Abstract: According to an embodiment, a battery includes an exterior container, a lid member, a plurality of electrode groups, a first lead, a second lead, and an electrode terminal. The lid member closes an opening of an inner cavity of the exterior container, and the plurality of electrode groups are stored in the inner cavity. A first current collecting tab protruding toward the lid member in a first electrode is joined with the first lead, and a second current collecting tab protruding toward the lid member in the second electrode different from the first electrode is joined with the second lead separate from the first lead. The first and second leads are together connected to the electrode terminal exposed on an outer surface of the lid member.

Abstract: An electroplating method according to an embodiment is a electroplating method of generating a metal film on a cathode surface by setting a negative potential to a cathode of an anode and the cathode provided in a reaction bath, including mixing and accommodating a plating solution containing at least plated metal ions, an electrolyte, and a surface active agent and a supercritical fluid in the reaction bath and applying a current in a concentration of the supercritical fluid and a cathode current density in which a polarization resistance obtained from a cathode polarization curve while the plated metal ions are reduced is larger than before the supercritical fluid is mixed.

Abstract: An electroplating method according to an embodiment is a electroplating method of generating a metal film on a cathode surface by setting a negative potential to a cathode of an anode and the cathode provided in a reaction bath, including mixing and accommodating a plating solution containing at least plated metal ions, an electrolyte, and a surface active agent and a supercritical fluid in the reaction bath and applying a current in a concentration of the supercritical fluid and a cathode current density in which a polarization resistance obtained from a cathode polarization curve while the plated metal ions are reduced is larger than before the supercritical fluid is mixed.

Abstract: According to one embodiment, a circuit board is provided with a first rectangular electronic component, a board and a reinforcing plate. The first electronic component has a plurality of connection terminals. The board has the first electronic component mounted thereon via the connection terminals, and has a through hole for receiving a second electronic component at a position at which the first electronic component overlaps with the second electronic component. The reinforcing plate is attached to the back surface of the board, and has a plurality of first portions near the corner portions of the first electronic component, and a second portion of a strip shape coupling the first portions and located near the hole. The first and second portions are formed integral as one body.

Abstract: According to one embodiment, a light emitting device includes a base, a light emitting element, a resin layer, a fluorescent material layer, and a lens layer. The base has an under surface, a top surface, and a side surface. The light emitting element is provided on the top surface of the base. The resin layer contacts a side surface of the light emitting element and the top surface of the base. A thickness of the resin layer is thinner from the side surface of the light emitting element toward the side surface of the base. The resin layer has light reflection particle dispersed. The fluorescent material layer is provided on the light emitting element and the resin layer. The lens layer is provided on the base and covers the fluorescent material layer.

Abstract: According to one embodiment, a thermoelectric device is provided with thermoelectric elements and formed of a material capable of exhibiting the thermoelectric effect and a first electrode located at end portions of the thermoelectric elements. The first electrode includes an electrode member, a soaking member having electrical conductivity, located between the electrode member and the thermoelectric elements, and including facing portions facing the thermoelectric elements and folded portions folded back at peripheral edges of the facing portions so as to lie on the opposite side to the thermoelectric elements, and an elastic member located on the opposite side of the facing portions to the thermoelectric elements, at least a part of the peripheral edge of the elastic member being held between the folded portions and the facing portions of the soaking member.

Abstract: According to one embodiment, a circuit board is provided with a first rectangular electronic component, a board and a reinforcing plate. The first electronic component has a plurality of connection terminals. The board has the first electronic component mounted thereon via the connection terminals, and has a through hole for receiving a second electronic component at a position at which the first electronic component overlaps with the second electronic component. The reinforcing plate is attached to the back surface of the board, and has a plurality of first portions near the corner portions of the first electronic component, and a second portion of a strip shape coupling the first portions and located near the hole. The first and second portions are formed integral as one body.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a board in the housing, a pad on the board, and a component. The pad includes a first portion and a second portion. The second portion includes a protrusion toward the first portion. The component includes a first electrode connected to the first portion and a second electrode connected to the second portion.

Abstract: In one embodiment, there is provided a wiring substrate. The wiring substrate includes: a substrate body comprising a first surface and a second surface opposite to the first surface, wherein the substrate body has a plurality of first through holes; a plurality of first pads on the first surface of the substrate body; a plurality of second pads on the first surface of the substrate body, wherein the second pads are surrounded by the first pads. Each of the second pads has at least one second through hole, and the second pads are disposed on the first surface of the substrate body such that each of the second through holes is communicated with a corresponding one of the first through holes.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a board in the housing, a pad on the board, and a component. The pad includes a first portion and a second portion. The second portion includes a protrusion toward the first portion. The component includes a first electrode connected to the first portion and a second electrode connected to the second portion.

Abstract: According to one embodiment, an electronic device includes a housing, a circuit board, and a component. The circuit board is provided in the housing, and includes a first pad and a second pad exposed on the surface. The component includes a first electrode and a second electrode. The first electrode is exposed on the circuit board-facing surface of the component fading the surface of the circuit board and bonded to the first pad via a bonding agent. The second electrode is exposed on the circuit board-facing surface and bonded to the second pad via a bonding agent. The second electrode is wider than the first electrode and projects more than the first electrode does.

Abstract: An optical semiconductor device includes: an optical semiconductor element including a light-emitting layer formed on a first principal surface, a first electrode formed on the light-emitting layer and having a smaller size than the first principal surface, and a second electrode formed on a second principal surface different from the first principal surface; a first lead portion including a bonding region to which the first electrode is bonded and which has a smaller size than the first principal surface, and a first groove portion formed on an outer peripheral region adjacent to the bonding region, the first lead portion being electrically connected to the first electrode bonded to the bonding region by use of a bonding member; and a second lead portion electrically connected to the second electrode by use of a connecting member.

Abstract: According to one embodiment, a thermoelectric device is provided with thermoelectric elements and formed of a material capable of exhibiting the thermoelectric effect and a first electrode located at end portions of the thermoelectric elements. The first electrode includes an electrode member, a soaking member having electrical conductivity, located between the electrode member and the thermoelectric elements, and including facing portions facing the thermoelectric elements and folded portions folded back at peripheral edges of the facing portions so as to lie on the opposite side to the thermoelectric elements, and an elastic member located on the opposite side of the facing portions to the thermoelectric elements, at least a part of the peripheral edge of the elastic member being held between the folded portions and the facing portions of the soaking member.

Abstract: An optical semiconductor device includes: an optical semiconductor element including a light-emitting layer formed on a first principal surface, a first electrode formed on the light-emitting layer and having a smaller size than the first principal surface, and a second electrode formed on a second principal surface different from the first principal surface; a first lead portion including a bonding region to which the first electrode is bonded and which has a smaller size than the first principal surface, and a first groove portion formed on an outer peripheral region adjacent to the bonding region, the first lead portion being electrically connected to the first electrode bonded to the bonding region by use of a bonding member; and a second lead portion electrically connected to the second electrode by use of a connecting member.

Abstract: A semiconductor device (3) is provided with a first electrode (A), a lead (4) has a second electrode (B), and a metallic film (6) electrically interconnects the first electrode (A) and the second electrode (B), allowing for a more reduced internal resistance, high reliability, and facilitated fabrication.

Abstract: The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g.

Abstract: The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g.

Abstract: A semiconductor device-manufacturing method includes a laminated wafer formation step and a dicing step. In the laminated wafer formation step, a metal plate is first laid on one side of a wafer with a solder material interposed, and then the metal plate and the wafer are subjected to decompression pressing to form a one-piece structure. As a result, a laminated wafer is obtained. In the dicing step, the laminated wafer is diced into laminated chips.

Abstract: A semiconductor device-manufacturing method includes a laminated wafer formation step and a dicing step. In the laminated wafer formation step, a metal plate is first laid on one side of a wafer with a solder material interposed, and then the metal plate and the wafer are subjected to decompression pressing to form a one-piece structure. As a result, a laminated wafer is obtained. In the dicing step, the laminated wafer is diced into laminated chips.