Patents by Inventor Yasuyuki Tochigi

Yasuyuki Tochigi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11725883
    Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: August 15, 2023
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Yasuyuki Tochigi, Masahiro Meguro, Hiroshi Sakai, Kenya Kawabata
  • Publication number: 20230102800
    Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.
    Type: Application
    Filed: October 28, 2022
    Publication date: March 30, 2023
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yasuyuki TOCHIGI, Masahiro MEGURO, Hiroshi SAKAI, Kenya KAWABATA
  • Patent number: 11543189
    Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: January 3, 2023
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Yasuyuki Tochigi, Masahiro Meguro, Hiroshi Sakai, Kenya Kawabata
  • Patent number: 11287192
    Abstract: Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that are thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate, and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: March 29, 2022
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yasuyuki Tochigi, Hung Wei Tseng, Kuang Yu Chu, Masahiro Meguro, Kenya Kawabata
  • Publication number: 20200355443
    Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.
    Type: Application
    Filed: July 21, 2020
    Publication date: November 12, 2020
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yasuyuki TOCHIGI, Masahiro MEGURO, Hiroshi SAKAI, Kenya KAWABATA
  • Publication number: 20180283797
    Abstract: Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that are thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate, and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other.
    Type: Application
    Filed: October 4, 2016
    Publication date: October 4, 2018
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yasuyuki Tochigi, Hung Wei Tseng, Kuang Yu Chu, Masahiro Meguro, Kenya Kawabata