Abstract: Provided is a reagent composition for immunophenotyping and MRD monitoring of B lymphoblastic leukemia/lymphoma (B-ALL/LBL). The reagent composition includes a 20-antibody combination. In the present disclosure, the antibody combination, the fluorescent labeling combination for the corresponding antibody, and the result interpretation methods are optimized. It only needs to use 20 kinds of antibodies in a single tube of cells for one sample loading, allowing for comprehensively and efficiently performing subtype typing on B lymphoblastic leukemia/lymphoma. In addition, it enables to predict part of recurrent genetically abnormal B-ALL/LBL and has high sensitivity and specificity for the diagnosis of the subtype of BCR/ABL1 gene. Meanwhile, it enables to determine the leukemia-related immunophenotype (LAIP) for minimal residual disease (MRD) monitoring after treatment by using the combination and used for MRD monitoring and CAR-T post-treatment monitoring.

Abstract: The present disclosure relates to the field of antibody medicine and in particular to an antibody composition for immunotyping of myeloid neoplasms and use thereof, the antibody composition comprising panels of 22-24 antibodies. In the disclosure, combinations of antibodies and corresponding fluorescent labels as well as the method for interpreting the results are optimized, which, with only one tube of 22 or 24 antibodies and one tube of cells at a time, allows for comprehensive and efficient subtyping of acute myeloid leukaemia (AML) and chronic myeloid neoplasms, prediction of CML and part of AML with recurrent genetical abnormalities, and thus a high sensitivity for the diagnosis of myelodysplasia (MDS). It is also possible to identify leukaemia-associated immunophenotypes (LAIP) in this composition that can be used for post-treatment minimal residual disease (MRD) monitoring.

Abstract: A semiconductor device includes: a semiconductor element; a frame which has a first surface, holds the semiconductor element on the first surface, and is electrically connected with the semiconductor element; and a seal which has electrical insulation properties and seals the semiconductor element and the frame, wherein a through-hole is formed in the seal, the through-hole has a hole axis which extends in a direction intersecting with the first surface, and an inner peripheral end surface of the seal exposed inside the through-hole is inclined with respect to the hole axis.

Abstract: A semiconductor device includes: a semiconductor element; a frame which has a first surface, holds the semiconductor element on the first surface, and is electrically connected with the semiconductor element; and a seal which has electrical insulation properties and seals the semiconductor element and the frame, wherein a through-hole is formed in the seal, the through-hole has a hole axis which extends in a direction intersecting with the first surface, and an inner peripheral end surface of the seal exposed inside the through-hole is inclined with respect to the hole axis.

Abstract: A semiconductor device includes: a semiconductor element; a frame which has a first surface, holds the semiconductor element on the first surface, and is electrically connected with the semiconductor element; and a seal which has electrical insulation properties and seals the semiconductor element and the frame, wherein a through-hole is formed in the seal, the through-hole has a hole axis which extends in a direction intersecting with the first surface, and an inner peripheral end surface of the seal exposed inside the through-hole is inclined with respect to the hole axis.

Abstract: A semiconductor device includes a functional block unit, external terminals and, and an external resin sealing body. The functional block unit includes an internal resin sealing body having an edge and an opposite edgeb. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The external resin sealing body covers the root portion and a portion of the middle portion of the external terminal, but does not cover the terminal portion of the external terminal. The functional block unit and the external terminals and are integrally connected together and sealed by the external resin sealing body.

Abstract: A semiconductor device includes a functional block unit, external terminals and, and an external resin sealing body. The functional block unit includes an internal resin sealing body having an edge and an opposite edge. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The external resin sealing body covers the root portion and a portion of the middle portion of the external terminal, but does not cover the terminal portion of the external terminal. The functional block unit and the external terminals and are integrally connected together and sealed by the external resin sealing body.

Abstract: A semiconductor device includes: a semiconductor element; a frame which has a first surface, holds the semiconductor element on the first surface, and is electrically connected with the semiconductor element; and a seal which has electrical insulation properties and seals the semiconductor element and the frame, wherein a through-hole is formed in the seal, the through-hole has a hole axis which extends in a direction intersecting with the first surface, and an inner peripheral end surface of the seal exposed inside the through-hole is inclined with respect to the hole axis.

Abstract: A semiconductor device includes a functional block unit, external terminals and, and an external resin sealing body. The functional block unit includes an internal resin sealing body having an edge and an opposite edgeb. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The external resin sealing body covers the root portion and a portion of the middle portion of the external terminal, but does not cover the terminal portion of the external terminal. The functional block unit and the external terminals and are integrally connected together and sealed by the external resin sealing body.

Abstract: A semiconductor device includes a functional block unit, external terminals and, and an external resin sealing body. The functional block unit includes an internal resin sealing body having an edge and an opposite edge. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The external resin sealing body covers the root portion and a portion of the middle portion of the external terminal, but does not cover the terminal portion of the external terminal. The functional block unit and the external terminals and are integrally connected together and sealed by the external resin sealing body.