Abstract: A method of forming a wiring pattern is provided. In the method, an adhesive material is coated on a substrate to form an adhesive layer, and then a patterned mask is provided on the adhesive layer, wherein the patterned mask has an opening defining a wiring pattern, and then an electrically conductive paste is filled in the opening, and subsequently the patterned mask is removed so as to form the wiring pattern on the substrate. In the method of the present invention, a wiring pattern is formed by using a screen printing method, but not by using an etching method. As a result, there are no etching contamination issues. Furthermore, the difficulty in etching the finer wiring patterns from the copper foil can be alleviated.

Abstract: A method of forming a printed circuit by using a printing method is provided. Method of forming the printed circuit, which instead of using the copper etching method, uses an adhesive to adhere to the metal powder, and then to solidify the metal powder. In detail, a patterned silk screen (corresponding to the through pattern of a predetermined printed circuit wiring) and a base material are provided. The adhesive is printed onto the base material using the patterned silk screen, and an adhesive layer which is patterned is formed onto the base material. Then, the metal powder is incorporated into the adhesive layer, and solidified inside the adhesive layer to form the printed circuit.