Patents by Inventor Yasukazu Anbai

Yasukazu Anbai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMOSETTING RESIN COMPOSITION AND UNCURED FILM COMPRISING THE SAME
    Publication number: 20090239992
    Abstract: To provide a thermosetting resin composition having excellent film-forming properties, which can form a cured product having low elastic modulus and having low dielectric constant and low dielectric loss tangent in a high frequency range; and a thermosetting resin composition comprising (A) a vinyl compound represented by the general formula (1), and (B) a rubber and/or a thermoplastic elastomer.
    Type: Application
    Filed: August 8, 2007
    Publication date: September 24, 2009
    Inventors: Toshiaki Yamada, Hidenori Iida, Yasukazu Anbai, Shin Teraki, Masaki Yoshida, Satoko Takahashi