Abstract: An electronic device includes a first body, a second body, a touch pad module and a speaker module. The first body has an assembling region. The second body is pivoted to the first body. The touch pad module and the speaker module are disposed in the assembling region, wherein the touch pad module includes a first extending circuit board which is configured with a conductive pad. The speaker module is located at one side of the touch pad module. The speaker module includes a speaker and a conductive elastic component, and the conductive elastic component contacts the conductive pad. An assembling method of an electronic device is also provided.

Abstract: An electronic device includes a first body, a second body, a touch pad module and a speaker module. The first body has an assembling region. The second body is pivoted to the first body. The touch pad module and the speaker module are disposed in the assembling region, wherein the touch pad module includes a first extending circuit board which is configured with a conductive pad. The speaker module is located at one side of the touch pad module. The speaker module includes a speaker and a conductive elastic component, and the conductive elastic component contacts the conductive pad. An assembling method of an electronic device is also provided.

Abstract: A lifting mechanism is adapted to bear an expansion unit, and the expansion unit contacts or is separated from a heat dissipating module. The lifting mechanism includes an outer casing base and a bearing base. The bearing base is disposed on the outer casing base liftably along a first axis. The expansion unit is disposed on the bearing base. When the bearing base is located at an original position relative to the outer casing base, the expansion unit on the bearing base is separated from the heat dissipating module. When the bearing base is lifted relative to the outer casing base along the first axis to a lifting position, the expansion unit on the bearing base contacts the heat dissipating module. An electronic device having the lifting mechanism is further provided.

Abstract: The present invention relates to a fluid-controlled wire tension mechanism including a sealed container, a control valve, and a delivery spool. The sealed container has a space. The control valve is coupled to the sealed container to control fluid pressure in the space. The delivery spool is coupled to the sealed container with a compression end and a reel. The compression end is placed in the space, and the reel is located outside the sealed container to send out a cutting wire. Wherein, a fluid enters the space and applies pressure on the compression end. The present invention utilizes the fluid pressure to produce the rotating impedance to the delivery spool, so that the component is wear-proof, the line tension is easily controlled and the stream of the cutting wire can be stable for a long time. Therefore, the cutting effect and the shape are more precise.

Abstract: A lifting mechanism is adapted to bear an expansion unit, and the expansion unit contacts or is separated from a heat dissipating module. The lifting mechanism includes an outer casing base and a bearing base. The bearing base is disposed on the outer casing base liftably along a first axis. The expansion unit is disposed on the bearing base. When the bearing base is located at an original position relative to the outer casing base, the expansion unit on the bearing base is separated from the heat dissipating module. When the bearing base is lifted relative to the outer casing base along the first axis to a lifting position, the expansion unit on the bearing base contacts the heat dissipating module. An electronic device having the lifting mechanism is further provided.