Abstract: A bonded SOI wafer is manufactured by performing bonding in a state where organics exist on a surface of an active layer wafer and/or on a surface of a supporting wafer and performing heat-treating for bonding reinforcement in a state where the organics are trapped at an interface between the active layer wafer and the supporting wafer to form crystal defects at an interface between the active layer wafer and an oxide film and/or at an interface between the supporting wafer and the oxide film. This allows a simple and inexpensive gettering source to be formed at the interface between an SOI layer and an insulating layer (oxide film). Also, the bonded SOI wafer of the present invention that is manufactured by this method can effectively remove heavy-metal impurities that may have a negative impact on the characteristics of the device and/or the withstand voltage characteristics of the oxide film.

Abstract: A bonded SOI wafer is manufactured by performing bonding in a state where organics exist on a surface of an active layer wafer and/or on a surface of a supporting wafer and performing heat-treating for bonding reinforcement in a state where the organics are trapped at an interface between the active layer wafer and the supporting wafer to form crystal defects at an interface between the active layer wafer and an oxide film and/or at an interface between the supporting wafer and the oxide film. This allows a simple and inexpensive gettering source to be formed at the interface between an SOI layer and an insulating layer (oxide film). Also, the bonded SOI wafer of the present invention that is manufactured by this method can effectively remove heavy-metal impurities that may have a negative impact on the characteristics of the device and/or the withstand voltage characteristics of the oxide film.

Abstract: In order to enable both a back lid and a battery of a mobile electronic apparatus to be locked and unlocked with a single motion, the mobile electronic apparatus (10) in which the battery (11) is housed by opening the back lid (13) has such a structure that when a lock member (21) which is provided in a body of the mobile electronic apparatus so as to slide is slid to a locked position, the lock member (21) simultaneously locks both an engaging part (11a) provided in the battery (11) and an engaging part (13b) provided in the back lid (13), and when the lock member (21) is slid to an unlocked position, the lock member (21) simultaneously unlocks both the engaging parts (11a, 13b).

Abstract: A portable telephone to which additional function units, such as a flip unit and a slide unit, that provide additional functions for the main body of a portable telephone, are easily mounted on the case of a basic unit that includes only the essential units required for speech. One or more of an LCD bezel 40, a flip cover 50, a keypad bezel 60, grips 70, a keypad slide cover 80 and a slide cover 90, which are additional function units, are mounted on a basic unit 20. Therefore, this arrangement can cope with a request from a user who desires to alter a portable telephone he or she purchased to obtain a model he or she favors.

Abstract: A card is slid and fitted to a card connector fixed in a card-fitting recessed portion provided inside a reverse surface-side housing of a portable terminal apparatus. A front portion of the card is held by card holding portions provided in a front portion, as viewed in a card sliding direction, of the card connector, and a rear portion of the card is held by an inner wall surface of a cover-cum-battery of the reverse surface-side housing. A housing-side stopper is provided on a bottom surface of the card-fitting recessed portion. The housing-side stopper is formed by a rectangular resilient piece having one end fixed to a bottom surface of the card-fitting recessed portion.

Abstract: A card connector includes a base member and two sets of contact members which are provided on the base member. One ends of the contact members serve as joining portions with respect to a circuit board of a portable telephone. The other ends of the contact members serve as contact portions with respect to a card. The joining portions are respectively disposed at mutually opposite ends of the base member. The contact portions are bent in a chevron shape and have terminations in a card fitting direction.

Abstract: First of all, a sub-PCB (6) is fixedly put on a surface of a chassis (5) as shown in an arrow I. At this time, a taper face (9a) of a guide rib (9) guides a fixed position of the sub-PCB (6) in a transverse direction. Next, the sub-PCB (6) is slid forward as shown in an arrow II. A front end of the sub-PCB (6) is led into a taper face (8b) of a fixed click (8) and is guided downward, and gets into the underside of the click and stops in a position of an abutting face (8c).

Abstract: In order to enable both a back lid and a battery of a mobile electronic apparatus to be locked and unlocked with a single motion, the mobile electronic apparatus (10) in which the battery (11) is housed by opening the back lid (13) has such a structure that when a lock member (21) which is provided in a body of the mobile electronic apparatus so as to slide is slid to a locked position, the lock member (21) simultaneously locks both an engaging part (11a) provided in the battery (11) and an engaging part (13b) provided in the back lid (13), and when the lock member (21) is slid to an unlocked position, the lock member (21) simultaneously unlocks both the engaging parts (11a, 13b).

Abstract: A method for bonding substrates to tightly bond two overlaid substrates comprises the steps of: aligning the substrates, freely falling a second substrate onto a first substrate to overlay the first and second substrates; interposing an air layer between the joining surfaces of the first and second substrates, aligning the first and second substrates and holding the aligned first and second substrates; and pressing one point of the aligned two substrates. Thus, the bonded substrates which can be aligned accurately and free from occurrence of voids or the like can be obtained.

Abstract: A card is slid and fitted to a card connector fixed in a card-fitting recessed portion provided inside a reverse surface-side housing of aportable terminal apparatus. A front portion of the card is held by card holding portions provided in a front portion, as viewed in a card sliding direction, of the card connector, and a rear portion of the card is held by an inner wall surface of a cover-cum-battery of the reverse surface-side housing. A housing-side stopper is provided on a bottom surface of the card-fitting recessed portion. The housing-side stopper is formed by a rectangular resilient piece having one end fixed to a bottom surface of the card-fitting recessed portion.

Abstract: An internal battery (2) has a battery terminal provided on a tip and has a third engagement projection (11) provided on the other end in a vertical direction. A battery housing portion (4) has a connector (5) provided on a tip and has, on a rear end, a battery hook (6) for pressing the third engagement projection (11) interlockingly with a sliding operation from a release position to a lock position. The battery hook (6) is slid from the release position to the lock position to press the third engagement projection (11). Consequently, the battery terminal is caused to abut on the connector (5) and the internal battery 2 is fixed into the battery housing portion (4). A battery (3) is fixed and attachment is thus completed.

Abstract: First of all, a sub-PCB (6) is fixedly put on a surface of a chassis (5) as shown in an arrow I. At this time, a taper face (9a) of a guide rib (9) guides a fixed position of the sub-PCB (6) in a transverse direction. Next, the sub-PCB (6) is slid forward as shown in an arrow II. A front end of the sub-PCB (6) is led into a taper face (8b) of a fixed click (8) and is guided downward, and gets into the underside of the click and stops in a position of an abutting face (8c).

Abstract: A method for bonding substrates to tightly bond two overlaid substrates comprises the steps of: aligning the substrates, freely falling a second substrate onto a first substrate to overlay the first and second substrates; interposing an air layer between the joining surfaces of the first and second substrates, aligning the first and second substrates and holding the aligned first and second substrates; and pressing one point of the aligned two substrates. Thus, the bonded substrates which can be aligned accurately and free from occurrence of voids or the like can be obtained.

Abstract: A portable telephone to which additional function units, such as a flip unit and a slide unit, that provide additional functions for the main body of a portable telephone, are easily mounted on the case of a basic unit that includes only the essential units required for speech. One or more of an LCD bezel 40, a flip cover 50, a keypad bezel 60, grips 70, a keypad slide cover 80 and a slide cover 90, which are additional function units, are mounted on a basic unit 20. Therefore, this arrangement can cope with a request from a user who desires to alter a portable telephone he or she purchased to obtain a model he or she favors.

Abstract: There is disclosed an electronic equipment device. A pair of first and second printed boards are superposed with an electrically-conductive shield frame interposed therebetween in such a manner that those faces of the two printed boards having associated electronic parts mounted thereon are faced to each other. The shield frame has an integral peripheral wall extending over an entire peripheral edge thereof. This peripheral wall surrounds the electronic parts mounted on each of the two printed boards to achieve a shielding effect. Right and left sides of the stack of the two printed boards and the shield frame interposed therebetween are clamped respectively by a pair of resilient clamping members of a U-shaped cross-section to thereby provide a unitary assembly. These resilient clamping members cause earth portions of the first and second printed boards to be electrically connected to the shield frame.