Patents by Inventor Yasumasa Wakasugi

Yasumasa Wakasugi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ORDERING PROGRAM, ORDERING DEVICE, AND ORDERING METHOD
    Publication number: 20170032448
    Abstract: A non-transitory computer-readable recording medium stores an ordering program that causes a computer to execute a process. The process includes determining whether an article is a chemical material by using slip issue data that is input when ordering the article; checking whether the slip issue data includes permission identification information indicating that the article has been allowed to be ordered, when the article is determined to be the chemical material; and making an approval request to approve of ordering the article according to a result of the checking of the slip issue data.
    Type: Application
    Filed: October 14, 2016
    Publication date: February 2, 2017
    Applicant: FUJITSU LIMITED
    Inventors: Masayuki Kitajima, Tetsuji Ishikawa, Yasumasa Wakasugi, KATSUYOSHI KUGO
  • Low dielectric constant ceramic substrate
    Patent number: 4891344
    Abstract: A low dielectric constant ceramic substrate comprised of 90 to 98% of mullite (3Al.sub.2 O.sub.3. 2SiO.sub.2) and 10 to 2% of a sintering promotor comprised of 0.5 to 3% of magnesia (MgO) and 1.5 to 7% of calcium oxide (CaO).
    Type: Grant
    Filed: December 19, 1986
    Date of Patent: January 2, 1990
    Assignee: Fujitsu Limited
    Inventors: Yasumasa Wakasugi, Masahiro Sugimoto
  • Heatsink package for flip-chip IC
    Patent number: 4803546
    Abstract: A semiconductor device which includes a substrate, a semiconductor element mounted on the substrate, a cap having an opening smaller than the external size of the semiconductor element for covering the semiconductor element to provide a hermetic seal, and a heatsink member mounted on the cap covering the opening and making contact with the semiconductor element via the opening. Heat generated by the semiconductor element is conducted directly to the heatsink member. A method of producing the semiconductor device includes mounting the semiconductor element onto the substrate, covering the semiconductor element with a cap which is fixed to the substrate, and mounting the heatsink member on the cap for covering the opening and making contact with the semicondutor element via the opening.
    Type: Grant
    Filed: February 9, 1988
    Date of Patent: February 7, 1989
    Assignee: Fujitsu Limited
    Inventors: Masahiro Sugimoto, Yasumasa Wakasugi
  • Semiconductor device and method of producing semiconductor device
    Patent number: 4742024
    Abstract: A semiconductor device comprises a substrate, a semiconductor element mounted on the substrate, a cap having an opening smaller than the external size of the semiconductor element for covering the semiconductor element to provide a hermetic seal, and a heatsink member mounted on the cap to cover the opening and to make contact with the semiconductor element via the opening, so that heat generated by the semiconductor element is conducted directly to the heatsink member. A method of producing the semiconductor device comprises the steps of mounting the semiconductor element on the substrate, covering the semiconductor element by the cap which is fixed to the substrate, and mounting the heatsink member on the cap to cover the opening and to make contact with the semiconductor element via the opening.
    Type: Grant
    Filed: July 23, 1987
    Date of Patent: May 3, 1988
    Assignee: Fujitsu Limited
    Inventors: Masahiro Sugimoto, Yasumasa Wakasugi, Shigeki Harada
  • Heatsink package for flip-chip IC
    Patent number: 4698663
    Abstract: A semiconductor device comprises a substrate, a semiconductor element mounted on the substrate, a cap having an opening smaller than the external size of the semiconductor element for covering the semiconductor element to provide a hermetic seal, and a heatsink member mounted on the cap to cover the opening and to make contact with the semiconductor element via the opening, so that heat generated by the semiconductor element is conducted directly to the heatsink member. A method of producing the semiconductor device comprises the steps of mounting the semiconductor element on the substrate, covering the semiconductor element by the cap which is fixed to the substrate, and mounting the heatsink member on the cap to cover the opening and to make contact with the semiconductor element via the opening.
    Type: Grant
    Filed: December 3, 1986
    Date of Patent: October 6, 1987
    Assignee: Fujitsu Limited
    Inventors: Masahiro Sugimoto, Yasumasa Wakasugi, Shigeki Harada