Abstract: A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a pair of electrodes; and a first power feeder provided for one of the electrodes and a second power feeder provided for the other of the electrodes, in which provided that the number of the conductive linear bodies is N, a resistance value of each conductive linear body is r, a resistance value of each electrode is R, a resistance value of each electrode between the n-th conductive linear body and the (n?1)th conductive linear body counted from a side at which the first power feeder and the second power feeder are provided is Rn, the wiring sheet satisfies all conditions represented by numerical formulae (F1) to (F3) below, r/R?300??(F1) Rn?Rn?1??(F2) where n is an integer of 2 or more, 0<R2?RN??(F3).

Abstract: First, a sample holder 13, 57 is lowered such that a sample is held. Next, a roller 11 or a plate-shaped member 56 is lowered and pressed to an adhesive surface 15A of a sample 15. At this time, a tape 23 is disposed between the roller 11 or the plate-shaped member 56 and the adhesive surface 15A of the sample 15, and a fixed pressure load is applied to the sample 15. Then after a fixed period of time has passed, the tape 23 is pulled from the sample 15 by the raising of the roller 11 or the plate-shaped member 56 and an adhesive strength is measured with a load cell 25 according to the tension of the tape 23 at that time. After measuring, a take-up reel 21, 52 is rotated so as to wind up a predetermined pitch of the tape 23, and an unused portion of the tape 23 is reeled out to the tip of the roller 11 or the plate-shaped member 56.

Abstract: A stirring device achieving high stirring efficiency and easy to wash and maintain, is provided. The stirring device includes a vertical cylindrical stirring vessel, a rotary shaft vertically extended within the stirring vessel for rotation, and a stirring vessel constituted of two or more basically rectangular vane plates vertically supported on the rotary shaft in symmetrical relation with each other with respect to the rotary shaft. On an upper portion of the stirring vane, a recess is formed for forming a cone about the rotary shaft when the stirring vane rotates. A lower end of the stirring vane is arranged in the vicinity of a bottom surface of the stirring vessel.

Abstract: A stirring device achieving high stirring efficiency and easy to wash and maintain, is provided. The stirring device includes a vertical cylindrical stirring vessel, a rotary shaft vertically extended within the stirring vessel for rotation, and a stirring vessel constituted of two or more basically rectangular vane plates vertically supported on the rotary shaft in symmetrical relation with each other with respect to the rotary shaft. On an upper portion of the stirring vane, a recess is formed for forming a cone about the rotary shaft when the stirring vane rotates. A lower end of the stirring vane is arranged in the vicinity of a bottom surface of the stirring vessel.

Abstract: A stirring device achieving high stirring efficiency and easy to wash and maintain, is provided. The stirring device includes a vertical cylindrical stirring vessel, a rotary shaft vertically extended within the stirring vessel for rotation, and a stirring vessel constituted of two or more basically rectangular vane plates vertically supported on the rotary shaft in symmetrical relation with each other with respect to the rotary shaft. On an upper portion of the stirring vane, a recess is formed for forming a cone about the rotary shaft when the stirring vane rotates. A lower end of the stirring vane is arranged in the vicinity of a bottom surface of the stirring vessel.

Abstract: An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable latent curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.

Abstract: An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.

Abstract: An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.