Patents by Inventor Yasumi Ohsera

Yasumi Ohsera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4624884
    Abstract: A thermosetting synthetic resin composition consisting mainly of, for example, an epoxy resin is melted at a temperature of 70.degree. to 130.degree. C. After adding a filler to the resin composition, the resultant mixture is kneaded and rapidly cooled. The composition consists of a thixotropy agent, a leveling agent, etc., in addition to the epoxy resin and a curing agent for the epoxy resin. Aluminum as the filler is added in the amount of 30 wt % to 100 wt % of the mixture. The mixture of the composition with the filler is kneaded and rapidly cooled and is then pulverized to prepare a powder. The powder coating thus obtained is coated on a coil and is cured to provide a heat radiating insulator.
    Type: Grant
    Filed: September 11, 1985
    Date of Patent: November 25, 1986
    Assignee: Nippondenso Co., Ltd.
    Inventors: Hitoshi Harada, Yasumi Ohsera