Patents by Inventor Yasushi Takiguchi
Yasushi Takiguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11887869Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.Type: GrantFiled: September 6, 2021Date of Patent: January 30, 2024Assignee: TOKYO ELECTRON LIMITEDInventors: Nobuhiko Mouri, Takanori Obaru, Yasushi Takiguchi, Teruhiko Kodama
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Publication number: 20230381825Abstract: A substrate cleaning apparatus includes a holder configured to hold a substrate; a circular ring-shaped body; grooves formed in a radial shape at an upper portion of the circular ring-shaped body, each groove having a bottom located on the circular ring-shaped body; a sliding surface which is a top surface of the circular ring-shaped body between the respective grooves, and configured to be slid on a bottom surface of the substrate; a supporting body configured to support and rotate the circular ring-shaped body in a circumferential direction; a cleaning liquid supply configured to allow a cleaning liquid to be absorbed into the circular ring-shaped body; and a relatively moving mechanism configured to move the substrate and the supporting body relative to each other in a state that the sliding surface being rotated and having absorbed the cleaning liquid presses the bottom surface of the substrate.Type: ApplicationFiled: May 24, 2023Publication date: November 30, 2023Inventors: Yoshiki Okamoto, Akihiro Kubo, Yasushi Takiguchi
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Patent number: 11554389Abstract: A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively is provided. A contact region of the cleaning member which comes into contact with the surface of the substrate is widened in a radial shape from a center side of the substrate toward a peripheral side thereof.Type: GrantFiled: January 20, 2021Date of Patent: January 17, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Akihiro Kubo, Yasushi Takiguchi, Teruhiko Kodama, Yoshiki Okamoto
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Patent number: 11532487Abstract: A substrate processing apparatus includes a polishing member having a polishing surface configured to perform a polishing of a main surface of a substrate; a first dressing member having a first dressing surface configured to perform a dressing of the polishing surface; a second dressing member having a second dressing surface configured to perform a dressing of the first dressing surface; a holding member configured to hold the polishing member and the second dressing member; and a driving unit configured to, by moving the holding member, switch a first state in which the first dressing surface and the polishing surface come into contact with each other to perform the dressing of the polishing surface and a second state in which the first dressing surface and the second dressing surface come into contact with each other to perform the dressing of the first dressing surface.Type: GrantFiled: May 12, 2020Date of Patent: December 20, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Akihiro Kubo, Yasushi Takiguchi, Teruhiko Kodama, Yoshiki Okamoto, Hayato Hosaka
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Publication number: 20210398827Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.Type: ApplicationFiled: September 6, 2021Publication date: December 23, 2021Inventors: Nobuhiko Mouri, Takanori Obaru, Yasushi Takiguchi, Teruhiko Kodama
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Publication number: 20210308828Abstract: A dressing apparatus includes a bus member which is equipped with a ceiling plate and a circular or polygonal cylindrical skirt portion provided at a bottom surface of the ceiling plate and which is configured to accommodate a polishing pad from thereabove. The bus member includes a dual fluid nozzle configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad; a dress board configured to come into contact with the polishing surface of the polishing pad; and a rinse nozzle configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad and the dress board. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion.Type: ApplicationFiled: June 15, 2021Publication date: October 7, 2021Inventors: Yoshiki Okamoto, Yasushi Takiguchi, Akihiro Kubo, Hayato Hosaka, Ryuto Ozasa
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Patent number: 11139182Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.Type: GrantFiled: December 10, 2018Date of Patent: October 5, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Nobuhiko Mouri, Takanori Obaru, Yasushi Takiguchi, Teruhiko Kodama
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Publication number: 20210220878Abstract: A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively is provided. A contact region of the cleaning member which comes into contact with the surface of the substrate is widened in a radial shape from a center side of the substrate toward a peripheral side thereof.Type: ApplicationFiled: January 20, 2021Publication date: July 22, 2021Inventors: Akihiro Kubo, Yasushi Takiguchi, Teruhiko Kodama, Yoshiki Okamoto
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Patent number: 11059145Abstract: A dressing apparatus 200 includes a bus member 203 which is equipped with a ceiling plate 201 and a circular or polygonal cylindrical skirt portion 202 provided at a bottom surface of the ceiling plate 201 and which is configured to accommodate a polishing pad 131 from thereabove. The bus member 203 includes a dual fluid nozzle 204 configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad 131; a dress board 205 configured to come into contact with the polishing surface of the polishing pad 131; and a rinse nozzle 206 configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad 131 and the dress board 205. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion 202.Type: GrantFiled: August 9, 2018Date of Patent: July 13, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Yoshiki Okamoto, Yasushi Takiguchi, Akihiro Kubo, Hayato Hosaka, Ryuto Ozasa
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Patent number: 11031261Abstract: A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding units arranged side by side in a left-right direction; a nozzle configured to supply the processing fluid to the substrate held in each of the substrate holding units; and a nozzle moving mechanism configured to move the nozzle forward and backward in a front-rear direction intersecting an arrangement direction of the substrate holding units between a supplying position in which the processing fluid is supplied to a region including a central portion of the substrate and a waiting position which is defined at a rear side of a row of the substrate holding units opposite to a front side of the row of the substrate holding units at which the substrate is loaded and unloaded.Type: GrantFiled: June 21, 2018Date of Patent: June 8, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Yasushi Takiguchi, Koki Yoshimura, Taro Yamamoto, Hideharu Kyouda, Koshi Muta
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Publication number: 20210039221Abstract: A substrate warpage correction method according to this disclosure corrects warpage of a substrate without performing a process on a front surface of the substrate. The substrate warpage correction method includes a surface roughening of performing a surface roughening process on a rear surface of the substrate using a surface roughening processing apparatus configured to be able to perform the surface roughening process on the rear surface of the substrate, to form grooves in the rear surface to thereby correct the warpage of the substrate.Type: ApplicationFiled: February 26, 2019Publication date: February 11, 2021Inventors: Nozomu KANETAKE, Akihiro KUBO, Teruhiko KODAMA, Taro YAMAMOTO, Yasushi TAKIGUCHI, Yoshiki OKAMOTO, Hayato HOSAKA
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Publication number: 20200365417Abstract: A substrate processing apparatus includes a polishing member having a polishing surface configured to perform a polishing of a main surface of a substrate; a first dressing member having a first dressing surface configured to perform a dressing of the polishing surface; a second dressing member having a second dressing surface configured to perform a dressing of the first dressing surface; a holding member configured to hold the polishing member and the second dressing member; and a driving unit configured to, by moving the holding member, switch a first state in which the first dressing surface and the polishing surface come into contact with each other to perform the dressing of the polishing surface and a second state in which the first dressing surface and the second dressing surface come into contact with each other to perform the dressing of the first dressing surface.Type: ApplicationFiled: May 12, 2020Publication date: November 19, 2020Inventors: Akihiro Kubo, Yasushi Takiguchi, Teruhiko Kodama, Yoshiki Okamoto, Hayato Hosaka
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Patent number: 10840079Abstract: A substrate processing apparatus includes: a first holding part configured to hold a substrate; a second holding part configured to hold the substrate; a sliding member configured to rotate about a vertical axis so that the sliding member slides on a back surface of the substrate; a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis; and a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on a central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on the peripheral portion of the back surface of the substrate under rotation.Type: GrantFiled: November 28, 2017Date of Patent: November 17, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Yasushi Takiguchi, Taro Yamamoto, Yoshiki Okamoto, Hayato Hosaka, Teruhiko Kodama, Akihiro Kubo, Ryuto Ozasa, Yuji Ariuchi, Shinsuke Kimura
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Patent number: 10649334Abstract: Disclosed is a liquid processing apparatus for performing a liquid processing by supplying a processing liquid from a nozzle to a substrate. The apparatus includes: a cup body provided to surround a substrate holding unit; a nozzle arm provided with a nozzle and supported by a support unit; a moving mechanism configured to move the nozzle arm via the support unit between a stand-by position and a processing position; an elevating mechanism configured to move up and down the support unit; a cover member including a top plate portion provided above a driving region and configured to partition the driving region from a region where the substrate is held within the cup body; an opening formed in a portion corresponding to a moving path of the support unit in the top plate portion; and an exhaust mechanism configured to evacuate the driving region.Type: GrantFiled: August 10, 2018Date of Patent: May 12, 2020Assignee: Tokyo Electron LimitedInventors: Koki Yoshimura, Shogo Takahasi, Yasushi Takiguchi, Taro Yamamoto
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Publication number: 20190181022Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.Type: ApplicationFiled: December 10, 2018Publication date: June 13, 2019Inventors: Nobuhiko Mouri, Takanori Obaru, Yasushi Takiguchi, Teruhiko Kodama
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Patent number: 10289004Abstract: A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.Type: GrantFiled: October 31, 2016Date of Patent: May 14, 2019Assignee: Tokyo Electron LimitedInventors: Kousuke Yoshihara, Hideharu Kyouda, Koshi Muta, Taro Yamamoto, Yasushi Takiguchi
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Publication number: 20190047118Abstract: A dressing apparatus 200 includes a bus member 203 which is equipped with a ceiling plate 201 and a circular or polygonal cylindrical skirt portion 202 provided at a bottom surface of the ceiling plate 201 and which is configured to accommodate a polishing pad 131 from thereabove. The bus member 203 includes a dual fluid nozzle 204 configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad 131; a dress board 205 configured to come into contact with the polishing surface of the polishing pad 131; and a rinse nozzle 206 configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad 131 and the dress board 205. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion 202.Type: ApplicationFiled: August 9, 2018Publication date: February 14, 2019Inventors: Yoshiki Okamoto, Yasushi Takiguchi, Akihiro Kubo, Hayato Hosaka, Ryuto Ozasa
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Publication number: 20190049845Abstract: Disclosed is a liquid processing apparatus for performing a liquid processing by supplying a processing liquid from a nozzle to a substrate. The apparatus includes: a cup body provided to surround a substrate holding unit; a nozzle arm provided with a nozzle and supported by a support unit; a moving mechanism configured to move the nozzle arm via the support unit between a stand-by position and a processing position; an elevating mechanism configured to move up and down the support unit; a cover member including a top plate portion provided above a driving region and configured to partition the driving region from a region where the substrate is held within the cup body; an opening formed in a portion corresponding to a moving path of the support unit in the top plate portion; and an exhaust mechanism configured to evacuate the driving region.Type: ApplicationFiled: August 10, 2018Publication date: February 14, 2019Inventors: Koki Yoshimura, Shogo Takahasi, Yasushi Takiguchi, Taro Yamamoto
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Patent number: 10168618Abstract: A liquid processing method includes: accommodating a substrate horizontally in each of a first processing region and a second processing region, for performing therein a process on the substrate by a processing solution from a nozzle; rotating a rotary body about a vertical axis; keeping a plurality of processing nozzles provided at the rotary body; supplying different kinds of processing solutions to the substrate from the plurality of processing nozzles; holding a processing nozzle selected from the plurality of processing nozzles by a nozzle holder provided at the rotary body; transferring the nozzle holder into selected one of the first and the second processing regions by a nozzle transfer device; and rotating the rotary body by a rotation driving unit so as to allow a front of the nozzle holder in a forward/backward direction thereof to face the selected one of the first and the second processing regions.Type: GrantFiled: October 22, 2015Date of Patent: January 1, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Norihiko Sasagawa, Hiroichi Inada, Yasushi Takiguchi
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Patent number: 10120285Abstract: A developing apparatus including a horizontal substrate holder, a rotating mechanism to rotate the substrate holder, a developer nozzle to supply a developer onto a part of the substrate to form a liquid puddle, a moving mechanism to move the developer nozzle in a radial direction of the rotating substrate, a contact part that moves with the developer nozzle and has a surface opposed to the substrate, which is smaller than the surface of the substrate, and a control unit to output a control signal such that a supply position of the developer on the substrate is moved in the radial direction of the substrate so that the liquid puddle is spread out on a whole surface of the substrate while the contact part is in contact with the liquid puddle.Type: GrantFiled: December 9, 2016Date of Patent: November 6, 2018Assignee: Tokyo Electron LimitedInventors: Kousuke Yoshihara, Hideharu Kyouda, Koshi Muta, Taro Yamamoto, Yasushi Takiguchi, Masahiro Fukuda