Abstract: The transfer chamber transfers a wafer (W) as a transferred object to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) as a chemical filter provided in the midstream of the circulation path (CL), a humidity detector (HG2) as a humidity detection means which detects internal humidity, a gas supply means (NS) which supplies gas to the inside of the transfer chamber (1), and a moisture supply means (HS) which supplies moisture content to the inside of the transfer chamber (1). The moisture supply means (HS) is made to operate in accordance with a humidity detection value by the humidity detection means.

Abstract: A door opening/closing system includes: a base as part of a wall isolating a conveyance space from an external space; an opening portion provided in the base; a door configured to open/close the opening portion; a first seal member which seals a gap between the base and a container; a second seal member which seals a gap between the base and the door; a sealed space constituted by the base, the first and second seal members, a lid member, and the door when the container state of contact with the opening portion with the first seal member therebetween; a first gas injection unit which injects gas into the sealed space; and a second gas discharge unit which evacuates the sealed space. The door opening/closing system prevents entry of atmospheric air into a front-opening unified pod and an equipment front end module when placed in communication.

Abstract: A load port including: a base as part of a wall partitioning a transportation space from an external space; an opening provided to the base; a door configured to open and close the opening and securing a lid to, and releasing a lid from, a container containing contents; and a first seal member for sealing the space between the base and the container. At least some of the container-side end surface of the door is located nearer to the transportation space than the container-side end part of the first seal member. The load port can keep a surrounding space clean when a FOUP is connected to a casing.

Abstract: A load port including: a base as part of a wall partitioning a transportation space from an external space; an opening provided to the base; a door configured to open and close the opening and securing a lid to, and releasing a lid from, a container containing contents; and a first seal member for sealing the space between the base and the container. At least some of the container-side end surface of the door is located nearer to the transportation space than the container-side end part of the first seal member. The load port can keep a surrounding space clean when a FOUP is connected to a casing.

Abstract: There is provided an exhaust nozzle unit capable of discharging a gas atmosphere in a substrate storage container having a loading/unloading opening from the container to an outside of the container through a port formed on a bottom surface of the container. The exhausted nozzle includes a nozzle capable of switching the port from a closed state to an open state by pressing a valve of the port; and a housing configured to hold the nozzle so as to be movable up and down between a use posture in which the port is in the open state and a standby posture in which the port is in the closed state.

Abstract: There is provided a method for manufacturing semiconductor. The method includes providing a semiconductor manufacturing apparatus and providing an EFEM. The EFEM includes a shield gas curtain apparatus 6 that forms a gas curtain capable of shielding an opening 23 when an internal space 5S of a purge container 5, in which the humidity is reduced to a predetermined value by means of a bottom purge apparatus 25 provided in a load port 2, is brought into communication with an internal space 3S of a wafer transport chamber 3, the gas curtain being formed of a shield curtain gas blown immediately downward from a location near the opening 23 of the load port 2 and being closer to the wafer transport chamber 3 than the opening 23 at a higher height than an upper edge of the opening 23.

Abstract: A purging nozzle unit of a gas supply device according to the present invention including: a housing that is capable of passing a predetermined gas so as to replace the internal atmosphere of a FOUP with the predetermined gas; a nozzle coming into intimate contact with the proximity of a port that is provided on one face of the FOUP, the nozzle being pressed to thereby open the port; an operation adjustment space configured to increase or decrease so as to operate the nozzle between a use posture in which the predetermined gas can be supplied into the target container via the port and a standby posture in which the predetermined gas cannot be supplied into the target container via the port; and a gas introducing part configured to export or import compression air relative to the operation adjustment space to thereby control an operation of the nozzle.

Abstract: There is provided a gas injection device configured to prevent entry of atmospheric air when charging gas into a FOUP. In order to realize such a gas injection device, the gas injection device is structured so as to include: a gas supply port 72 through which inert gas is supplied; a nozzle main body 71 including a gas passage 77 communicating with the gas supply port 72; an opening/closing mechanism 92 configured to close the gas supply port 72; and an opener 96 configured to cause the opening/closing mechanism 92 to open the gas supply port 72 closed by the opening/closing mechanism 92.

Abstract: A load port including: a base as part of a wall partitioning a transportation space from external space; an opening provided to the base; a door configured to open and close the opening and securing a lid to, and releasing a lid from, a container containing contents; and a first seal member for sealing the space between the base and the container. At least some of the container-side end surface of the door is located nearer to the transportation space than the container-side end part of the first seal member. The load port can keep a surrounding space clean when a FOUP is connected to a casing.

Abstract: A door opening/closing system includes: a base as part of a wall isolating a conveyance space from an external space; an opening portion provided in the base; a door configured to open/close the opening portion; a first seal member which seals a gap between the base and a container; a second seal member which seals a gap between the base and the door; a sealed space constituted by the base, the first and second seal members, a lid member, and the door when the container state of contact with the opening portion with the first seal member therebetween; a first gas injection unit which injects gas into the sealed space; and a second gas discharge unit which evacuates the sealed space. The door opening/closing system prevents entry of atmospheric air into a front-opening unified pod and an equipment front end module when placed in communication.

Abstract: The transfer chamber transfers a wafer (W) as a transferred object to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) as a chemical filter provided in the midstream of the circulation path (CL), a humidity detector (HG2) as a humidity detection means which detects internal humidity, a gas supply means (NS) which supplies gas to the inside of the transfer chamber (1), and a moisture supply means (HS) which supplies moisture content to the inside of the transfer chamber (1). The moisture supply means (HS) is made to operate in accordance with a humidity detection value by the humidity detection means.

Abstract: To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter. The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).

Abstract: An EFEM includes a housing 3 that constitutes a wafer transport chamber 9 that is substantially closed by connecting load ports 4 to an opening 31a provided on a wall 31, and connecting a processing apparatus 6; a wafer transport apparatus 2, and transports a wafer between the processing apparatus 6 and the FOUPs 7 mounted on the load ports 4; a gas delivery port 11; a gas suction port 12; a gas feedback path 10; and a FFU 13 that includes a filter 13b that is provided in the gas delivery port 11, and eliminates particles contained in the delivered gas, wherein the gas in the wafer transport chamber 9 is circulated by generating a downward gasflow in the wafer transport chamber 9 and feeding back the gas through the gas feedback path 10.

Abstract: The present invention provides an atmosphere replacement apparatus capable of replacing the atmosphere on the surface of a wafer with a small amount of gas. The apparatus is configured to have a cover capable of facing and covering the wafer to be transported, and a gas supply means that supplies gas having properties different from a surrounding atmosphere from the cover, and replaces the atmosphere on the surface of the wafer by the gas.

Abstract: An EFEM includes a housing 3 that constitutes a wafer transport chamber 9 that is substantially closed by connecting load ports 4 to an opening 31a provided on a wall 31, and connecting a processing apparatus 6; a wafer transport apparatus 2, and transports a wafer between the processing apparatus 6 and the FOUPs 7 mounted on the load ports 4; a gas delivery port 11; a gas suction port 12; a gas feedback path 10; and a FFU 13 that includes a filter 13b that is provided in the gas delivery port 11, and eliminates particles contained in the delivered gas, wherein the gas in the wafer transport chamber 9 is circulated by generating a downward gasflow in the wafer transport chamber 9 and feeding back the gas through the gas feedback path 10.

Abstract: The present invention provides an atmosphere replacement apparatus capable of replacing the atmosphere on the surface of a wafer with a small amount of gas. The apparatus is configured to have a cover capable of facing and covering the wafer to be transported, and a gas supply means that supplies gas having properties different from a surrounding atmosphere from the cover, and replaces the atmosphere on the surface of the wafer by the gas.

Abstract: There is provided an EFEM that includes a shield gas curtain apparatus 6 that forms a gas curtain capable of shielding an opening 23 when an internal space 5S of a purge container 5, in which the humidity is reduced to a predetermined value by means of a bottom purge apparatus 25 provided in a load port 2, is brought into communication with an internal space 3S of a wafer transport chamber 3, the gas curtain being formed of a shield curtain gas blown immediately downward from a location near the opening 23 of the load port 2 and being closer to the wafer transport chamber 3 than the opening 23 at a higher height than an upper edge of the opening 23. The EFEM thus configured can prevent and suppress a rapid increase in the humidity in the purge container, in which the humidity in the interior space is reduced by performing the bottom purging, occurring immediately after a lid of the purge container is opened, so that quality degradation due to the moisture adhered on a wafer can be avoided.

Abstract: A load port including a frame having an opening, a vessel receiving table that receives the wafer vessel, a door removably attached to the opening, a door opening and closing mechanism that opens and closes the door, and a closing mechanism that exerts force on the door when the door opening and closing mechanism closes the door.

Abstract: A load port including a frame having an opening, a vessel receiving table that receives the wafer vessel, a door removably attached to the opening, a door opening and closing mechanism that opens and closes the door, and a closing mechanism that exerts force on the door when the door opening and closing mechanism closes the door.

Abstract: A transportation apparatus operable to linearly transport an object includes a first transmission unit provided in a first intermediate table and which is operable to transmit torque from one of a pair of first links to one of a pair of second links. The transmission unit includes a pair of pulleys supported by a pair of first intermediate shafts and fixed to the one of the first links and the one of the second links; and an upper belt and lower belt are partially wound around the pulley in opposite directions with each other and fixed to the pulleys so as to transmit the torque. One of the pulley is divided into an upper part fixed with the upper belt and a lower fixed with the lower belt in an axial direction of the first intermediate shafts.