Patents by Inventor Yasuyoshi Ohno

Yasuyoshi Ohno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method of semiconductor device
    Patent number: 8198187
    Abstract: Disclosed is a method of manufacturing a semiconductor device that does not have a defect, such as wire breakage, due to an uplifted portion created at a rewiring pattern in a multilayer wire structure. Before a wiring layer is formed on an insulation layer, the insulation layer is exposed via a mask. The mask has a weak exposure part and a strong exposure part. The mask is positioned such that the weak exposure part corresponds to an arrangement position of a wire line of an underlying wiring layer, and such that the strong exposure part corresponds to an arrangement position of a via part of the underlying wiring layer. The underlying wiring layer is a layer immediately below the insulation layer.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: June 12, 2012
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Yasuyoshi Ohno
  • Manufacturing method of semiconductor device
    Publication number: 20100221908
    Abstract: Disclosed is a method of manufacturing a semiconductor device that does not have a defect, such as wire breakage, due to an uplifted portion created at a rewiring pattern in a multilayer wire structure. Before a wiring layer is formed on an insulation layer, the insulation layer is exposed via a mask. The mask has a weak exposure part and a strong exposure part. The mask is positioned such that the weak exposure part corresponds to an arrangement position of a wire line of an underlying wiring layer, and such that the strong exposure part corresponds to an arrangement position of a via part of the underlying wiring layer. The underlying wiring layer is a layer immediately below the insulation layer.
    Type: Application
    Filed: February 26, 2010
    Publication date: September 2, 2010
    Applicant: OKI SEMICONDUCTOR CO., LTD.
    Inventor: Yasuyoshi Ohno