Abstract: A proximity sensor module with two sensors, including a package housing, a circuit substrate, an light emitter and a sensing assembly. The package housing includes a first package structure, a second package structure, a partition structure, a first accommodating space defined by the first package structure and the partition structure, and a second accommodation space defined by the second package structure and the partition structure. The light emitter is arranged in the first accommodating space and is disposed on the circuit substrate. The sensing assembly includes a first sensor and a second sensor. The first sensor and the second sensor are arranged in the second accommodating space, and the first sensor is farther from the light emitter than the second sensor.

Abstract: A proximity sensing module with dual transmitters includes a circuit board, a package housing, a sensing assembly and a transmitter unit. The sensing assembly includes a sensor disposed on the circuit board. The transmitter unit is shielded from the sensing assembly through the package housing and includes a first transmitter and a second transmitter both disposed on the circuit board. One of the first transmitter and the second transmitter is closer to the sensing assembly.

Abstract: A proximity sensing module with dual transmitters includes a circuit board, a package housing, a sensing assembly and a transmitter unit. The sensing assembly includes a sensor disposed on the circuit board. The transmitter unit is shielded from the sensing assembly through the package housing and includes a first transmitter and a second transmitter both disposed on the circuit board. One of the first transmitter and the second transmitter is closer to the sensing assembly.

Abstract: A proximity sensor module with two sensors, including a package housing, a circuit substrate, an light emitter and a sensing assembly. The package housing includes a first package structure, a second package structure, a partition structure, a first accommodating space defined by the first package structure and the partition structure, and a second accommodation space defined by the second package structure and the partition structure. The light emitter is arranged in the first accommodating space and is disposed on the circuit substrate. The sensing assembly includes a first sensor and a second sensor. The first sensor and the second sensor are arranged in the second accommodating space, and the first sensor is farther from the light emitter than the second sensor.

Abstract: A proximity sensing module with dual transmitters includes a circuit board, a package housing, a transmitter unit and a sensing assembly. The transmitter unit includes a first transmitter and a second transmitter. The first transmitter and the second transmitter are disposed on the circuit board. The sensing assembly includes a sensor disposed on the circuit board. The transmitter unit is shielded from the sensing assembly through the package housing. One of the first transmitter and the second transmitter is nearer to the sensing assembly than the other one is.

Abstract: A proximity sensing module with dual transmitters includes a circuit board, a package housing, a transmitter unit and a sensing assembly. The transmitter unit includes a first transmitter and a second transmitter. The first transmitter and the second transmitter are disposed on the circuit board. The sensing assembly includes a sensor disposed on the circuit board. The transmitter unit is shielded from the sensing assembly through the package housing. One of the first transmitter and the second transmitter is nearer to the sensing assembly than the other one is.

Abstract: An exemplary embodiment of the present disclosure illustrates a gesture sensing module disposed on a substrate. The gesture sensing module includes at least one light emitting unit, at least one light sensor, and a control circuit. The light emitting unit provides a light to illuminate a sensing area, wherein a central optical axis of the light forms an angle with a normal vector of the substrate, and the angle is not equal to 0. The light sensor senses a reflection light which a target in the sensing area reflects the light, and generate a sensing signal according to the reflection light. The control circuit coupled to the light sensor and the light emitting unit determines a traveling direction of the target according to the sensing signal.

Abstract: An exemplary embodiment of the present disclosure illustrates a gesture sensing module disposed on a substrate. The gesture sensing module includes at least one light emitting unit, at least one light sensor, and a control circuit. The light emitting unit provides a light to illuminate a sensing area, wherein a central optical axis of the light forms an angle with a normal vector of the substrate, and the angle is not equal to 0. The light sensor senses a reflection light which a target in the sensing area reflects the light, and generate a sensing signal according to the reflection light. The control circuit coupled to the light sensor and the light emitting unit determines a traveling direction of the target according to the sensing signal.

Abstract: A stacked photodiode structure comprises a first-conductivity-type substrate, a second-conductivity-type well region and a first-conductivity-type well region. The first-conductivity-type substrate has a first surface for light incidence and a grounding terminal. The second-conductivity-type well region is formed in the first-conductivity-type substrate and adjacent to the first surface. The first-conductivity-type well region is formed in the second-conductivity-type well region and adjacent to the first surface. A PN junction between the first-conductivity-type well region and the second-conductivity-type well region generates free electrons responsive to visible light spectrum. A PN junction between the second-conductivity-type well region and the first-conductivity-type substrate generates free holes and free electrons responsive to mainly IR light.

Abstract: An ambient light sensing method is provided. The ambient light sensing method comprises: acquiring the sensitivity settings, an exposure time and obtaining a sensing signal of a light sensor according to the sensitivity settings and the exposure time; determining whether the magnitude of the sensing signal is within a predetermined range when the sensing signal is available, wherein the predetermined range has an upper value and a lower value; updating the sensitivity settings and the exposure time of the light sensor according to the determined result for the magnitude of the sensing signal; and acquiring the sensing signal of the light sensor with the updated sensitivity settings and the updated exposure time.

Abstract: A stacked photodiode structure comprises a first-conductivity-type substrate, a second-conductivity-type well region and a first-conductivity-type well region. The first-conductivity-type substrate has a first surface for light incidence and a grounding terminal. The second-conductivity-type well region is formed in the first-conductivity-type substrate and adjacent to the first surface. The first-conductivity-type well region is formed in the second-conductivity-type well region and adjacent to the first surface. A PN junction between the first-conductivity-type well region and the second-conductivity-type well region generates free electrons responsive to visible light spectrum. A PN junction between the second-conductivity-type well region and the first-conductivity-type substrate generates free holes and free electrons responsive to mainly IR light.

Abstract: An ambient light sensing method, comprising: acquiring the sensitivity settings, an exposure time and obtaining a sensing signal of a light sensor according to the sensitivity settings and the exposure time; determining whether the magnitude of the sensing signal is within a predetermined range when the sensing signal is available, wherein the predetermined range has an upper value and a lower value; updating the sensitivity settings and the exposure time of the light sensor according to the determined result for the magnitude of the sensing signal; and acquiring the sensing signal of the light sensor with the updated sensitivity settings and the updated exposure time.

Abstract: An encoder with signal conditioning of an emitter drive signal is described. In one embodiment, the encoder includes a peak comparator, a pulse generator, a threshold comparator, and digital circuitry. The peak comparator outputs a peak comparator signal based on a comparison of an input sinusoidal signal stored at a first time with the input sinusoidal signal stored at a second time. The pulse generator determines a peak of the input sinusoidal signal based on the peak comparator signal. The threshold comparator compares a differential signal amplitude with a differential signal amplitude window at approximately the peak of the input sinusoidal signal. The differential signal amplitude is associated with the input sinusoidal signal. The digital circuitry generates an emitter modification signal in response to a determination that the differential signal amplitude is outside of the differential signal amplitude window.

Abstract: An encoder with signal conditioning of an emitter drive signal is described. In one embodiment, the encoder includes a peak comparator, a pulse generator, a threshold comparator, and digital circuitry. The peak comparator outputs a peak comparator signal based on a comparison of an input sinusoidal signal stored at a first time with the input sinusoidal signal stored at a second time. The pulse generator determines a peak of the input sinusoidal signal based on the peak comparator signal. The threshold comparator compares a differential signal amplitude with a differential signal amplitude window at approximately the peak of the input sinusoidal signal. The differential signal amplitude is associated with the input sinusoidal signal. The digital circuitry generates an emitter modification signal in response to a determination that the differential signal amplitude is outside of the differential signal amplitude window.

Abstract: A method of controlling a laser diode measures an average light output power of the laser diode and compares the average light output power to a desired average light output power within a target range. If the average light output power is not within the target range, the slope efficiency is determined by measuring two light output powers at two different bias conditions. Each of the two light output powers is greater than a selected minimum light output power, which insures that each measurement occurs within the slope efficiency portion of the laser diode curve. A new bias current for the laser diode is calculated based on the measured slope efficiency so as to produce a new average light output power within the target range.

Abstract: A semiconductor package contains a metal leadframe that has been specially treated by roughening it with a chemical etchant. The roughening process enhances the adhesion between the leadframe and the molten plastic during the encapsulation of the leadframe and thereby reduces the tendency of the package to separate when exposed to moisture and numerous temperature cycles. In one embodiment, the leadframe made of copper is roughened with a chemical etchant that contains sulfuric acid and hydrogen peroxide.