Abstract: An anodic bonding method for anodically bonding a first substrate and a second substrate includes: a substrate placement step in which the first substrate and the second substrate are stacked and placed on a flat surface of a base with a surface of one of the first substrate and the second substrate to be cathode in contact with the flat surface of the base; a jig placement step, following the substrate placement step, in which the anodic bonding jig is placed so as to be in contact with a surface of one of the first substrate and the second substrate to be anode, the anodic bonding jig having a visual checking area formed of a material that allows visible light to pass through; an alignment step in which the relative positional relation between the first substrate and the second substrate is adjusted based on visible light passing through the visual checking area so that pairs of marks provided on the first substrate and the second substrate will be in a predetermined positional relation; a pressurizing step

Abstract: When a base substrate where through electrodes are formed is anodically bonded to a lid substrate that includes a bonding film formed on the entire lower surface thereof, a method of manufacturing a piezoelectric vibrator includes a superimposing process for superimposing the lid substrate on the base substrate so that a piezoelectric vibrating reed is received in a cavity, after bonding the piezoelectric vibrating reed to the upper surface of the base substrate; a setting process for placing a dummy member, which is made of a material in which ions can be transferred at a bonding temperature, on an electrode plate, and placing the superimposed substrates on the dummy member so that the base substrate faces the dummy member; and an applying process for applying a bonding voltage between the electrode plate and the bonding film after heating the dummy member and the substrates up to the bonding temperature.

Abstract: A method for fabricating a piezoelectric vibrator includes inserting a filling member formed with a through hole inside of a ring having a substantially cylindrical shape, and inserting one piece of a lead to the through hole of the filling member to project from both sides of the ring. The method further includes sintering the filling member along with the ring and the lead to integrate in an airtight manner, subjecting an exciting electrode of the piezoelectric vibrating piece to a bump connection with an inner lead portion of the lead projected from the ring, subjecting another exciting electrode on a side of the piezoelectric vibrating piece opposed to the other exciting electrode to wire bonding with the ring, and press-fitting the ring to an opening portion of a case and sealing the piezoelectric vibrating piece connected with the inner lead portion inside of the case in an airtight manner.

Abstract: Disclosed is a glass body cutting method for cutting a glass body along a planned cutting line, the method including: a groove forming process of forming a groove on one surface of the glass body along the planned cutting line by irradiation of a laser light along the planned cutting line; an attachment process of attaching an adhesive sheet to the one surface to cover at least the groove, after the groove forming process; and a cutting process of cutting the glass body along the planned cutting line by applying a tear stress along the planned cutting line while pressing a cutting blade against the other surface of the glass body in a state where the glass body is disposed on a supporting section through the adhesive sheet, after the attachment process.

Abstract: Disclosed is a bonded glass cutting method including: a first focus adjustment process of focusing laser light; a second focus adjustment process of moving the focus of the laser light toward one surface side of the bonded glass along a thickness direction of the bonded glass, after the first focus adjustment process; a detection target portion forming process of forming a detection target portion on one surface by irradiation of the laser light, after the second focus adjustment process; a third focus adjustment process of refocusing the laser light on the detection target portion; a groove forming process of forming a groove on one surface by irradiation of the laser light along the planned cutting line, after the third focus adjustment process.

Abstract: To provide a wafer in which out-gas emitted between wafers during bonding of the wafers can be easily discharged to the outside and the bonded wafers can be favorably cut to improve the yields, and a method of manufacturing a package product using the wafer. A groove portion is formed in a wafer for lid substrate along a plurality of imaginary straight lines passing through a center in a diameter direction of the wafer for lid substrate and extending in the diameter direction. The groove portion is divided into a plurality of groove portions in the diameter direction placed such that the groove portions are not in contact with each other.

Abstract: An anodic bonding method for anodically bonding a first substrate and a second substrate includes: a substrate placement step in which the first substrate and the second substrate are stacked and placed on a flat surface of a base with a surface of one of the first substrate and the second substrate to be cathode in contact with the flat surface of the base; a jig placement step, following the substrate placement step, in which the anodic bonding jig is placed so as to be in contact with a surface of one of the first substrate and the second substrate to be anode, the anodic bonding jig having a visual checking area formed of a material that allows visible light to pass through; an alignment step in which the relative positional relation between the first substrate and the second substrate is adjusted based on visible light passing through the visual checking area so that pairs of marks provided on the first substrate and the second substrate will be in a predetermined positional relation; a pressurizing step

Abstract: There is provided a method of manufacturing piezoelectric vibrators 1. The method includes a process for through holes 35 and 36, which pass through a base substrate wafer, so that openings of the through holes are opened to the outside of the recesses for cavities C; a process for patterning a bonding layer 30, pairs of mounting layers, and pairs of extraction electrode layers 33 and 34 on the upper surface of the base substrate wafer with the same conductive material; and a process for electrically isolating the extraction electrode layers 34 in the middle by irradiating a part (area S2) of the extraction electrode layers 34, which are formed between the bonding layer and openings of through holes 36, with laser light after both the wafers are anodically bonded to each other. The bonding layer 30 surrounds the recesses, the pairs of mounting layers are in the recesses, and the pairs of extraction electrode layers 33 and 34 electrically connect the pairs of mounting layers to the bonding layer.

Abstract: There is provided a method of manufacturing a package 1 having a base substrate 10 and a lid substrate 20 bonded to each other and both formed of a glass base material; and a cavity C formed between the both substrates for storing an encapsulated object 2 in a state of being hermetically encapsulated, including: a depression forming step for forming a depression C1 for a cavity which defines the cavity when the both substrates are superimposed to each other on at least one of the both substrates; and a bonding step for superimposing the both substrates so as to store the encapsulated object in the depression and then bonding the both substrates to encapsulate the encapsulated object in the cavity, characterized in that in the depression forming step, printed layers 12 are laminated on an upper surface of a flat plate-shaped glass base material 11 in a frame shape in plan view by screen printing, and then the printed layers and the glass base material are baked at the same time to form the depression.

Abstract: A piezoelectric vibrating reed includes a piezoelectric plate made of a piezoelectric material, a pair of exciter electrodes formed on outer surfaces of the piezoelectric plate and configured to vibrate the piezoelectric plate when a predetermined voltage is applied thereon, and a pair of mount electrodes electrically connected to the pair of exciter electrodes, respectively. One mount electrode in the pair of mount electrodes is formed on one surface (under surface) of the piezoelectric plate and the other mount electrode is formed on the other surface (top surface) of the piezoelectric plate in a state not to oppose the one mount electrode with the piezoelectric plate in between. Accordingly, not only can power be saved, but also higher performance can be achieved by lowering the R1 characteristic and thereby enhancing the vibration characteristic.

Abstract: A method of fabricating a case accommodating a piezoelectric vibrating piece therein in a piezoelectric oscillator including the piezoelectric vibrating piece, including the steps of: applying deep drawing to a conductive plate member to shape the plate member in a nearly cylindrical shape with a bottom; pressing an inner surface of a bottom part of the plate member by a punch for step drawing while an outer surface of the bottom part is being abutted against a surface including an opening of a hole of a die having an inner diameter smaller than the outer diameter of the bottom part, whereby a projecting portion is formed on the outer surface of the bottom part; and cutting the plate member having the projecting portion at a predetermined position on the opening side thereof, whereby a case in a nearly cylindrical shape with a bottom having the projecting portion is obtained.

Abstract: When a base substrate where through electrodes are formed is anodically bonded to a lid substrate that includes a bonding film formed on the entire lower surface thereof, a method of manufacturing a piezoelectric vibrator includes a superimposing process for superimposing the lid substrate on the base substrate so that a piezoelectric vibrating reed is received in a cavity, after bonding the piezoelectric vibrating reed to the upper surface of the base substrate; a setting process for placing a dummy member, which is made of a material in which ions can be transferred at a bonding temperature, on an electrode plate, and placing the superimposed substrates on the dummy member so that the base substrate faces the dummy member; and an applying process for applying a bonding voltage between the electrode plate and the bonding film after heating the dummy member and the substrates up to the bonding temperature.

Abstract: A method of fabricating a hermetic terminal includes: joining and firing wherein a bar-shaped member to be a lead is inserted into a ring, and they are fired to form a hermetic terminal intermediate having the bar-shaped member fixed in the ring; flattening wherein an end part of the bar-shaped member to be the inner lead portion of the lead is flattened to form a stair portion; and shaping wherein an end part of the stair portion is cut to shape the stair portion into a predetermined shape, wherein in the joining and firing step, a solid round bar longer than the lead is used as the bar-shaped member, and one end side of the bar-shaped member to be the inner lead portion is inserted into the ring so that the one end side is longer than the inner lead portion in the hermetic terminal as a completed product.

Abstract: There is There is provided a method of manufacturing a package 1 having a base substrate 10 and a lid substrate 20 bonded to each other and both formed of a glass base material; and a cavity C formed between the both substrates for storing an encapsulated object 2 in a state of being hermetically encapsulated, including: a depression forming step for forming a depression C1 for a cavity which defines the cavity when the both substrates are superimposed to each other on at least one of the both substrates; and a bonding step for superimposing the both substrates so as to store the encapsulated object in the depression and then bonding the both substrates to encapsulate the encapsulated object in the cavity, characterized in that in the depression forming step, printed layers 12 are laminated on an upper surface of a flat plate-shaped glass base material 11 in a frame shape in plan view by screen printing, and then the printed layers and the glass base material are baked at the same time to form the depression.

Abstract: There is provided a method of manufacturing piezoelectric vibrators 1. The method includes a process for through holes 35 and 36, which pass through a base substrate wafer, so that openings of the through holes are opened to the outside of the recesses for cavities C; a process for patterning a bonding layer 30, pairs of mounting layers, and pairs of extraction electrode layers 33 and 34 on the upper surface of the base substrate wafer with the same conductive material; and a process for electrically isolating the extraction electrode layers 34 in the middle by irradiating a part (area S2) of the extraction electrode layers 34, which are formed between the bonding layer and openings of through holes 36, with laser light after both the wafers are anodically bonded to each other. The bonding layer 30 surrounds the recesses, the pairs of mounting layers are in the recesses, and the pairs of extraction electrode layers 33 and 34 electrically connect the pairs of mounting layers to the bonding layer.

Abstract: A piezoelectric vibrating reed includes a piezoelectric plate made of a piezoelectric material, a pair of exciter electrodes formed on outer surfaces of the piezoelectric plate and configured to vibrate the piezoelectric plate when a predetermined voltage is applied thereon, and a pair of mount electrodes electrically connected to the pair of exciter electrodes, respectively. One mount electrode in the pair of mount electrodes is formed on one surface (under surface) of the piezoelectric plate and the other mount electrode is formed on the other surface (top surface) of the piezoelectric plate in a state not to oppose the one mount electrode with the piezoelectric plate in between. Accordingly, not only can power be saved, but also higher performance can be achieved by lowering the R1 characteristic and thereby enhancing the vibration characteristic.

Abstract: To achieve small-sized formation of a piezoelectric vibrator while preventing exciting electrodes provided at both faces of the piezoelectric vibrating piece from being shortcircuited to each other and enabling to fabricate the piezoelectric vibrating piece easily, there is provided a piezoelectric vibrator 1 including a case 3 in a shape of a bottomed cylinder having an opening portion 3a and having a conductivity, a ring 12 substantially in a cylindrical shape press-fitted to the opening portion 3a of the case 3 and having a conductivity, one piece of a lead 13 inserted to the ring 12 and having an inner lead portion 15 and an outer lead portion 16, a filling member 14 having an insulting property for sealing an interval between the lead 13 and the ring 12 in airtight, and a piezoelectric vibrating piece 2 which is constituted by substantially a plate-like shape arranged at inside of the case 3 and includes exciting electrodes 8, 9 at both faces thereof and in which the exciting electrode 8 is supported by

Abstract: To achieve small-sized formation of a piezoelectric vibrator while preventing exciting electrodes provided at both faces of the piezoelectric vibrating piece from being shortcircuited to each other and enabling to fabricate the piezoelectric vibrating piece easily, there is provided a piezoelectric vibrator 1 including a case 3 in a shape of a bottomed cylinder having an opening portion 3a and having a conductivity, a ring 12 substantially in a cylindrical shape press-fitted to the opening portion 3a of the case 3 and having a conductivity, one piece of a lead 13 inserted to the ring 12 and having an inner lead portion 15 and an outer lead portion 16, a filling member 14 having an insulting property for sealing an interval between the lead 13 and the ring 12 in airtight, and a piezoelectric vibrating piece 2 which is constituted by substantially a plate-like shape arranged at inside of the case 3 and includes exciting electrodes 8, 9 at both faces thereof and in which the exciting electrode 8 is supported by

Abstract: A method of fabricating a case accommodating a piezoelectric vibrating piece therein in a piezoelectric oscillator including the piezoelectric vibrating piece, including the steps of: applying deep drawing to a conductive plate member to shape the plate member in a nearly cylindrical shape with a bottom; pressing an inner surface of a bottom part of the plate member by a punch for step drawing while an outer surface of the bottom part is being abutted against a surface including an opening of a hole of a die having an inner diameter smaller than the outer diameter of the bottom part, whereby a projecting portion is formed on the outer surface of the bottom part; and cutting the plate member having the projecting portion at a predetermined position on the opening side thereof, whereby a case in a nearly cylindrical shape with a bottom having the projecting portion is obtained.

Abstract: A method of fabricating a hermetic terminal includes: joining and firing wherein a bar-shaped member to be a lead is inserted into a ring, and they are fired to form a hermetic terminal intermediate having the bar-shaped member fixed in the ring; flattening wherein an end part of the bar-shaped member to be the inner lead portion of the lead is flattened to form a stair portion; and shaping wherein an end part of the stair portion is cut to shape the stair portion into a predetermined shape, wherein in the joining and firing step, a solid round bar longer than the lead is used as the bar-shaped member, and one end side of the bar-shaped member to be the inner lead portion is inserted into the ring so that the one end side is longer than the inner lead portion in the hermetic terminal as a completed product.