Patents by Inventor Yasuyuki Tokunaga

Yasuyuki Tokunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020181147
    Abstract: A pressure sensitive adhesive label for a hard disk drive includes a substrate, an information indicator formed on one side of the substrate, and a pressure sensitive adhesive layer formed on the other side of the substrate. By applying onto the outer surface of a housing of a hard disk drive, the pressure sensitive adhesive label can reduce noise caused by operation of the hard disk drive.
    Type: Application
    Filed: December 4, 2001
    Publication date: December 5, 2002
    Inventors: Yasuyuki Tokunaga, Naoyuki Nishiyama, Yasunori Sugihara, Hideyuki Kitai, Masahiro Ohura
  • Patent number: 6440553
    Abstract: A pressure-sensitive adhesive composition, wherein the storage elastic modulus [G′] at room temperature is at least 2×106 dyne/cm2 and the adhesive strength at room temperature is 1 kg/20 mm width or higher. Preferably, a pressure-sensitive adhesive composition comprising a polymer having a polycarbonate structure having a repeating unit represented by the following formula wherein R represents a straight chain or branched hydrocarbon group having from 2 to 20 carbon atoms, a pressure-sensitive adhesive sheet, a sealing material, a reinforcing sheet, and a pressure-sensitive sheet for printing, each having the pressure-sensitive adhesive composition.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: August 27, 2002
    Assignee: Nitto Denko Corporation
    Inventors: Yasuyuki Tokunaga, Masahiko Ando, Takeshi Yamanaka, Waka Hikosaka, Makoto Kojima, Shin-ichi Kouno, Hiroaki Mashiko, Hiroshi Wada, Hiroshi Yamamoto, Yoshikazu Soeda, Naoki Matsuoka, Katsuya Kume, Mitsuo Kuramoto
  • Publication number: 20010021451
    Abstract: A pressure-sensitive adhesive composition, wherein the storage elastic modulus [G′] at room temperature is at least 2×106 dyne/cm2 and the adhesive strength at room temperature is 1 kg/20 mm width or higher.
    Type: Application
    Filed: January 31, 2001
    Publication date: September 13, 2001
    Inventors: Yasuyuki Tokunaga, Masahiko Ando, Takeshi Yamanaka, Waka Hikosaka, Makoto Kojima, Shin-Ichi Kouno, Hiroaki Mashiko, Hiroshi Wada, Hiroshi Yamamoto, Yoshikazu Soeda, Naoki Matsuoka, Katsuya Kume, Mitsuo Kuramoto
  • Patent number: 6218006
    Abstract: A pressure-sensitive adhesive composition, wherein the storage elastic modulus [G′] at room temperature is at least 2×106 dyne/cm2 and the adhesive strength at room temperature is 1 kg/20 mm width or higher. Preferably, a pressure-sensitive adhesive composition comprising a polymer having a polycarbonate structure having a repeating unit represented by the following formula wherein R represents a straight chain or branched hydrocarbon group having from 2 to 20 carbon atoms, a pressure-sensitive adhesive sheet, a sealing material, a reinforcing sheet, and a pressure-sensitive sheet for printing, each having the pressure-sensitive adhesive composition.
    Type: Grant
    Filed: September 15, 1997
    Date of Patent: April 17, 2001
    Assignee: Nitto Denko Corporation
    Inventors: Yasuyuki Tokunaga, Masahiko Ando, Takeshi Yamanaka, Waka Hikosaka, Makoto Kojima, Shin-ichi Kouno, Hiroaki Mashiko, Hiroshi Wada, Hiroshi Yamamoto, Yoshikazu Soeda, Naoki Matsuoka, Katsuya Kume, Mitsuo Kuramoto
  • Patent number: 6093464
    Abstract: A pressure-sensitive adhesive composition with a pressure-sensitive adhesive property and heat resistance comprises a polyester having a polylactone structure as the main chain. A pressure-sensitive adhesive sheet with a releasing property of a peelable liner and containing no silicone can be obtained by using the pressure-sensitive adhesive composition in combination with a polyolefin film without being subjected to a silicone treatment as a peelable liner. When the pressure-sensitive adhesive sheet comprises a base material having formed thereon the layer of the pressure-sensitive adhesive composition and the back side of the base material has a surface composed of a polyolefin, neither a peelable liner nor a silicone treatment is required. The pressure-sensitive adhesive sheet is suitably used for computer instruments etc., because it contains no silicone.
    Type: Grant
    Filed: May 23, 1997
    Date of Patent: July 25, 2000
    Assignee: Nitto Denko Corporation
    Inventors: Yasuyuki Tokunaga, Masahiko Ando, Takeshi Yamanaka, Waka Hikosaka
  • Patent number: 5502085
    Abstract: A photopolymerized acrylic pressure-sensitive adhesive having excellent heat-resistance, an adhesive sheet using the adhesive, and methods for producing the adhesive and the adhesive sheet, are disclosed. The pressure-sensitive adhesive sheet having excellent heat resistance comprising a photopolymerization product of a composition comprising;a) 100 parts by weight of monomers comprising from 70 to 100% by weight of a (meth)acrylic acid alkyl ester having from 2 to 14 carbon atoms in the alkyl moiety, and from 30 to 0% by weight of a monoethylenically unsaturated monomer copolymerizable with the (meth)acrylic acid alkyl ester,b) from 0.02 to 20 parts by weight of a radical chain inhibitor,c) up to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, andd) from 0.01 to 5 parts by weight of a photopolymerization initiator.
    Type: Grant
    Filed: August 1, 1994
    Date of Patent: March 26, 1996
    Assignee: Nitto Denko Corporation
    Inventors: Masahiro Ohura, Takao Yoshikawa, Yasuyuki Tokunaga, Takaaki Moriyama, Tetsuo Inoue
  • Patent number: 5362687
    Abstract: A lead-free frit glaze consisting of, by mole %, 61% or greater SiO.sub.2, 8-10% Al.sub.2 O.sub.3, 0.1-3% CaO, 0.1-2% MgO, 2-5% Li.sub.2 O, 1-4% K.sub.2 O, 2-6% Na.sub.2 O, and 10-15% B.sub.2 O.sub.3. The glaze is applied over the surface of ceramic biscuit base and fired therewith. Although the glaze contains no lead, the lead-free frit glaze provides excellent gloss and excellent quick cooling resistance.
    Type: Grant
    Filed: February 3, 1993
    Date of Patent: November 8, 1994
    Assignee: Narumi China Corporation
    Inventor: Yasuyuki Tokunaga
  • Patent number: 5334447
    Abstract: A foam substrate-attached adhesive sheet or tape comprising a substrate having formed thereon a layer of a pressure-sensitive adhesive, wherein the substrate is a foam elastomer having a breaking elongation of at least 800% and an apparent 800% modulus of from 1.0 to 15 kg/cm.sup.2 in a tensile test of 23.degree. C., and a breaking elongation of at least 400% and an apparent 400% modulus of from 2.0 to 60 kg/cm.sup.2 in a tensile test of -30.degree. C.
    Type: Grant
    Filed: December 3, 1993
    Date of Patent: August 2, 1994
    Assignee: Nitto Denko Corporation
    Inventors: Yoshinao Kitamura, Shinkiti Yamashita, Yasuyuki Tokunaga, Masahiko Ando, Takeshi Yamanaka
  • Patent number: 5334686
    Abstract: A pressure-sensitive adhesive and adhesive sheets using the pressure-sensitive adhesive are disclosed. The pressure-sensitive adhesive comprising (a) from 50 to 84% by weight of an acrylic monomer, (b) from 15 to 28% by weight of an N,N-di-substituted (meth)acrylamide, (c) from 1 to 10% by weight of a monomer having an acid group, and (d) from 0 to 25% by weight of other monomer copolmerizable with the components (a) to (c).
    Type: Grant
    Filed: November 30, 1993
    Date of Patent: August 2, 1994
    Assignee: Nitto Denko Corporation
    Inventors: Masahiko Ando, Takeshi Yamanaka, Yutaka Moroishi, Yasuyuki Tokunaga, Yoshinao Kitamura
  • Patent number: 5279896
    Abstract: A vibration-damping pressure-sensitive adhesive composition containing a crosslinked structure of a copolymer comprising (A) from 75 to 92% by weight of a main monomer comprising an alkyl (meth)acrylate containing from 8 to 12 carbon atoms in the alkyl moiety thereof and (B) from 8 to 25% by weight of a carboxyl-containing monomer whose homopolymer has a glass transition temperature of 50.degree. C. or more, said crosslinked structure having a solvent-insoluble content of 80% by weight or more and a weight loss of 3% by weight or less on heating at 120.degree. C. for 240 hours, and said composition having a T-peel strength of 400 g/20 mm-width or more from a SUS plate and a loss factor of 0.05 or more at 60.degree. C. in the vicinity of 1 kHz as determined by a half-value width method. The composition exhibits satisfactory heat resistance against long-term use in high temperatures as well as satisfactory adhesion to various parts at room temperature.
    Type: Grant
    Filed: November 9, 1992
    Date of Patent: January 18, 1994
    Assignee: Nitto Denko Corporation
    Inventors: Yasuyuki Tokunaga, Yutaka Moroishi, Nobuharu Suzuki
  • Patent number: 4584044
    Abstract: This invention concerns treatment of the heat-fusible materials by use of a fusing agent, according to which a fusing agent capable of producing red hot "embers" by combustion is applied to the surface of a worked object such as a sign formed from a heat-fusible material and worked at a construction site or to the area to be newly worked, and then said fusing agent is ignited and burned so that the combustion heat of the resultantly produced "embers" is directly conducted to the material to be worked to thereby remove the fused material from the worked area or fuse and affix the material to the working area.
    Type: Grant
    Filed: February 11, 1982
    Date of Patent: April 22, 1986
    Assignees: Marusho Kagaku K.K.K., Nihon Sanka Kogo K.K.K.
    Inventors: Yasuyuki Tokunaga, Shozo Fukushima