Abstract: An object of the present invention is to take fundamental measures against the phenomenon that the positive current collector of a lead-acid battery elongates due to corrosion, in consideration of a mechanism, and to inhibit corrosion elongation. A current collector is prepared by the steps of: mixing a lead oxide of pinning compounds for inhibiting recrystallization with the atomized powder of lead or a lead alloy; and then powder-rolling the mixture. A lead-acid battery is composed with the use of the current collector.

Abstract: Disclosed is an engine driving system having a cell suitable for restarting an engine, wherein an engine is stopped at the time of stopping running of a vehicle and the engine is restarted at the time of starting running of the vehicle, there are provided an engine electronic control device for controlling the engine, a motor for restarting the engine and a cell for supplying an electrical power to the motor; the cell comprises an anode plate formed into a thin band-shape, a cathode plate formed into a thin band-shape and a band-like separator arranged between the anode plate and the cathode plate; and the anode plate, the cathode plate and the separator form a group of wound pole plates and the group of pole plates is immersed in electrolysis solution.

Abstract: Disclosed is an engine driving system having a cell suitable for restarting an engine, wherein an engine is stopped at the time of stopping running of a vehicle and the engine is restarted at the time of starting running of the vehicle, there are provided an engine electronic control device for controlling the engine, a motor for restarting the engine and a cell for supplying an electrical power to the motor; the cell comprises an anode plate formed into a thin band-shape, a cathode plate formed into a thin band-shape and a band-like separator arranged between the anode plate and the cathode plate; and the anode plate, the cathode plate and the separator form a group of wound pole plates and the group of pole plates is immersed in electrolysis solution.

Abstract: An object of the present invention is to inhibit intergranular corrosion of a lead alloy by grain refining, and to prolong the life and improve the reliability of a lead battery using the alloy for a positive current collector in the battery. The intergranular corrosion of the lead alloy is inhibited by adding Sr to a Pb—Sn alloy to refine a cast structure and the recrystallized structure of a rolled material, and the hardness is improved by further adding Ca, Ba and Te. In addition, the rolled sheet of the lead alloy is used in the positive current collector of the lead storage battery.

Abstract: The present invention relates to a ball bearing that includes a plurality of balls and a retainer. The present invention also relates to a self-winding timepiece that is provided with a ball bearing. The present invention employs a retainer that is formed from a resin that contains filler as a component element of the ball bearing. Alternatively, the present invention employs a ball bearing that has a retainer that is formed from a resin that contains filler as a component element of the self-winding timepiece.

Abstract: A plurality of chargers 7 are provided in a housing 2, these chargers 7 noncontactly supply electric power to the objects W by electromagnetic induction. Each of the objects W includes an IC chip 80 having a high-frequency oscillator circuit and an antenna 90 connecting to the IC chip. The charging apparatus 1 further includes an antenna 110 for receiving high-frequency data signals from the IC chip 80 and a circuit for controlling the chargers 7 around the object W according to the data signals received by the antenna 110 so as to drive a charger 7 sending electromagnetic waves to the object from an optimal direction.

Abstract: In the hydrogen supply device for producing and supplying hydrogen to a fuel cell, a heat exchange section has a rotary thermal storage through which low and high temperature passages pass. Reforming material is supplied to the low temperature fluid passage on an upstream side of the heat exchange section. A reforming section for producing reformed gas containing hydrogen is located at a downstream side of the low temperature fluid passage. A combustion gas supply section for generating and supplying a combustion gas is located in the high temperature fluid passage. The rotary thermal storage rotates to move alternately between the low and high temperature fluid passages so that heat of the combustion gas flowing in the high temperature fluid conduit is transferred to reforming material flowing in the low temperature fluid conduit. The low temperature fluid passage communicates with the high temperature fluid passage via the fuel cell.

Abstract: A composite material is provided, which has a low thermal expansivity, a high thermal conductivity, and a good plastic workability, which composite material may be applied to semiconductor devices and many other uses. The composite material is composed of metal and inorganic particles having a smaller coefficient of thermal expansion than the metal. It is characterized in that the inorganic particles are dispersed in such a way that 95% or more of them (in terms of their area in cross-section) form aggregates of complex configuration joined together. The composite material contains 20-80 vol % of copper oxide, with the remainder being copper. It has a coefficient of thermal expansion of 5×10?6 to 14×10?6/° C. and thermal conductivity of 30-325 W/m·K in the range of room temperature to 300° C. It is suitable for the radiator plate of semiconductor devices and the dielectric plate of electrostatic attractors.

Abstract: The present invention relates to an electronic timepiece. Moreover, the present invention relates to a conductive spring which can be used in an alarm electronic timepiece, or the like. Also the present invention is constituted to include one or more curved sections so as to be deformable, and constitutes a conductive spring formed from a filler containing resin. Alternatively it constitutes an electronic timepiece in which this conductive spring is used for transferring a buzzer signal. Furthermore it constitutes a conductive part comprising this conductive spring and a housing which retains the conductive spring.

Abstract: The invention relates to an ultrasonic motor, an electronic timepiece, and an electronic apparatus, which includes an ultrasonic rotor formed from a base resin of thermoplastic resin. Moreover, the invention includes an ultrasonic rotor which contacts with an ultrasonic stator under pressure, the ultrasonic rotor being formed from a filler containing resin. Alternatively an electronic timepiece with the ultrasonic motor is constructed. Furthermore, an electronic apparatus with the ultrasonic motor which is constructed.

Abstract: The invention relates to a timepiece which has a resin bearing section. Moreover, the invention relates to a wheel train apparatus which has a resin bearing section. The invention is constituted by the timepiece provided with a gear wheel and supporting members which support the gear wheel, the supporting members being formed from a filler containing resin. Alternatively the invention is constituted by the wheel train apparatus provided with a gear wheel and supporting members which support the gear wheel, the supporting members being formed from a filler containing resin.

Abstract: A radio wave absorber is provided which can be produced at a low cost compared to the case of using silicon carbide fiber and which is also superior in radio wave absorption property in 76 GHz band (75-77 GHz frequency band). The radio wave absorber is produced by arranging a radio wave absorbing layer onto the surface of a metal body. The radio wave absorbing layer is made of a radio wave absorbing material containing silicon carbide powder dispersed in matrix resin. Average particle diameter of the silicon carbide powder is 4-40 ?m. Silicon carbide powder content in the radio wave absorbing material is 15-45 volume %. Thickness of the radio wave absorbing layer is adjusted so that reflection attenuation of not less than 10 dB is provided in 76 GHz band.

Abstract: A radio wave absorber is provided which can be produced at a low cost compared to the case of using silicon carbide fiber and which is also superior in radio wave absorption property in 76 GHz band (75-77 GHz frequency band). The radio wave absorber is produced by arranging a radio wave absorbing layer onto the surface of a metal body. The radio wave absorbing layer is made of a radio wave absorbing material containing silicon carbide powder dispersed in matrix resin. Average particle diameter of the silicon carbide powder is 4-40 ?m. Silicon carbide powder content in the radio wave absorbing material is 15-45 volume %. Thickness of the radio wave absorbing layer is adjusted so that reflection attenuation of not less than 10 dB is provided in 76 GHz band.

Abstract: In the hydrogen supply device for producing and supplying hydrogen to a fuel cell, a reforming section has a rotary thermal storage through which low and high temperature passages pass. Reforming material is supplied to the low temperature fluid passage on an upstream side of the first rotary thermal storage. A combustion gas supply section for generating and supplying a combustion gas is located in the high temperature fluid passage on a downstream side of the first rotary thermal storage. With the hydrogen supply device mentioned above, the first rotary thermal storage rotates to move alternately between the low and high temperature fluid passages so that, in the reforming section, the reforming material flowing in the low temperature fluid passage is catalytically reformed to a reformed gas containing hydrogen upon receiving combustion heat of the combustion gas flowing in the high temperature fluid conduit.

Abstract: A panel for an airbag of an automobile is formed by integrally molding a cover body, which is made of a synthetic resin, with a main body, made of another synthetic resin. The panel includes a joint portion, joined with the cover body, and provided around an opening portion formed in the main body. The joint portion constitutes an overlapping portion in which an outer peripheral edge of the cover body is overlapped as being arranged on the inner side of an opening edge of the main body.

Abstract: It is an object of the present invention to provide a composite material having low thermal expansivity, high thermal conductivity, and good plastic workability, which is applied to semiconductor devices and many other uses. The composite material is composed of metal and inorganic particles having a smaller coefficient of thermal expansion than said metal. It is characterized in that said inorganic particles disperse in such a way that 95% or more of them (in terms of their area in cross-section) form aggregates of complex configuration joining together. The composite material contains 20-80 vol % of copper oxide, with the remainder being copper. It has a coefficient of thermal expansion of 5×10−6 to 14×10−6/° C. and thermal conductivity of 30-325 W/m·K in the range of room temperature to 300° C. It is suitable for the radiator plate of semiconductor devices and the dielectric plate of electrostatic attractors.

Abstract: Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied.

Abstract: Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This composite material comprises a metal and an inorganic compound formed to have a dendritic shape or a bar shape. In particular, this composite material is a copper composite material, which comprises 10 to 55 vol. % cuprous oxide (Cu2O) and the balance of copper (Cu) and incidental impurities and has a coefficient of thermal expansion in a temperature range from a room temperature to 300° C. of from 5×10−6 to 17×10−6/° C. and a thermal conductivity of 100 to 380 W/m·k. This composite material can be produced by a process comprising the steps of melting, casting and working and is applied to a heat-radiating board of a semiconductor article.

Abstract: To provide a composite material member for semiconductor device, an insulated semiconductor device and non-insulated semiconductor device using the composite material member, which are effective for obtaining a semiconductor device that alleviates thermal stress or thermal strain occurring during production or operation, has no possibilities of deformation, degeneration and rupture of each member, and is highly reliably and inexpensive. The composite material member for semiconductor device is characterized by being a composite metal plate with particles composed of cuprous oxide dispersed in a copper matrix, in which a surface of the composite metal plate is covered with a metal layer, and a copper layer with thickness of 0.5 &mgr;m or larger exists in an interface formed by the composite metal plate and the metal layer.

Abstract: Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This composite material comprises a metal and an inorganic compound formed to have a dendritic shape or a bar shape. In particular, this composite material is a copper composite material, which comprises 10 to 55 vol. % cuprous oxide (Cu2O) and the balance of copper (Cu) and incidental impurities and has a coefficient of thermal expansion in a temperature range from a room temperature to 300° C. of from 5×10−6 to 17×10−6/° C. and a thermal conductivity of 100 to 380 W/m·k. This composite material can be produced by a process comprising the steps of melting, casting and working and is applied to a heat-radiating board of a semiconductor article.