Abstract: A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package includes a substrate. The substrate includes a first recess including a first bottom surface on which a light emitter is mountable, and a first step surface having a first connection pad thereon, a second recess including a second bottom surface on which a light receiver is mountable, and a second step surface having a second connection pad thereon. In a direction connecting a center of the first bottom surface and a center of the second bottom surface in a plan view, the first step surface is located outward from the first bottom surface and the second step surface is located outward from the second bottom surface.

Abstract: A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package (1) includes a substrate (2), a lid (3), and a ground conductor layer (4). The substrate (2) contains a light emitter and a light receiver, and includes a substrate body (20), a plurality of ground via conductors (21), an frame-shaped ground conductor layer (22), signal wiring conductors (23), and an external connection terminal (24). The ground via conductors (21) are connectable to a ground potential, and are located outward from a first recess (20a) and a second recess (20b) included in the substrate body (20) in a plan view.

Abstract: A measurement sensor package and a measurement sensor improve reliability in strength and other aspects. A measurement sensor package includes a substrate, a lid, a ground conductor layer, a metallic thin layer, and a bond. The ground conductor layer and the metallic thin layer are arranged inside the bond that extends continuously as viewed through from above. The bond directly bonds a first main surface of a substrate body and a facing surface of the lid together along the entire periphery. This improves the reliability in strength.

Abstract: A measurement sensor package and a measurement sensor improve reliability in strength and other aspects. A measurement sensor package includes a substrate, a lid, a ground conductor layer, a metallic thin layer, and a bond. The ground conductor layer and the metallic thin layer are arranged inside the bond that extends continuously as viewed through from above. The bond directly bonds a first main surface of a substrate body and a facing surface of the lid together along the entire periphery. This improves the reliability in strength.

Abstract: A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package includes a substrate. The substrate includes a first recess including a first bottom surface on which a light emitter is mountable, and a first step surface having a first connection pad thereon, a second recess including a second bottom surface on which a light receiver is mountable, and a second step surface having a second connection pad thereon. In a direction connecting a center of the first bottom surface and a center of the second bottom surface in a plan view, the first step surface is located outward from the first bottom surface and the second step surface is located outward from the second bottom surface.

Abstract: A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package (1) includes a substrate (2), a lid (3), and a ground conductor layer (4). The substrate (2) contains a light emitter and a light receiver, and includes a substrate body (20), a plurality of ground via conductors (21), an frame-shaped ground conductor layer (22), signal wiring conductors (23), and an external connection terminal (24). The ground via conductors (21) are connectable to a ground potential, and are located outward from a first recess (20a) and a second recess (20b) included in the substrate body (20) in a plan view.