Patents by Inventor Yehuda Seidman

Yehuda Seidman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11837540
    Abstract: A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: December 5, 2023
    Assignee: KYOCERA AVX Components Corporation
    Inventors: Dan Rozbroj, Yehuda Seidman, Elinor O'Neill
  • Patent number: 11798896
    Abstract: A surface-mountable component is disclosed. The surface-mountable component may include a substrate having a side surface and a top surface that is perpendicular to the side surface. The component may include an element layer formed on the top surface of the substrate. The element layer may include a thin-film element and a contact pad electrically connected with the thin-film element. The contact pad may extend to the side surface of the substrate. The component may include a terminal that is electrically connected with the contact pad at a connection area. The connection area may be parallel with the top surface of the substrate. The terminal may have a visible edge surface that is approximately aligned with the side surface of the substrate. The visible edge surface may be visible for inspection when the surface-mountable component is mounted to a mounting surface.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: October 24, 2023
    Assignee: KYOCERA AVX Components Corporation
    Inventors: Yehuda Seidman, Elinor O'Neill, Dan Rozbroj
  • Publication number: 20220359389
    Abstract: A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.
    Type: Application
    Filed: July 18, 2022
    Publication date: November 10, 2022
    Inventors: Dan Rozbroj, Yehuda Seidman, Elinor O'Neill
  • Patent number: 11404372
    Abstract: A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: August 2, 2022
    Assignee: KYOCERA AVX Components Corporation
    Inventors: Dan Rozbroj, Yehuda Seidman, Elinor O'Neill
  • Publication number: 20210305176
    Abstract: A surface-mountable component is disclosed. The surface-mountable component may include a substrate having a side surface and a top surface that is perpendicular to the side surface. The component may include an element layer formed on the top surface of the substrate. The element layer may include a thin-film element and a contact pad electrically connected with the thin-film element. The contact pad may extend to the side surface of the substrate. The component may include a terminal that is electrically connected with the contact pad at a connection area. The connection area may be parallel with the top surface of the substrate. The terminal may have a visible edge surface that is approximately aligned with the side surface of the substrate. The visible edge surface may be visible for inspection when the surface-mountable component is mounted to a mounting surface.
    Type: Application
    Filed: June 10, 2021
    Publication date: September 30, 2021
    Inventors: Yehuda Seidman, Elinor O'Neill, Dan Rozbroj
  • Patent number: 11056444
    Abstract: A surface-mountable component is disclosed. The surface-mountable component may include a substrate having a side surface and a top surface that is perpendicular to the side surface. The component may include an element layer formed on the top surface of the substrate. The element layer may include a thin-film element and a contact pad electrically connected with the thin-film element. The contact pad may extend to the side surface of the substrate. The component may include a terminal that is electrically connected with the contact pad at a connection area. The connection area may be parallel with the top surface of the substrate. The terminal may have a visible edge surface that is approximately aligned with the side surface of the substrate. The visible edge surface may be visible for inspection when the surface-mountable component is mounted to a mounting surface.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: July 6, 2021
    Assignee: AVX Corporation
    Inventors: Yehuda Seidman, Elinor O'Neill, Dan Rozbroj
  • Publication number: 20200352026
    Abstract: A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.
    Type: Application
    Filed: April 16, 2020
    Publication date: November 5, 2020
    Inventors: Dan Rozbroj, Yehuda Seidman, Elinor O'Neill
  • Publication number: 20200144201
    Abstract: A surface-mountable component is disclosed. The surface-mountable component may include a substrate having a side surface and a top surface that is perpendicular to the side surface. The component may include an element layer formed on the top surface of the substrate. The element layer may include a thin-film element and a contact pad electrically connected with the thin-film element. The contact pad may extend to the side surface of the substrate. The component may include a terminal that is electrically connected with the contact pad at a connection area. The connection area may be parallel with the top surface of the substrate. The terminal may have a visible edge surface that is approximately aligned with the side surface of the substrate. The visible edge surface may be visible for inspection when the surface-mountable component is mounted to a mounting surface.
    Type: Application
    Filed: October 17, 2019
    Publication date: May 7, 2020
    Inventors: Yehuda Seidman, Elinor O'Neill, Dan Rozbroj