Abstract: It is an object of the present invention to provide a photo-curable resin composition which provides a sealing agent for a flat panel display with good moisture permeation resistance and excellent adhesion. The present inventors have conducted extensive studies to solve the above-described problems, and as a result, they have found a photo-curable resin composition which comprises a cationic photopolymerization initiator (A), a cationically polymerizable compound (B), a cyclic polyether compound (C) and another organic compound (D), wherein the amount of (B) is 1.0 to 99.9% by mass and the amount of (C) is 0.0 to 10.0% by mass, both based on the sum of (B), (C) and (D), and the sum (F) of the fluorine atoms in a fluorine-containing organic compound is 0.0 to 40.0% by mass, based on the sum of (B), (C) and (D), and wherein at least 1/1000 mass ratio of the (B) component is a compound containing an oxetanyl group, and both of the contents of (C) and (F) are not 0.0% by mass at the same time.

Abstract: An injection mold includes a sliding member having a partial cavity surface which forms part of a cavity surface, and an adjacent member having a partial cavity surface which forms part of the cavity surface. A sliding surface of the sliding member is guided by a sliding surface of the adjacent member and is linearly movable by a relative sliding distance. A portion from the partial cavity surface to the sliding surface of at least one of the sliding member and adjacent member is continuously coated with a heat insulating coat, and a range over which the sliding surface is coated with the heat insulating coat is so set as to exceed an end of the relative sliding distance, where an edge of the partial cavity surface of the adjacent member contacts with the sliding surface of the sliding member.

Abstract: A lead-free organic sealant with which sealing can be carried out at a temperature lower than 400° C., and which is excellent in strength at high temperature. Specifically, an organic sealant for sealing envelope-constituting members to constitute a vacuum envelope for an image display device, wherein a fired body of the organic sealant has a minimum viscosity of at most 103 Pa•s within a temperature range of at least 300° C. and lower than 400° C., and the fired body of the organic sealant satisfies 0.99<m400/m20?1.00, where m20 is the mass at 20° C., and m400 is the mass at 400° C.

Abstract: A photocurable resin composition comprises a cationic polymerizable compound (A), an acrylic resin (B) and a cationic photopolymerization initiator (C), in which the acrylic resin (B) has a cationic polymerizable functional group, and the content of the component (A) is 30 to 95 parts by mass and the content of the component (B) is 5 to 70 parts by mass, based on 100 parts by mass of the total amount of the components (A) and (B). In addition, the functional group of the acrylic resin (B) preferably contains at least one of a cyclic ether group, a vinyloxy group, an acid adduct of a vinyloxy group, and an active hydrogen group, with the active hydrogen group preferably being a hydroxyl group. The photocurable resin composition has sufficient curability and sufficient adhesiveness to rigid plastics such as polycarbonate and PET having poor adhesive property.

Abstract: A liquid crystal sealing agent composition that is a one-component light and heat-curable resin composition containing: (1) a solid epoxy resin having a ring and ball method softening temperature of 40° C. or above; (2) an acrylate monomer and/or a methacrylate monomer, or an oligomer thereof; (3) a thermoplastic polymer having a ring and ball method softening temperature of 50 to 120° C., the thermoplastic polymer being obtained by copolymerizing an acrylate monomer and/or a methacrylate monomer with a monomer copolymerizable therewith; (4) a light-activated radical polymerization initiator; and (5) a latent epoxy curing agent.

Abstract: Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and connection reliability at high temperatures and high humidity, and the ability to be repaired. The paste for circuit connection contains an epoxy resin, an acid anhydride curing agent or a phenolic curing agent, and high-softening point fine particles. The anisotropic conductive paste additionally contains conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste involves connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste.

Abstract: This invention aims at preventing a peeling phenomenon occurring on the surface of a foamed product. In order to achieve this object, an injection-molded product formed in accordance with injection molding by mixing a foaming agent in a molding resin material, is formed by molding using a mold having a heat insulating material on a surface of its cavity forward in a moving direction of a portion where the molding resin material molten and injected for forming the molded product has an injection speed of at least 1.5 m/sec to 2,000 m/sec in the cavity of the mold.

Abstract: It is an object of this invention to provide an injection mold having high durability because a heat insulating coat with which at least one of a sliding member and an adjacent member for guiding the sliding member is coated has a high peeling resistance. To achieve this object, the injection mold has an adjacent member and sliding member adjacent to each other. A sliding surface of the sliding member is slidably guided by a sliding surface of the adjacent member such that a partial cavity surface of the sliding member protrudes into the cavity by a relative sliding distance from the state in which this partial cavity surface is leveled with that partial cavity surface of the adjacent member, which forms part of the cavity surface. A portion from the partial cavity surface to the sliding surface of the sliding member is continuously coated with a heat insulating coat. The range over which the sliding surface is coated with the heat insulating coat is so set as to exceed the relative sliding distance.

Abstract: Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and connection reliability at high temperatures and high humidity, and the ability to be repaired. The paste for circuit connection contains an epoxy resin, an acid anhydride curing agent or a phenolic curing agent, and high-softening point fine particles. The anisotropic conductive paste additionally contains conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste involves connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste.

Abstract: A photo-curable resin composition for sealing material, which is superior in the photo-curing performance and in the prompt curing property and is better in the adhesive property, in the resistance to moisture permeation and in the heat resistance, the photo-curable resin composition comprising (A) a compound having oxetane ring, (B) a photoinitiator for cationic polymerization and (C) a silane coupling agent, wherein the composition has a viscosity in the range from 0.01 to 300 Pa.s at 25° C.

Abstract: The photocationic-curable resin composition of the invention comprises (A) a cationic-polymerizable compound, (B) a photocationic initiator and (C) an aromatic ether compound or an aliphatic thioether compound. The photocationic-curable resin composition has excellent conversion (curability) at low temperatures, and its cured product exhibits excellent adhesive strength and moisture permeation resistance. According to the sealing material comprising the composition, a liquid crystal display or an electroluminescent display having excellent adhesive strength and moisture permeation resistance can be provided with high productivity.