Abstract: A semiconductor device includes: a semiconductor layer having a main surface; a first conductive type well region formed on a surface portion of the main surface of the semiconductor layer; a second conductive type source region formed on a surface portion of the well region; a second conductive type drain region formed on the surface portion of the well region at an interval from the source region; a planar gate structure formed on the main surface of the semiconductor layer so as to face a first conductive type channel region disposed between the source region and the drain region; and a memory structure disposed adjacent to a lateral side of the planar gate structure, and including an insulating film formed on the channel region and a charge storage film facing the channel region with the insulating film interposed between the charge storage film and the channel region.

Abstract: An acoustic wave device includes a support substrate, a piezoelectric layer on the support substrate, and a functional element on the piezoelectric layer. The support substrate and the piezoelectric layer each have a rectangular or substantially rectangular shape in plan view from a direction normal to the support substrate. At least one corner portion of the piezoelectric layer has a curved shape or a polygonal shape.

Abstract: A semiconductor device includes: a semiconductor layer having a main surface; a first-conduction-type well region formed on a surface portion of the main surface of the semiconductor layer; a second-conduction-type first region formed on a surface portion of the well region; a second-conduction-type second region formed on the surface portion of the well region at an interval from the first region; a first-conduction-type diffusion layer formed on the surface portion of the main surface adjacent to the first region; a planar gate structure formed on the main surface of the semiconductor layer to face a first-conduction-type channel region between the first region and the second region; and a memory structure including a charge storage film arranged adjacent to a lateral side of the planar gate structure on a side of the first region.

Abstract: An acoustic wave device includes a piezoelectric layer and an interdigital transducer disposed on the piezoelectric layer. The interdigital transducer primarily includes Al and includes an additive selected from a group consisting of Nd, Sc, and Ta, and a concentration of the additive in a region opposite to a piezoelectric-layer-side region of the interdigital transducer is higher than a concentration of the additive in the piezoelectric-layer-side region of the interdigital transducer.

Abstract: A semiconductor device includes a semiconductor layer, a source region and a drain region that are formed in the semiconductor layer and at an interval in a first direction, a gate insulating film that is formed such as to cover a channel region between the source region and the drain region, and a gate electrode that is formed on the gate insulating film and opposes the channel region across the gate insulating film. The gate insulating film has a major portion on which the gate electrode is formed and extension portions projecting outward from each of both sides of the major portion in a second direction orthogonal to the first direction and leak current suppressing electrodes are formed on the extension portions.

Abstract: An acoustic wave device includes a piezoelectric substrate and an electrode on the piezoelectric substrate and including first and second layers. The first layer includes Al and Cu. The second layer is on a side opposite to a piezoelectric substrate side of the first layer and includes Al. The first layer includes an Al crystal and at least a portion of CuAl2 crystal grains that are provided in a direction orthogonal or substantially orthogonal to a thickness direction of the piezoelectric substrate. In the electrode, the CuAl2 crystal grains do not extend to the main surface of the second layer on a side opposite to a first layer side.

Abstract: An elastic wave device includes a spacer layer on or above a support substrate and outside a piezoelectric film as seen in a plan view from a thickness direction of the support substrate. A cover layer is disposed on the spacer layer. A through electrode extends through the spacer layer and the cover layer and is electrically connected to the wiring electrode. The wiring electrode includes a first section overlapping the through electrode as seen in the plan view from the thickness direction, a second section overlapping the piezoelectric film as seen in the plan view from the thickness direction, and a step portion defining a step in the thickness direction between the first section and the second section. The spacer layer includes an end portion embedded in the cover layer.

Abstract: A memory cell formed on the surface of a p-well of a semiconductor substrate includes a drain region and a source region that are formed with a channel region therebetween; an insulating film that is formed to cover the channel region; a gate that is formed on the insulating film; sidewall spacers that are formed to be positioned at side surfaces of the gate and directly above the channel region; a salicide block film that is formed to cover a portion of the drain region, a portion of the source regio, the gat, and the sidewall spacers; a drain salicide layer and a source salicide layer that are formed at the salicide block film and on the drain region and the source region exposed from the salicide block film; and a nitride film that is formed to cover the salicide block film, the drain salicide layer, and the source salicide layer.

Abstract: A semiconductor device includes: a semiconductor layer having a main surface; a first conductive type well region formed on a surface portion of the main surface of the semiconductor layer; a second conductive type source region formed on a surface portion of the well region; a second conductive type drain region formed on the surface portion of the well region at an interval from the source region; a planar gate structure formed on the main surface of the semiconductor layer so as to face a first conductive type channel region disposed between the source region and the drain region; and a memory structure disposed adjacent to a lateral side of the planar gate structure, and including an insulating film formed on the channel region and a charge storage film facing the channel region with the insulating film interposed between the charge storage film and the channel region.

Abstract: An electronic component that includes a substrate having a first main surface and a second main surface, an element on the first main surface of the substrate, a first contact electrode electrically connected to the element, an insulating film defining a first opening at a position that has an overlap with the first contact electrode in the plan view of the first main surface, a protective film covering the insulating film in a region including at least a part of the periphery of the first opening, and a first external electrode electrically connected to the first contact electrode and extending over the protective film.

Abstract: An acoustic wave device includes a piezoelectric layer and an interdigital transducer disposed on the piezoelectric layer. The interdigital transducer primarily includes Al and includes an additive selected from a group consisting of Nd, Sc, and Ta, and a concentration of the additive in a region opposite to a piezoelectric-layer-side region of the interdigital transducer is higher than a concentration of the additive in the piezoelectric-layer-side region of the interdigital transducer.

Abstract: An elastic wave device includes a spacer layer on or above a support substrate and outside a piezoelectric film as seen in a plan view from a thickness direction of the support substrate. A cover layer is disposed on the spacer layer. A through electrode extends through the spacer layer and the cover layer and is electrically connected to the wiring electrode. The wiring electrode includes a first section overlapping the through electrode as seen in the plan view from the thickness direction, a second section overlapping the piezoelectric film as seen in the plan view from the thickness direction, and a step portion defining a step in the thickness direction between the first section and the second section. The spacer layer includes an end portion embedded in the cover layer.

Abstract: An electronic component that includes a substrate having a first main surface and a second main surface, an element on the first main surface of the substrate, a first contact electrode electrically connected to the element, an insulating film defining a first opening at a position that has an overlap with the first contact electrode in the plan view of the first main surface, a protective film covering the insulating film in a region including at least a part of the periphery of the first opening, and a first external electrode electrically connected to the first contact electrode and extending over the protective film.