Patents by Inventor Yasuki Mikamura

Yasuki Mikamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6599032
    Abstract: An optical parallel transmission receiver in which a plurality of light-receiving elements and a plurality of optical fibers are optically coupled via guide pins (1) includes a pair of guide pins (1), a fiber holding means (2) for holding the pair of guide pins in parallel and holding the plurality of optical fibers between the pair of guide pins (1) at a predetermined interval, and a light-receiving element holding means for holding the plurality of light-receiving elements between the pair of guide pins (1) and holding one end of each of the pair of guide pins (1) so as to make a plane including light-receiving surfaces of the light-receiving elements perpendicular to longitudinal axes of the guide pins (1). The fiber holding means (2) and light-receiving element holding means (3) are integrally held by resin molding.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: July 29, 2003
    Assignees: Sumitomo Electric Industries, Ltd., Nippon Telegraph and Telephone Corporation
    Inventors: Hiromi Kurashima, Yasuki Mikamura, Nobuyuki Tanaka, Takashi Sakamoto
  • Patent number: 6315465
    Abstract: An electronic circuit is formed on a wiring substrate capable of cross wiring, and an electrode of the wiring substrate and a connecting portion of a lead frame are electrically connected to each other without wire bonding. As a consequence, while the substrate size is enhanced, the wiring pitch is reduced, whereby the electronic circuit can have a larger area and a larger scale. Further, the difference between the thickness of the encapsulating resin on the upper surface of the lead frame from the upper surface of the wiring substrate and the thickness of the encapsulating resin on the lower surface of the lead frame is made smaller than the thickness of the wiring substrate, whereby the occurring stress is reduced, and the encapsulating resin is kept from being distorted or cracking. Here realized is an optical module having a configuration in which, while the electronic circuit has a larger scale, the stability and durability are maintained.
    Type: Grant
    Filed: December 20, 1999
    Date of Patent: November 13, 2001
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Toshio Mizue, Yasuki Mikamura, Ichiro Tonai
  • Patent number: 5363064
    Abstract: A phase-inverting amplifier includes an input-stage FET, a load thereof and a gain control circuit. The gain control circuit is provided in parallel with the load, and reduces an effective load resistance to lower an open-loop gain of the phase-inverting amplifier when a current flowing through the load exceeds a predetermined value. The gain control circuit is typically a FET whose gate is biased at a constant voltage. A feedback resistor is provided in a negative feedback path of the phase-inverting amplifier. A bypass circuit is provided in parallel with the feedback resistor, and reduces an effective feedback resistance when a feedback quantity exceeds a predetermined value.
    Type: Grant
    Filed: April 22, 1993
    Date of Patent: November 8, 1994
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventor: Yasuki Mikamura