Patents by Inventor Yasunori Oka

Yasunori Oka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6474474
    Abstract: The present invention relates to a thin-plate supporting container 1 having a container body 2, and a thin-plate supporting unit 3 for supporting the semiconductor wafers from both sides thereof in the container body. There are provided a lid 4, and an easy attach/detach mechanism for attaching and detaching the lid 4. The easy attach/detach mechanism 31 is composed of a lid engaging claw 32 provided on the circumference of the lid 4, and object engagement part 28, provided on the container body 2, for engaging with the lid engagement claw 32 so as to secure the lid 4 to the container body 2, an arm 34 for releasing the lid engagement claw 32 from the object engagement part 28; and an elevating mechanism for slightly elevating the lid 4 from the container body 2 when the lid engagement claw 32 is released by means of the arm 34. The thin-plate supporting unit 3, the top flange 5, the carrying handle 6 are detachably mounted. The thin-plate supporting unit 3 is formed with a V-shaped groove 38.
    Type: Grant
    Filed: September 21, 1999
    Date of Patent: November 5, 2002
    Assignees: Sumitomo Metal Industries, Ltd., Kakizaki Manufacturing Co., Ltd.
    Inventors: Yukihiro Hyobu, Yasunori Oka
  • Publication number: 20010040116
    Abstract: The present invention relates to a thin-plate supporting container 1 having a container body 2, and a thin-plate supporting unit 3 for supporting the semiconductor wafers from both sides thereof in the container body. There are provided a lid 4, and an easy attach/detach mechanism for attaching and detaching the lid 4. The easy attach/detach mechanism 31 is composed of a lid engaging claw 32 provided on the circumference of the lid 4, and object engagement part 28, provided on the container body 2, for engaging with the lid engagement claw 32 so as to secure the lid 4 to the container body 2, an arm 34 for releasing the lid engagement claw 32 from the object engagement part 28; and an elevating mechanism for slightly elevating the lid 4 from the container body 2 when the lid engagement claw 32 is released by means of the arm 34. The thin-plate supporting unit 3, the top flange 5, the carrying handle 6 are detachably mounted. The thin-plate supporting unit 3 is formed with a V-shaped groove 38.
    Type: Application
    Filed: September 21, 1999
    Publication date: November 15, 2001
    Inventors: YUKIHIRO HYOBU, YASUNORI OKA
  • Patent number: 5051375
    Abstract: Disclosed is a method of producing a semiconductor wafer through gettering by means of sand blasting in a semiconductor wafer fabrication process. The method includes blasting abrasives each having a configuration at least similar to a sphere against a back surface of the semiconductor wafer, causing shear stress having a maximum point in the interior of the wafer to be generated, whereby damage is produced mainly in the interior of the wafer.
    Type: Grant
    Filed: July 10, 1989
    Date of Patent: September 24, 1991
    Assignees: Kyushu Electronic Metal Co., Ltd., Osaka Titanium Co., Ltd.
    Inventors: Sueo Sakata, Yasunori Oka, Toshio Naritomi