Patents by Inventor Yasuo Furuhashi

Yasuo Furuhashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing a multi-layered wiring board
    Patent number: 7100275
    Abstract: Method of producing a multi-layered wiring board comprising the steps of subjecting the photosensitive resin to exposure- and development-treatment to form the holes having a predetermined size and shape; depositing and forming the curable resin to the insulating layer having the holes formed therein in such a manner as to bury the holes, and conducting heat-treatment to form the cured thin film of the curable resin on the surface of the insulating layer; and so removing the curable resin as to leave the cured thin film to obtain the via-holes having the reduced opening size by the cured thin film.
    Type: Grant
    Filed: July 20, 2004
    Date of Patent: September 5, 2006
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshiyuki Toyoshima, Satoshi Yanaura, Yasuo Furuhashi, Hirofumi Fujioka
  • Method of producing a multi-layered wiring board
    Publication number: 20050003076
    Abstract: Method of producing a multi-layered wiring board comprising the steps of subjecting the photosensitive resin to exposure- and development-treatment to form the holes having a predetermined size and shape; depositing and forming the curable resin to the insulating layer having the holes formed therein in such a manner as to bury the holes, and conducting heat-treatment to form the cured thin film of the curable resin on the surface of the insulating layer; and so removing the curable resin as to leave the cured thin film to obtain the via-holes having the reduced opening size by the cured thin film.
    Type: Application
    Filed: July 20, 2004
    Publication date: January 6, 2005
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshiyuki Toyoshima, Satoshi Yanaura, Yasuo Furuhashi, Hirofumi Fujioka
  • Method of producing a multi-layered wiring board
    Publication number: 20010025414
    Abstract: Method of producing a multi-layered wiring board comprising the steps of subjecting the photosensitive resin to exposure- and development-treatment to form the holes having a predetermined size and shape; depositing and forming the curable resin to the insulating layer having the holes formed therein in such a manner as to bury the holes, and conducting heat-treatment to form the cured thin film of the curable resin on the surface of the insulating layer; and so removing the curable resin as to leave the cured thin film to obtain the via-holes having the reduced opening size by the cured thin film.
    Type: Application
    Filed: December 18, 2000
    Publication date: October 4, 2001
    Inventors: Toshiyuki Toyoshima, Satoshi Yanaura, Yasuo Furuhashi, Hirofumi Fujioka
  • Method for manufacturing multi-layer printed board
    Patent number: 5626713
    Abstract: An apparatus for producing a multi-layer printed circuit board. The printed circuit board includes a bottom layer board, a hole board, and an adhesive sheet between the bottom layer board and the hole board. The printed circuit board is heated so that adhesive sheet bonds the bottom layer board to the hole board. A mold release sheet and a thermoplastic resin sheet begins to soften at a temperature lower than the melting temperature of the adhesive. A contraction control member controls contraction when the thermoplastic resin sheet cools.
    Type: Grant
    Filed: December 30, 1994
    Date of Patent: May 6, 1997
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shoji Yamaguchi, Akira Yamada, Yasuo Furuhashi, Fumiaki Baba
  • Method for manufacturing multi-layer printed board
    Patent number: 5460680
    Abstract: A method for producing multi-layer printed board. The method includes heating a hole board as a top layer, an adhesive sheet, and a bottom layer board. The adhesive sheet includes a mold release sheet and a thermoplastic resin sheet which begins to soften at a temperature lower than the melting temperature of the adhesive. A contraction control member controls contraction when the thermoplastic resin sheet cools.
    Type: Grant
    Filed: January 19, 1994
    Date of Patent: October 24, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shoji Yamaguchi, Akira Yamada, Yasuo Furuhashi, Fumiaki Baba