Patents by Inventor Yee Teh

Yee Teh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS, SYSTEMS, AND DEVICES FOR BANDWIDTH STEERING USING PHOTONIC DEVICES
    Publication number: 20220394362
    Abstract: Disclosed herein are methods, systems, and devices for bandwidth steering. Systems may include a plurality of compute nodes configured to execute one or more applications, a plurality of first level resources communicatively coupled to the plurality of compute nodes, a plurality of second level resources communicatively coupled to the plurality of first level resources, and a plurality of third level resources communicatively coupled to the plurality of second level resources. Systems may also include a plurality of optical switch circuits communicatively coupled to the plurality of first level resources and the plurality of second level resources, wherein each of the plurality of optical switch circuits is coupled to more than one of the plurality of the first level resources and is also coupled to more than one of the plurality of the second level resources.
    Type: Application
    Filed: November 13, 2020
    Publication date: December 8, 2022
    Inventors: Georgios Michelogiannakis, Yiwen Shen, Min Yee Teh, John Shalf, Madeleine Glick, Keren Bergman
  • Semiconductor package system with patterned mask over thermal relief
    Patent number: 8274145
    Abstract: A semiconductor package system including: providing a substrate having a thermal relief thereon; depositing a mask on the substrate and the thermal relief, the mask deposited on the thermal relief and having a regular pattern to partially cover the thermal relief; and die attaching a semiconductor die over the thermal relief.
    Type: Grant
    Filed: July 5, 2007
    Date of Patent: September 25, 2012
    Assignee: Stats Chippac Ltd.
    Inventors: Leocadio M. Alabin, Librado Gatbonton, Chiu Hsieh Ong, Beng Yee Teh, Antonio B. Dimaano, Jr.
  • SEMICONDUCTOR PACKAGE SYSTEM WITH PATTERNED MASK OVER THERMAL RELIEF
    Publication number: 20090008768
    Abstract: A semiconductor package system including: providing a substrate having a thermal relief thereon; depositing a mask on the substrate and the thermal relief, the mask deposited on the thermal relief and having a regular pattern to partially cover the thermal relief; and die attaching a semiconductor die over the thermal relief.
    Type: Application
    Filed: July 5, 2007
    Publication date: January 8, 2009
    Inventors: Leocadio M. Alabin, Librado Gatbonton, Chiu Hsieh Ong, Beng Yee Teh, Antonio B. Dimaano, JR.
  • Shape memory alloy actuator
    Publication number: 20070175213
    Abstract: A controller (44) for a SMA actuator (2) includes an electgric power source (46) for applying an electric current through an SMA element (8), a sensor (48) to detect change in an electric resistance of the element (8); and a regulator (50) for controlling the magnitude of the applied electric current. The regulator (50) applies a first current above a safe limit current for the element (8) until a selected change in the electric resistance is detected and applies a second current less than the first current after the change is detected.
    Type: Application
    Filed: February 8, 2005
    Publication date: August 2, 2007
    Applicant: The Australian National University
    Inventors: Roy Featherstone, Yee Teh