Abstract: An abrasive liquid for a metal comprising (1) an oxidizing agent for a metal, (2) a dissolving agent for an oxidized metal, (3) a first protecting film-forming agent such as an amino acid or an azole which adsorbs physically on the surface of the metal and/or forms a chemical bond, to thereby form a protecting film, (4) a second protecting film-forming agent such as polyacrylic acid, polyamido acid or a salt thereof which assists the first protecting film-forming agent in forming a protecting film and (5) water; and a method for polishing.

Abstract: A polishing liquid for metal containing a metal-oxidizing agent, an oxidized metal dissolving agent, a protective film forming agent, a water-soluble polymer and water, the polishing liquid being used for producing a wiring pattern having a metal-embedded wiring portion of 10 to 100 &mgr;m width and an insulating portion of 10 to 100 &mgr;m width in which pattern the wiring portion is arranged at a wiring density of 40 to 60%, the polishing liquid for metal being comprising in that, when a surface to be polished of a metal film embedded in the wiring portion and a surface to be polished of an insulating film formed at both side portions of the metal film is polished substantially flush, wherein (width of the metal-embedded wiring portion)/(magnitude of dishing (depth)) is no less than 103.

Abstract: An abrasive liquid for a metal comprising (1) an oxidizing agent for a metal, (2) a dissolving agent for an oxidized metal, (3) a first protecting film-forming agent such as an amino acid or an azole which adsorbs physically on the surface of the metal and/or forms a chemical bond, to thereby form a protecting film, (4) a second protecting film-forming agent such as polyacrylic acid, polyamido acid or a salt thereof which assists the first protecting film-forming agent informing a protecting film and (5) water; and a method for polishing.

Abstract: This invention provides a heat transmitting pipe and a heat transmitting plate which are capable of greatly improving the heat transfer efficiency of a conventional finned heating pipe and a convention heating plate. Copper oxide powder is deposited in a vapor phase onto a cellular synthetic resin coated with an adhesive beforehand. Thereafter, a copper plate with the same metal powder deposited thereon is placed on one surface of the metal powder-bearing cellular synthetic resin and is brought into lightly pressed contact with the surface by a roll press or the like, to thereby form a laminated article. Subsequently, the cellular synthetic resin is burnt off in a combustion furnace, to thereby produce a cellular metal material of the copper oxide on the copper plate. Further, the cellular metal material is reduced and sintered in a reducing atmosphere such as that of a hydrogen reduction furnace, to thereby produce a cellular copper material which is provided with the copper plate on one surface thereof.

Abstract: A method for producing a porous body with high porosity is provided.An adhesive is coated on a synthetic resin foam having three-dimensional network structure, such as urethane foam, serving as a base material, to impart stickiness to the surface of the resin foam, and thereafter a powder such as copper oxide powder is applied thereto, followed by heating to remove the substrate and sinter the powder. Thus, a porous body to which the pattern of the base material has been transferred is produced.The powder may be appropriately selected to obtain porous bodies having a great strength, without limitations on materials.