Patents by Inventor YAU-TZU JANG
YAU-TZU JANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9899587Abstract: A lead frame for an LED package includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes separated first and second connecting surfaces. Top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed, and support and electrically connect with light emitting chips. LED packages can be mounted on the lead frame and electrically connect with each other. The conductive layout of the lead frame further permits installation of a zener diode which can be connected to the LED packages in series or in parallel.Type: GrantFiled: February 16, 2017Date of Patent: February 20, 2018Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: Yau-Tzu Jang, Yu-Liang Huang, Wen-Liang Tseng, Pin-Chuan Chen, Lung-Hsin Chen, Hsing-Fen Lo, Chao-Hsiung Chang, Che-Hsang Huang, Yu-Lun Hsieh
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Publication number: 20170162477Abstract: A lead frame for an LED package includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes separated first and second connecting surfaces. Top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed, and support and electrically connect with light emitting chips. LED packages can be mounted on the lead frame and electrically connect with each other. The conductive layout of the lead frame further permits installation of a zener diode which can be connected to the LED packages in series or in parallel.Type: ApplicationFiled: February 16, 2017Publication date: June 8, 2017Inventors: YAU-TZU JANG, YU-LIANG HUANG, WEN-LIANG TSENG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, HSING-FEN LO, CHAO-HSIUNG CHANG, CHE-HSANG HUANG, YU-LUN HSIEH
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Patent number: 9620692Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.Type: GrantFiled: October 7, 2015Date of Patent: April 11, 2017Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: Yau-Tzu Jang, Yu-Liang Huang, Wen-Liang Tseng, Pin-Chuan Chen, Lung-Hsin Chen, Hsing-Fen Lo, Chao-Hsiung Chang, Che-Hsang Huang, Yu-Lun Hsieh
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Publication number: 20160027983Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.Type: ApplicationFiled: October 7, 2015Publication date: January 28, 2016Inventors: YAU-TZU JANG, YU-LIANG HUANG, WEN-LIANG TSENG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, HSING-FEN LO, CHAO-HSIUNG CHANG, CHE-HSANG HUANG, YU-LUN HSIEH
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Patent number: 9184358Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.Type: GrantFiled: October 22, 2013Date of Patent: November 10, 2015Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: Yau-Tzu Jang, Yu-Liang Huang, Wen-Liang Tseng, Pin-Chuan Chen, Lung-Hsin Chen, Hsing-Fen Lo, Chao-Hsiung Chang, Che-Hsang Huang, Yu-Lun Hsieh
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Publication number: 20150162497Abstract: A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die and the coating layer. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of each of the connecting pins is smaller than that of the conductive sheet. A top surface of each of the connecting pins is lower than that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer.Type: ApplicationFiled: October 27, 2014Publication date: June 11, 2015Inventors: YAU-TZU JANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG, YU-LIANG HUANG
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Publication number: 20150162498Abstract: A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of the connecting pin is smaller than that of the conductive sheet. A top surface of the connecting pin is coplanar with that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer.Type: ApplicationFiled: October 27, 2014Publication date: June 11, 2015Inventors: YAU-TZU JANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG, YU-LIANG HUANG
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Publication number: 20140306240Abstract: An exemplary light emitting diode package includes a substrate, a first electrode and a second electrode embedded in the substrate, and a light emitting chip fixed onto the first electrode by first glue. The first electrode has a first barrier member at a periphery of the first glue and below the light emitting chip. The first barrier member obstructs the first glue from spreading toward a side of the first barrier member away from the first glue and the light emitting chip, whereby a contamination by the first glue to an area of the top surface beside the side of the first barrier of the first electrode away from the first glue and the light emitting chip is prevented.Type: ApplicationFiled: October 24, 2013Publication date: October 16, 2014Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: HOU-TE LIN, YAU-TZU JANG, CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN
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Publication number: 20140175482Abstract: An exemplary LED package includes a base, electrodes formed on the base, an LED chip electrically connecting the electrodes, and a reflecting cup mounted on the base and surrounding the LED chip therein. The reflecting cup includes a bottom surface and an inner surface recessed up from the bottom surface and slantwise oriented towards a top end of the reflecting cup. The reflecting cup is annular. The inner surface includes a reflecting portion slantwise extending from the top surface, and a transition portion extending downwardly from the reflecting portion. The transition portion defines a through hole therein. The reflecting portion defines a reflecting hole therein. An angle ? is defined between the reflecting portion and an imaginary surface parallel to the bottom surface. An angle ? is defined between the reflecting portion and the bottom surface. The angle ? is larger than the angle ?.Type: ApplicationFiled: August 9, 2013Publication date: June 26, 2014Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: YAU-TZU JANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, HSING-FEN LO, WEN-LIANG TSENG, YU-LIANG HUANG
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Publication number: 20140167078Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.Type: ApplicationFiled: October 22, 2013Publication date: June 19, 2014Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: YAU-TZU JANG, YU-LIANG HUANG, WEN-LIANG TSENG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, HSING-FEN LO, CHAO-HSIUNG CHANG, CHE-HSANG HUANG, YU-LUN HSIEH
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Publication number: 20130240928Abstract: An LED package includes an LED light source and an optical lens located over the LED light source. The optical lens includes a top surface, a light reflective lateral surface and a bottom surface receiving the LED light source therein. The top surface includes a reflection surface located in the middle of the top surface and a refraction surface surrounding the reflection surface. The top surface receives light emitted from the LED light source, and the light striking the reflection surface is firstly reflected towards the lateral surface by the reflection surface, secondly reflected towards the refraction surface by the lateral surface, and finally refracted out of the optical lens by the refraction surface.Type: ApplicationFiled: October 23, 2012Publication date: September 19, 2013Inventor: YAU-TZU JANG
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Publication number: 20120313126Abstract: An LED package comprises an encapsulation layer, an LED die and two electrodes. The LED die is capable of emitting a first light beam with a first wavelength, and, respectively, electrically connecting to the two electrodes. The encapsulation layer covers the LED die, and comprises a luminescent conversion element and a light-compensating element. A heat exhaustion of the luminescent conversion element is converse to that of the light-compensating element.Type: ApplicationFiled: February 6, 2012Publication date: December 13, 2012Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventor: YAU-TZU JANG
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Publication number: 20120139002Abstract: An LED package structure comprises a substrate, two electrodes arranged on the substrate, an LED chip arranged on the substrate and electrically connected to the electrodes, an encapsulation covering the LED chip, and a shell surrounding the substrate and the encapsulation. The shell includes walls, of a height which exceeds the thickness of the substrate and so functions as a reflector. A circuit structure connected to the electrodes is arranged on the bottom of the walls.Type: ApplicationFiled: October 7, 2011Publication date: June 7, 2012Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventor: YAU-TZU JANG