Abstract: An acidic or basic hydrogen peroxide cleaning fluid for cleaning a semiconductor substrate, comprising a phosphonic acid chelating agent and a wetting agent, or comprising a wetting agent alone.

Abstract: A process for purification of hydrogen peroxide is provided which comprises contacting an aqueous hydrogen peroxide solution with a chelate resin. According to the process, it is possible to remove impurities in the aqueous hydrogen peroxide solution in high efficiency, and particularly, it is possible to remove iron, aluminum, etc., which are difficult to remove singly by ion exchange resins, up to extremely low concentrations. Highly pure hydrogen peroxide solutions obtained by this invention can suitably used for washing of silicon wafers.

Abstract: A food-preserving agent comprising an oxygen absorbent and a compound represented by the following structural formula (I): ##STR1## , wherein n is an integer of 2 to 4 and X is H or CH.sub.3, can remove generated acetaldehyde effective, thereby preserving food without any fear of disagreeable odor for a long duration.

Abstract: In cleaning a semiconductor substrate with a basic aqueous solution of hydrogen peroxide, it is an object to prevent metal impurities adhering to the substrate surface. A cleaning solution of a semiconductor substrate which comprises a basic aqueous solution of a hydrogen peroxide containing a chelating agent having at least two phosphonic acid groups. Preferred chelating agent is 1,2-propylenediamine tetra(methylene phosphonic acid) in amount of 1 ppb to 1000 ppm, together with 0.1 to 20% by weight of hydrogen peroxide and, optionally, 0.1 to 10% by weight of ammonia. Even if the cleaning solution is contaminated with metal impurities, characteristics of semiconductor elements prepared from a substrate are stabilized since no metal impurities adhere on the substrate surface.

Abstract: The present invention relates to novel oxygen absorbent comprising as main ingredients a 1,2-glycol, glycerine or sugar alcohol with the oxygen absorbent materials.

Abstract: There are disclosed an oxygen absorbent comprising boron or a reducing boron compound, an alkaline substance and a carrier, an oxygen absorbent parcel formed by enclosing said oxygen absorbent in a permeable packaging parcel, a food package and a package of a metallic or electronic product or part containing said oxygen absorbent parcel.

Abstract: A method for purifying an impure aqueous hydrogen peroxide solution, which comprises passing an impure aqueous hydrogen peroxide solution through(a) a cation exchange resin layer, a halogen-containing porous resin layer and an anion exchange resin layer in this order, or(b) a halogen-containing porous resin layer, a cation exchange resin layer and an anion exchange resin layer in this order, or(c) a halogen-containing porous resin layer and a cation/anion mixed-bed resin layer in this order to contact said solution with each resin.

Abstract: A method of removing organic impurities from an aqueous solution of hydrogen peroxide, which comprises bringing an aqueous solution of hydrogen peroxide containing organic impurities into contact with a halogen-containing porous resin having a true specific gravity in the wet state of 1.1 to 1.3.