Abstract: An electrostatic chuck includes an insulating base body including a predetermined surface, and an electrode inside the base body, which is layer shaped along the predetermined surface. An upper surface of the electrode facing a side where the predetermined surface is located and the base body are in contact. A gap which is rendered a vacuum or filled with a gas is interposed between a side surface of the electrode and the base body.

Abstract: A board-like structure includes a base body, an internal conductor, and a terminal member. The base body is an insulating member including an upper surface and a lower surface on an opposite side to the upper surface. The internal conductor runs along the upper surface and the lower surface inside the base body. The terminal member is at least partially located inside the base body, is exposed to an external portion of the base body at the lower surface, and is electrically connected to the internal conductor. The terminal member includes an insulating terminal base part and a conductor layer on a surfaces of the terminal base part.

Abstract: A heater includes a plate-shaped part, one or more resistance heating element, a columnar part, and a plurality of relay conductors. The plate-shaped part has an insulation property and includes an upper surface on which a wafer is to be superimposed and a lower surface on an opposite side to the upper surface. The one or more resistance heating element is buried in the plate-shaped part. The columnar part has an insulation property and projects downward from the lower surface of the plate-shaped part. The plurality of relay conductors respectively include extension portions vertically extending inside the columnar part and are electrically connected to the one or more resistance heating elements.

Abstract: A structural body (2, 2A to 2E) according to the present disclosure includes a base (10, 10D, 10E), a first electrode layer (111), a second electrode layer (112), a first via conductor (131), a second via conductor (132), and a connection conductor (133). The base (10, 10D, 10E) is composed of a ceramic. The first electrode layer (111) and the second electrode layer (112) are located inside the base (10, 10D, 10E). The first via conductor (131) and the second via conductor (132) are located inside the base (10, 10D, 10E) and connect the first electrode layer (111) and the second electrode layer (112). The connection conductor is located inside the base (10, 10D, 10E), and connects the first via conductor and the second via conductor.

Abstract: Structures (2, 2A to 2P) according to the present disclosure have respective bases (10, 10A), electrode layers, and terminals. The bases (10, 10A) are made of a ceramic. The electrode layers (111, 111C, 111D, 111F, 111M, 111N, 111O) are located inside the respective bases (10, 10A). The terminals (41, 41G, 41H, 41I, 41J, 41K, 41L) are electrically connected to the respective electrode layers (111, 111C, 111D, 111F, 111M, 111N, 111O) at respective tip portions of the terminals. Further, the terminals (41, 41G, 41H, 41I, 41J, 41K, 41L) are in contact with the respective electrode layers (111, 111C, 111D, 111F, 111M, 111N, 111O) at respective tip surfaces and side surfaces of the terminals.

Abstract: A heater includes a base, a resistive heating body, and a terminal portion. The base is formed of ceramic and has a plate shape. The resistive heating body is located in the base. The terminal portion is electrically connected to the resistive heating body. The base includes a protruding portion surrounding the terminal portion, on a lower surface side. The protruding portion is formed of a ceramic member, and the terminal portion passes through a through hole formed in the ceramic member. The ceramic member is bonded to at least one of the lower surface of the base or the terminal portion.

Abstract: A base structure includes a base, a first conductor layer, and a via conductor. The base has a first surface. The first conductor layer is positioned along the first surface in the base. The via conductor includes a first part and a second part in a section that includes the via conductor and that extends in a first direction perpendicular to the first surface. The length of the first part in the first direction is larger than the thickness of the first conductor layer. The length of the second part in the first direction is larger than the thickness of the first conductor layer. The second part is continuous with the first part, and at least a portion of the outer edge of the second part is displaced from the outer edge of the first part when viewed in the first direction.

Abstract: A heater includes a base body and an internal conductor. The base body is made of ceramic. The internal conductor is located inside the base body and includes a connection portion. The base body includes a space extending from the connection portion to a lower surface of the base body. The space includes a first space and a second space. The first space contacts with the connection portion. The second space connects the first space and an outer side of the lower surface of the base body, and is smaller than the first space in a planar perspective of the lower surface of the base body.

Abstract: A board-like structure includes a base body, an internal conductor, a connection conductor, and a terminal member. The base body is an insulating member including an upper surface and a lower surface on an opposite side to the upper surface. The internal conductor runs along the upper surface and the lower surface inside the base body. The connection conductor is connected to the internal conductor inside the base body. The terminal member is connected to the connection conductor inside the base body and is exposed to an external portion of the base body at the lower surface. The connection conductor is longer in length in a vertical direction than a thickness of the internal conductor in the vertical direction. In the terminal member, at least a side surface is connected to the side surface of the connection conductor.

Abstract: A heater includes a base body, a resistance heating element, and a terminal part. The base body is made of ceramic and is a plate shape. The resistance heating element is located inside the base body. The terminal part is electrically connected to the internal conductor, is located inside the base body in at least a part, and is exposed from a lower surface of the base body to an exterior of the base body. The base body includes a hole opened at the lower surface of the base body. The terminal part includes a connection conductor. The connection conductor is inserted in the hole and is connected to the internal conductor. A lower surface of the connection conductor is located on a side closer to the upper surface of the base body other than the lower surface of the base body. The hole includes a reduced-diameter portion which has a diameter smaller than a diameter of the connection conductor between the lower surface of the connection conductor and the lower surface of the base body.

Abstract: A heater includes a plate-shaped part, one or more resistance heating element, a columnar part, and a plurality of relay conductors. The plate-shaped part has an insulation property and includes an upper surface on which a wafer is to be superimposed and a lower surface on an opposite side to the upper surface. The one or more resistance heating element is buried in the plate-shaped part. The columnar part has an insulation property and projects downward from the lower surface of the plate-shaped part. The plurality of relay conductors respectively include extension portions vertically extending inside the columnar part and are electrically connected to the one or more resistance heating elements.

Abstract: A board-like structure includes a base body, an internal conductor, and a terminal member. The base body is an insulating member including an upper surface and a lower surface on an opposite side to the upper surface. The internal conductor runs along the upper surface and the lower surface inside the base body. The terminal member is at least partially located inside the base body, is exposed to an external portion of the base body at the lower surface, and is electrically connected to the internal conductor. The terminal member includes an insulating terminal base part and a conductor layer on a surfaces of the terminal base part.

Abstract: A heater includes a base body, a resistance heating element, and a terminal part. The base body is made of ceramic and is plate shaped including an upper surface on which a wafer is superimposed and a lower surface on an opposite side to the upper surface. The resistance heating element is located inside the base body. The terminal part is electrically connected to the resistance heating element, is at least partially located inside the base body, and is exposed from, the lower surface of the base body to an exterior of the base body. The lower surface of the base body includes an adjacent region which surrounds the terminal part. The adjacent region includes an inclined surface in a portion reaching the terminal part.

Abstract: A heater includes a base body and a resistance heating element. The base body is configured by an insulating material and includes a top surface on which a wafer is placed. The resistance heating element extends in the base body along the top surface. A top surface of the resistance heating element and the base body are in contact with each other. A vacuum or gas-filled gap is interposed between a side surface of the resistance heating element and the base body.

Abstract: An electrostatic chuck includes an insulating base body including a predetermined surface, and an electrode inside the base body, which is layer shaped along the predetermined surface. An upper surface of the electrode facing a side where the predetermined surface is located and the base body are in contact. A gap which is rendered a vacuum or filled with a gas is interposed between a side surface of the electrode and the base body.

Abstract: A structure of the present disclosure includes a substrate made of an aluminum nitride-based ceramic, a power supply terminal made of tungsten or molybdenum, a bonding layer located between the substrate and the power supply terminal to be in contact with each thereof, and an internal electrode electrically connected to the power supply terminal. Then, in the bonding layer, a total of components constituting the power supply terminal and aluminum nitride is 90 vol % or more in a total volume of 100 vol % constituting the bonding layer.

Abstract: The sample conveying member of the present disclosure includes: a ceramic substrate; a support part that includes a conductive member on at least a portion of a sample support surface; and a conductive layer that is positioned inside of the substrate and connects to a grounding unit outside of the substrate from the conductive member.

Abstract: A wafer holding member comprises a ceramic base body and a heating resistor, an electrostatic adhesion electrode or a plasma generation electrode embedded in the base body. The wafer holding member exhibits reduced thermal expansion and greater corrosion resistance against halogenic gases. The heating resistor is made of a mixture containing 90 to 99 wt % of at least one of W, Mo, WC, TiC and TiN (the first component), and 1 to 10 wt % of AlN (the second component), the electrostatic adhesion electrode is made of a mixture containing 50 to 99 wt % of said first component, and 1 to 50 wt % of said second component, and the plasma generation electrode is made of a mixture containing 80 to 99 wt % of said first component, and 1 to 20 wt % of said second component.

Abstract: A wafer support member comprises a base made of ceramics with thickness of 3 mm or more, a metallic electrode plate with thickness of 0.5 mm or more bonded onto the base, and an attraction surface composed of an aluminum nitride film with thickness of 0.01 to 0.5 mm coated on the surface of the electrode plate. The electrode plate functions as a plasma generating electrode when high frequency voltage is applied to the electrode plate and as an electrostatic attraction electrode when direct-current high voltage is applied to the electrode plate. Also, a wafer holding device for holding a wafer such as semiconductor wafer and glass substrate for liquid crystal is disclosed. The wafer holding device comprises a base body of aluminum nitride sintered body containing resistance heating elements therein. Lead terminals for feeding power to the resistance heating elements are formed in the lower surface of the base body.

Abstract: Disclosure relates to the method for improving the heat absorption characteristic of a wafer holding member made of aluminum nitride during indirect heating and the method for preventing electrostatic adhesion. To establish the former method, the wafer holding member comprises an aluminum nitride based sintered body containing Er.sub.2 O.sub.3 as a sintering aid and silicon in the range of more than 200 ppm to 500 ppm or less and having a thermal conductivity of 150 W/m.k or more, and further comprises a holding base body made of an aluminum nitride based sintered body.