Abstract: A manufacturing method of a semiconductor device according to the present invention includes the steps of (a) preparing an insulating or conductive substrate; (b) arranging a bonding material having sinterability in at least one bonding region of a principal surface of the substrate (i.e., insulating substrate); and (c) sintering the bonding material while a bonding surface to be subjected to bonding of at least one semiconductor element is brought into pressurized contact with the bonding material, and bonding the substrate (i.e., insulating substrate) and the semiconductor element together through the bonding material. The bonding region in the step (b) is inwardly positioned from the bonding surface (i.e., region) of the semiconductor element in plan view, and the bonding material is not protruded outwardly from the bonding surface of the semiconductor element in plan view even after the step (c).

Abstract: A bonding structure including metal nano particles includes a first member having a metal surface on at least one side, a second member having a metal surface on at least one side, the second member being disposed such that the metal surface of the second member faces the metal surface of the first member, and a bonding material bonding the first member and the second member by sinter-bonding the metal nano particles. At least one of the metal surfaces of the first member and the second member is formed to be a rough surface having a surface roughness within the range from 0.5 ?m to 2.0 ?m.

Abstract: A P-side package unit and a N-side package unit are arranged on a main surface of a metal heatsink such that a main surface extends in a direction perpendicular to the main surface of the heatsink. Each of the P-side package unit and the N-side package unit is fixed by an end edge portion of a heatsink being clipped by a rail-shaped unit mounting part provided on the main surface of the heatsink.

Abstract: The present invention provides an automotive electric motor-generator that can achieve sufficient cooling of a radiating plate by ensuring a sufficient cooling airflow ventilation channel within limited axial or radial dimensions. In the present invention, first and second radiating plates each form a fan shape, have N-channel power MOSFETs mounted thereto, and have a drain potential for the power MOSFETs. A first circuit board includes insert conductors that connect the power MOSFETs in series, and a second circuit board has insert conductors that are connected to source terminals of the power MOSFETs and that have negative potential. The first radiating plate, the second radiating plate, the first circuit board, and the second circuit board are disposed in a fan shape that is centered around a shaft so as to line up radially in a plane that is perpendicular to the shaft outside one axial end of a rear housing.

Abstract: The present invention provides an automotive electric motor-generator that can achieve sufficient cooling of a radiating plate by ensuring a sufficient cooling airflow ventilation channel within limited axial or radial dimensions. In the present invention, first and second radiating plates each form a fan shape, have N-channel power MOSFETs mounted thereto, and have a drain potential for the power MOSFETs. A first circuit board includes insert conductors that connect the power MOSFETs in series, and a second circuit board has insert conductors that are connected to source terminals of the power MOSFETs and that have negative potential. The first radiating plate, the second radiating plate, the first circuit board, and the second circuit board are disposed in a fan shape that is centered around a shaft so as to line up radially in a plane that is perpendicular to the shaft outside one axial end of a rear housing.

Abstract: A P-side package unit and a N-side package unit are arranged on a main surface of a metal heatsink such that a main surface extends in a direction perpendicular to the main surface of the heatsink. Each of the P-side package unit and the N-side package unit is fixed by an end edge portion of a heatsink being clipped by a rail-shaped unit mounting part provided on the main surface of the heatsink.

Abstract: The present invention provides an automotive electric motor-generator that can achieve sufficient cooling of a radiating plate by ensuring a sufficient cooling airflow ventilation channel within limited axial or radial dimensions. In the present invention, first and second radiating plates each form a fan shape, have N-channel power MOSFETs mounted thereto, and have a drain potential for the power MOSFETs. A first circuit board includes insert conductors that connect the power MOSFETs in series, and a second circuit board has insert conductors that are connected to source terminals of the power MOSFETs and that have negative potential. The first radiating plate, the second radiating plate, the first circuit board, and the second circuit board are disposed in a fan shape that is centered around a shaft so as to line up radially in a plane that is perpendicular to the shaft outside one axial end of a rear housing.

Abstract: The present invention provides an automotive electric motor-generator that can achieve sufficient cooling of a radiating plate by ensuring a sufficient cooling airflow ventilation channel within limited axial or radial dimensions. In the present invention, first and second radiating plates each form a fan shape, have N-channel power MOSFETs mounted thereto, and have a drain potential for the power MOSFETs. A first circuit board includes insert conductors that connect the power MOSFETs in series, and a second circuit board has insert conductors that are connected to source terminals of the power MOSFETs and that have negative potential. The first radiating plate, the second radiating plate, the first circuit board, and the second circuit board are disposed in a fan shape that is centered around a shaft so as to line up radially in a plane that is perpendicular to the shaft outside one axial end of a rear housing.

Abstract: A method for assembling semiconductor switching elements and a heat sink in a rotary electric machine includes: a first step in which bare chips of the semiconductor switching elements are bonded to the heat sink using a good heat conductive bonding material; a second step which connects the bare chips to a wiring part by wire bonding; and a third step in which a resin which seals the bare chips and the wiring part is applied to the heat sink in a striding manner in a state that output terminal portions of the wiring part and fins of the heat sink are exposed to the outside of the resin.

Abstract: An insulating sheet consisting of a metal layer and an unhardened insulating resin layer is formed. The insulating resin layer contains a filler having grains of, e.g., scale-like shape and has thixotropy, and its outer size is larger than that of a bottom surface of a metal plate. The insulating sheet is disposed on a bottom surface of a cavity of a mold die and the metal plate is disposed on an upper surface of the insulating resin layer. On a main surface of the metal plate, a power semiconductor chip connected to a frame and another frame through a wire is mounted. The cavity is fully filled with a liquid mold resin in this state. After that, the insulating resin layer is hardened at the same timing as the hardening of the mold resin, and the insulating resin and the metal plate are fixed to each other. An interface between the insulating resin layer and the metal plate is included in the upper surface of the insulating resin layer.

Abstract: A method for assembling semiconductor switching elements and a heat sink in a rotary electric machine includes: a first step in which bare chips of the semiconductor switching elements are bonded to the heat sink using a good heat conductive bonding material; a second step which connects the bare chips to a wiring part by wire bonding; and a third step in which a resin which seals the bare chips and the wiring part is applied to the heat sink in a striding manner in a state that output terminal portions of the wiring part and fins of the heat sink are exposed to the outside of the resin.

Abstract: An insulating sheet consisting of a metal layer and an unhardened insulating resin layer is formed. The insulating resin layer contains a filler having grains of, e.g., scale-like shape and has thixotropy, and its outer size is larger than that of a bottom surface of a metal plate. The insulating sheet is disposed on a bottom surface of a cavity of a mold die and the metal plate is disposed on an upper surface of the insulating resin layer. On a main surface of the metal plate, a power semiconductor chip connected to a frame and another frame through a wire is mounted. The cavity is fully filled with a liquid mold resin in this state. After that, the insulating resin layer is hardened at the same timing as the hardening of the mold resin, and the insulating resin and the metal plate are fixed to each other. An interface between the insulating resin layer and the metal plate is included in the upper surface of the insulating resin layer.