Patents by Inventor Yasuyuki Komachi

Yasuyuki Komachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming pin-form wires and the like
    Patent number: 6581283
    Abstract: A method for forming pin-form wires or bumps on, for instance, an electrode pad of an electronic circuit element, in which a ball is formed on a tip end of a wire that passes through a capillary, the wire is then extended from the lower end of the capillary, a notch is formed in the portion of the wire between the ball and the capillary by a cutter, the ball is bonded to the electrode pad using the capillary, and the capillary is raised, thus pulling the wire and cutting the wire at the notch to form a pin-form wire or bump on the electrode pad.
    Type: Grant
    Filed: December 4, 2000
    Date of Patent: June 24, 2003
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Kazuo Sugiura, Hirofumi Moroe, Fumihiko Kato, Yasuyuki Komachi
  • Bent wire forming method
    Patent number: 6564453
    Abstract: So as to obtain a pin-form wire having a stable high-quality shape without being affected by the back tension in a bonding wire, a capillary of the bonding apparatus, with the formed pin-form wire inside the capillary, is move along a curved path has a shape of a bent wire to be formed after forming the pin-form wire by a wire bonding apparatus.
    Type: Grant
    Filed: March 21, 2001
    Date of Patent: May 20, 2003
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Hideaki Tamai, Yasuyuki Komachi
  • Bent wire forming method
    Publication number: 20010023534
    Abstract: So as to obtain a stable high-quality shape without being affected by the back tension in a bonding wire, after forming a pin-form wire by a wire bonding apparatus, a capillary of the bonding apparatus, with the formed pin-form wire inside the capillary, is moved along a curved path that has a shape of a bent wire to be formed.
    Type: Application
    Filed: March 21, 2001
    Publication date: September 27, 2001
    Applicant: KABUSHIKI KAISHA SHINKAWA
    Inventors: Hideaki Tamai, Yasuyuki Komachi
  • Method for forming pin-form wires and the like
    Publication number: 20010002607
    Abstract: A method for forming pin-form wires or bumps on, for instance, an electrode pad of an electronic circuit element, in which a ball is formed on a tip end of a wire that passes through a capillary, the wire is then extended from the lower end of the capillary, a notch is formed in the portion of the wire between the ball and the capillary by a cutter, the ball is bonded to the electrode pad using the capillary, and the capillary is raised, thus pulling the wire and cutting the wire at the notch to form a pin-form wire or bump on the electrode pad.
    Type: Application
    Filed: December 4, 2000
    Publication date: June 7, 2001
    Inventors: Kazuo Sugiura, Hirofumi Moroe, Fumihiko Kato, Yasuyuki Komachi