Patents by Inventor Yee Kim Lee
Yee Kim Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8736042Abstract: A semiconductor package configured to attain a thin profile and low moisture sensitivity. Packages of this invention can include a semiconductor die mounted on a die attachment site of a leadframe and further connected with a plurality of elongate I/O leads arranged about the die attach pad and extending in said first direction. The leadframe having an “up-set” bonding pad arranged with a bonding support for supporting a plurality of wire bonds and a large mold flow aperture in the up-set bonding pad. The package encapsulated in a mold material that surrounds the bonding support and flows through the large mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity.Type: GrantFiled: December 13, 2011Date of Patent: May 27, 2014Assignee: National Semiconductor CorporationInventors: Felix C. Li, Yee Kim Lee, Peng Soon Lim, Terh Kuen Yii, Lee Han Meng@Eugene Lee
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Publication number: 20120080781Abstract: A semiconductor package configured to attain a thin profile and low moisture sensitivity. Packages of this invention can include a semiconductor die mounted on a die attachment site of a leadframe and further connected with a plurality of elongate I/O leads arranged about the die attach pad and extending in said first direction. The leadframe having an “up-set” bonding pad arranged with a bonding support for supporting a plurality of wire bonds and a large mold flow aperture in the up-set bonding pad. The package encapsulated in a mold material that surrounds the bonding support and flows through the large mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity.Type: ApplicationFiled: December 13, 2011Publication date: April 5, 2012Applicant: NATIONAL SEMICONDUCTOR CORPORATIONInventors: Felix C. LI, Yee Kim LEE, Peng Soon LIM, Terh Kuen YII, Lee Han Meng@Eugene LEE
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Patent number: 8097934Abstract: A lead frame and package construction configured to attain a thin profile and low moisture sensitivity. Lead frames of this invention may include a die attach pad having a die attachment site and an elongate ground lead that extends from the die attach pad. The lead frame includes a plurality of elongate I/O leads arranged about the die attach pad and extending away from the die attach pad in at least two directions. An inventive lead frame features “up-set” bonding pads electrically connected with the die attach pad and arranged with a bonding surface for supporting a plurality of wire bonds. The bonding surfaces also constructed to define at least one mold flow aperture for each up-set bonding pad. A package incorporating the lead frame is further disclosed such that the package includes an encapsulant that surrounds the bonding support and flows through the mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity.Type: GrantFiled: August 13, 2008Date of Patent: January 17, 2012Assignee: National Semiconductor CorporationInventors: Felix C. Li, Yee Kim Lee, Peng Soon Lim, Terh Kuen Yii, Lee Han Meng@Eugene Lee
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Patent number: 8093707Abstract: Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.Type: GrantFiled: October 19, 2009Date of Patent: January 10, 2012Assignee: National Semiconductor CorporationInventors: Shaw Wei Lee, Ein Sun Ng, Chue Siak Liu, Lee Han Meng @ Eugene Lee, Yee Kim Lee
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Publication number: 20110140253Abstract: A variety of semiconductor package arrangements and packaging methods are described that improve the reliability of bonding wires that down bond a die to a die attach pad. In one aspect, selected portions of the top surface of a lead frame (which may be in panel form) are plated (e.g., silver plated) to facilitate wire bonding. The plating covers some, but not all of a die attach surface of the die attach pad. In some preferred embodiments, the plating on the die attach pad is arranged as a peripheral ring that surrounds an unplated central region of the die support surface. In other embodiments, the plating on the die attach pad takes the form of bars or other geometric patterns that do not fully cover the die support surface. Unplated portions of the die support surface are roughened to improve the adherence of the die to the die attach pad, thereby reducing the probability of die attach pad delamination and the associated risks to down bonded bonding wires.Type: ApplicationFiled: December 14, 2009Publication date: June 16, 2011Applicant: NATIONAL SEMICONDUCTOR CORPORATIONInventors: Shaw Wei LEE, Yee Kim LEE, Ein Sun NG, Lee Han Meng @ Eugene LEE, Ting Soon Peter CHIN
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Publication number: 20110089556Abstract: Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.Type: ApplicationFiled: October 19, 2009Publication date: April 21, 2011Applicant: NATIONAL SEMICONDUCTOR CORPORATIONInventors: Shaw Wei LEE, Ein Sun NG, Chue Siak LIU, Lee Han Meng Eugene LEE, Yee Kim LEE
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Patent number: 7838980Abstract: A lead frame and package construction configured to attain a thin profile and low moisture sensitivity. Lead frames of this invention may include a die attach pad having a die attachment site and an elongate ground lead that extends from the die attach pad. The lead frame includes a plurality of elongate I/O leads arranged about the die attach pad and extending in said first direction. An inventive lead frame features an “up-set” bonding pad electrically connected with the die attach pad and arranged with a bonding support for supporting a plurality of wire bonds. The lead frame also having a large mold flow aperture in the up-set bonding pad. A package incorporating the lead frame is further disclosed such that the package includes an encapsulant that surrounds the bonding support and flows through the large mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity.Type: GrantFiled: September 27, 2007Date of Patent: November 23, 2010Assignee: National Semiconductor CorporationInventors: Yee Kim Lee, Peng Soon Lim, Terh Kuen Yii, Lee Han Meng@Eugene Lee