Abstract: A method and an apparatus process a substrate to divide a mother substrate into unit substrates. The apparatus is provided with a scribing portion for drawing a scribe line on a mother substrate, a breaking portion for breaking a mother substrate along the formed scribe line, and a portion for conveying a substrate for conveying a mother substrate or a unit substrate at least between the above described respective portions, wherein portion for conveying a substrate has a number of rotational supports and with a suction surface for sucking and holding each substrate from a main surface, rotational supports and have rotational axes, as well as suction members for respectively sucking and rotating a substrate which rotates substrates around rotational axes approximately simultaneously in such a manner that at least two main surfaces of each substrate are turned over in the upward and downward direction.

Abstract: A substrate cutting system which requires a small footprint area so as to be compact, and also which is capable of efficiently cutting a substrate is disclosed. A pair of substrate cutting devices are provided in a cutting device guide body 30 so as to be movable along a direction perpendicular to the moving direction of the clamp devices 50, the pair of substrate cutting devices cutting the mother substrate from each of the top surface and the bottom surface of the mother substrate which is clamped by the clamp devices 50.

Abstract: A method and an apparatus process a substrate to divide a mother substrate into unit substrates. The apparatus is provided with a scribing portion for drawing a scribe line on a mother substrate, a breaking portion for breaking a mother substrate along the formed scribe line, and a portion for conveying a substrate for conveying a mother substrate or a unit substrate at least between the above described respective portions, wherein portion for conveying a substrate has a number of rotational supports and with a suction surface for sucking and holding each substrate from a main surface, rotational supports and have rotational axes, as well as suction members for respectively sucking and rotating a substrate which rotates substrates around rotational axes approximately simultaneously in such a manner that at least two main surfaces of each substrate are turned over in the upward and downward direction.

Abstract: A clamping device (50) is installed on a stand (10) with a hollow rectangular parallelepiped shape such that at least one place at a side edge portion of a mother board transported in the stand (10) is clamped. A pair of substrate-cutting devices for cutting the mother substrate, clamped by the clamping device (50), from its upper face and lower face is provided on a scribing device guide body (30). The scribing device guide body (30) is reciprocally movable along one side of the hollow rectangular parallelepiped. The pair of substrate-cutting devices is installed so as to be movable along the direction perpendicular to the movement direction of the scribing device guide body (30). The mother substrate clamped by the clamping device is supported by a substrate-supporting device (20).

Abstract: A method for processing a substrate and an apparatus for processing a substrate are provided, where a substrate can be prevented from being damaged during conveyance of the substrate, including turning over of the substrate, and the apparatus for processing a substrate having this mechanism for conveying a substrate is miniaturized, so that the area for installment can be reduced.

Abstract: The objective of the present invention is to provide a substrate cutting system which requires a small footprint area so as to be compact, and also which is capable of efficiently cutting a substrate. Clamp devices 50 are attached to the substrate cutting system. The clamp devices can hold at least one part of a side edge of the mother substrate to be carried-in a mounting base 10 in a hollow rectangular parallelepiped and reciprocate along one side of the mounting base 10 in a hollow rectangular parallelepiped. A pair of substrate cutting devices are provided in a cutting device guide body 30 so as to be movable along a direction perpendicular to the moving direction of the clamp devices 50, the pair of substrate cutting devices cutting the mother substrate from each of the top surface and the bottom surface of the mother substrate which is clamped by the clamp devices 50.

Abstract: The objective of the present invention is to make an entire system compact and provide a substrate cutting system capable of efficiently cutting a variety of substrates. A substrate cutting system according to the present invention includes: pair of scribing line forming means arranged facing each other; pair of scribing devices for supporting the pair of scribing forming line means such that one of the pair of scribing forming line means moves on a first surface of a substrate in an X axial direction and the other of the pair of scribing forming means moves on a second surface of the substrate in the X axial direction; a scribing device guide body for supporting the pair of scribing devices such that the pair of scribing devices moves in a Y axial direction; and a substrate supporting means for supporting the substrate in an X-Y plane such that the pair of scribing forming line means scribes the first surface of the substrate and the second surface of the substrate.

Abstract: A clamping device (50) is installed on a stand (10) with a hollow rectangular parallelepiped shape such that at least one place at a side edge portion of a mother board transported in the stand (10) is clamped. A pair of substrate-cutting devices for cutting the mother substrate, clamped by the clamping device (50), from its upper face and lower face is provided on a scribing device guide body (30). The scribing device guide body (30) is reciprocally movable along one side of the hollow rectangular parallelepiped. The pair of substrate-cutting devices is installed so as to be movable along the direction perpendicular to the movement direction of the scribing device guide body (30). The mother substrate clamped by the clamping device is supported by a substrate-supporting device (20).

Abstract: A cutting apparatus 400 has a first cutting device 410 located so as to face a first substrate and a second cutting device 420 located so as to face the second substrate. A cutting unit 411 includes a cutter wheel 412 for forming scribing lines on the first substrate and a breaking roller 416 which let the scribing lines penetrate through the thickness direction of the first substrate. The second cutting device 430 also includes a cutter wheel 412 for forming scribing lines on the second substrate and a breaking roller 416 which let the scribing lines penetrate through the thickness direction of the second substrate. The first cutting device 410 includes a back up roller 414 which opposes the breaking roller 416 of the second cutting device 430 and is pressed onto a surface of the first substrate. The second cutting device 430 also has a similar back up roller.