Patents by Inventor Yasutomi Asai

Yasutomi Asai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layered substrate
    Patent number: 5731067
    Abstract: A multi-layered substrate capable of lowering transient and steady heat resistances. A metal serving as a heat conductor having good heat conducting property is fitted in the uppermost insulating layer, and a power element is disposed on the fitted metal. The heat generated by the power element is conducted to the metal in the uppermost insulating layer and is radiated. The metal can be composed of a mixture of molybdenum particles or tungsten particle having a high melting point and aluminum particles.
    Type: Grant
    Filed: June 7, 1996
    Date of Patent: March 24, 1998
    Assignee: Denso Corporation
    Inventors: Yasutomi Asai, Takashi Nagasaka