Abstract: A heat-transfer member (1) is used in a cooling system in which an alcohol serves as a coolant. The heat-transfer member (1) has: a heat-receiving surface (11) configured such that it can receive heat from a heat-generating body; and a heat-dissipating surface (12) configured such that it can dissipate, to the coolant, the heat received at the heat-receiving surface (11). The heat-dissipating surface (12) has a plurality of pores (121) whose average pore diameter is 5 nm or more and 1,000 nm or less. A cooling system can be configured by causing the coolant to contact the heat-dissipating surface (12) of the heat-transfer member (1).

Abstract: This invention has its aim in providing a hydrogen heat exchanger for a hydrogen filling system which is of a small size and has high heat transfer performance. The hydrogen filling system, in which a hydrogen tank (8) in a hydrogen fuel-cell automobile (7) is filled with pressurized hydrogen from a hydraulic accumulator (5), has a precooling apparatus (11) equipped with a heat exchanger (12) for cooling hydrogen to be filled. In the heat exchanger (12), the supply pressure in the hydrogen supplying channel (13) is substantially as high as the pressure in the coolant supplying channel (14). This allows the pipe wall of the intermediate pipe between both supplying channels to be thinner than in prior arts. Owing to this, heat transfer resistance and hydrogen pressure loss decrease, improving heat transfer performance and allowing the apparatus to be constituted in a small scale.

Abstract: An IC device to be inspected is received in a chamber, and an IC tester Judges performance of the IC device. An electrical connection device is arranged outside the chamber and has a conductive passage electrically connecting between the IC tester and the IC device. An IC socket is retained on the electrical connection device, for having the IC device inserted therein. A magnetometric sensor is arranged close to the conductive passage of the electrical connection device, for detecting a magnetic field generated when electric current is supplied to the IC device. A temperature control device controls a temperature of the IC device. A control unit controls the temperature control device based on a signal delivered from the magnetometric sensor, to maintain the temperature of the IC device within a predetermined temperature range.