 2004Publication date: August 19, 2004Applicant: SHARP KABUSHIKI KAISHAInventor: Yasuji Takenaka
-
Publication number: 20040135156Abstract: A semiconductor light emitting device includes an LED chip, a first lead frame on which the LED chip is mounted, a second lead frame electrically connected to the LED chip via a bonding wire, and a resin portion surrounding the circumference of the LED chip, and fastening the first and second lead frames. A metal body is located under the region of the first lead frame where the LED chip is mounted.Type: ApplicationFiled: December 23, 2003Publication date: July 15, 2004Applicant: SHARP KABUSHIKI KAISHAInventor: Yasuji Takenaka
-
Publication number: 20030183852Abstract: A semiconductor light device includes a light emitting element, a reflector for reflecting a light beam outgoing from the light emitting element and a resin disposed between the light emitting element and the reflector, which are formed on a substrate. A face of the reflector is formed into a rough surface to improve adherence between the reflector and the resin for preventing detachment of the reflector from the resin.Type: ApplicationFiled: March 18, 2003Publication date: October 2, 2003Applicant: SHARP KABUSHIKI KAISHAInventor: Yasuji Takenaka