Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.

Abstract: A method for touchless gesture recognition is provided. The method includes transmitting ultrasonic signals via a speaker. The method includes generating ultrasonic signals. The method includes receiving the reflected ultrasonic signals from an object via two or more microphones. The method includes computing a frequency shift according to the reflected ultrasonic signals. The method includes identifying a gesture that corresponds to a movement of the object according to the frequency shift. The method includes performing a function that corresponds to the gesture.

Abstract: An oven includes an oven body, a heating element, a frame, and an oven door. The oven body has an inner space inside and includes a front plate, wherein the front plate has an entrance that communicates with the inner space. The heating element is adapted to heat the inner space. The frame is engaged with the oven body and has an abutted portion. The oven door is pivotally connected to the oven body and is located at the entrance. The oven door can pivot to a closed position to close the entrance and can pivot downward to an open position from the closed position to open the entrance. When the oven door is located at the open position, the second surface abuts against the abutted portion of the frame, thereby forming a platform outside the entrance for placing objects.

Abstract: A true wireless device is provided. The true wireless device includes a modulator for generating ultrasonic waves and a MEMS speaker coupled to the modulator. The MEMS speaker provides greater bandwidth than traditional speakers such as electrodynamic speakers and piezoelectric thin-film speakers. In particular, the MEMS speaker has an audio frequency band and an ultrasonic frequency band.

Abstract: A copolymer, a film composition and a composite material employing the same are provided. The copolymer is a copolymerization product of a composition, wherein the composition includes a monomer (a), a monomer (b) and a monomer (c). The monomer (a) is a compound having a structure represented by Formula (I), the monomer (b) is a compound having a structure represented by Formula (II), and the monomer (c) is a compound having a structure represented by Formula (III) wherein R1, R2, R3, R4, R5 and R6 are as defined in specification.

Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.

Abstract: An electrical connection device comprises an insulation body, an electrical connection component and a temperature sensing module. The electrical connection component is connected to the insulation body, and the electrical connection component includes a plurality of conductive terminals. The temperature sensing module is positioned between the insulation body and the electrical connection component, and the temperature sensing module is arranged in the insulation body. The temperature sensing module is configured to be adjacent to the conductive terminals.

Abstract: A vehicle power adaptor module includes a vehicle-sided connector and an interchangeable socket. The vehicle-sided connector includes a connector body and a first connecting portion. The first connecting portion is connected with the connector body. The connector body is configured to electrically connect with an electric vehicle. The interchangeable socket includes a socket body and a second connecting portion. The second connecting portion is connected with the socket body. The socket body is configured to electrically connect with an electronic equipment. The second connecting portion is configured to detachably connect with the first connecting portion.

Abstract: A high-speed successive-approximation register analog-to-digital converter (SAR ADC) is shown. A digital-to-analog converter (DAC), a comparator, and a SAR logic circuit are configured to form a loop for successive approximation of a digital representation of an analog input. The SAR logic circuit includes a plurality of latches. Each latch uses a one-gate-delay circuit to wire the comparator to one bit-control terminal of the DAC.

Abstract: A storage and inference method for a deep-learning neural network comprises steps: establishing dummy nodes in a first artificial neural network to form a second artificial neural network; storing model parameters of the second artificial neural network in a first storage area, and storing parameters of the dummy nodes in a second storage area; and in inference, respectively retrieving the model parameters of the second artificial neural network and the parameters of the dummy nodes from the first storage area and the second storage area simultaneously; deleting interconnections between the dummy nodes of the second artificial neural network or setting the interconnections between the dummy nodes of the second artificial neural network to 0 according to the parameters of the dummy nodes before inference. The present invention prevents ANN from be deciphered through respectively storing model parameters and parameters of the dummy nodes in different locations.

Abstract: The present disclosure provides an adapter assembly. Portion of the main body of the plug adapter is penetrated through the opening and exposed to the exterior of the accommodation space. Each protrusion is penetrated through the concave and exposed to the exterior of the accommodation space. Each protrusion exposed to the exterior of the accommodation space is connected with the position-limiting portion through the rotation of the plug adapter. Each fastening element is plugged into the first hole and the second hole. The plug adapter is fastened to the casing through the fastening element and the connection between the protrusion and the position-limiting portion. The adapter assembly includes two impact bearing points. One is formed by the fastening element, and the other is formed by the connection between the protrusion and the position-limiting portion. The stability and the waterproof capability of the adapter assembly are enhanced.

Abstract: The present disclosure provides an adapter assembly. Portion of the main body of the plug adapter is penetrated through the opening and exposed to the exterior of the accommodation space. Each protrusion is penetrated through the concave and exposed to the exterior of the accommodation space. Each protrusion exposed to the exterior of the accommodation space is connected with the position-limiting portion through the rotation of the plug adapter. Each fastening element is plugged into the first hole and the second hole. The plug adapter is fastened to the casing through the fastening element and the connection between the protrusion and the position-limiting portion. The adapter assembly includes two impact bearing points. One is formed by the fastening element, and the other is formed by the connection between the protrusion and the position-limiting portion. The stability and the waterproof capability of the adapter assembly are enhanced.

Abstract: A method includes forming a first etch stop layer (ESL) over a conductive feature, forming a first dielectric layer on the first ESL, forming a second ESL on the first dielectric layer, forming a second dielectric layer on the second ESL, forming a trench in the second dielectric layer, forming a first opening in a bottom surface of the trench extending through the second dielectric layer, and forming a second opening in a bottom surface of the first opening. The second opening extends through the first dielectric layer and the first ESL. The second opening exposes a top surface of the conductive feature. The method further includes widening the first opening to a second width, filling the trench with a conductive material to form a conductive line, and filling the second opening and the first opening with the conductive material to form a conductive via.

Abstract: A vehicle power adaptor module includes a vehicle-sided connector and an interchangeable socket. The vehicle-sided connector includes a connector body and a first connecting portion. The first connecting portion is connected with the connector body. The connector body is configured to electrically connect with an electric vehicle. The interchangeable socket includes a socket body and a second connecting portion. The second connecting portion is connected with the socket body. The socket body is configured to electrically connect with an electronic equipment. The second connecting portion is configured to detachably connect with the first connecting portion.

Abstract: A method of building a decoding status prediction system is provided. Firstly, plural read records are collected during read cycles of a flash memory. Then, the plural read records are classified into read records with a first read result and read records with a second read result. Then, a first portion of the read records with the first read result are divided into K0 groups according to a clustering algorithm, and a second portion of the read records with the second read result are divided into K1 groups according to the clustering algorithm. Then, the read records of the K0 groups and the K1 groups are used to train prediction models. Consequently, K0×K1 prediction models are generated. Then, the prediction models are combined as a prediction database.

Abstract: A data transmitting method using an LDPC code as an error correction code is provided. The method includes providing a parity check matrix of LDPC code, wherein the size of the parity check matrix is (m1+m2)×(n1+n2); in a sending side, encoding an input data of K bits with a encoder to generate a first block code of (n1+n2) bits, according to the parity check matrix; through a transmitting channel, sending n1 bits of the first block code from the sending side to a receiving side, wherein n2 bits of the first block code are not transmitted; and receiving the n1 bits of the first block code in the receiving side, and using the parity check matrix to perform a decoding algorithm to the received first block code to iterative decodes a second block code of (n1+n2) bits with a decoder. Furthermore, a data decoding method thereof is also provided.

Abstract: A low-density parity-check code scaling method is disclosed. The method includes following steps: obtaining the original low-density parity-check matrix; forming the permutation matrices with the random row shift or the random column shift to the identity matrix; replacing the component codes by the permutation matrices and the all-zero matrix to form the extended low-density parity-check matrix; adjusting the code length and the code rate to form the global coupled low-density parity-check matrix; and outputting the global coupled low-density parity-check code.

Abstract: A continuous time delta sigma modulator is described in this application. In one example, the continuous time delta sigma modulator includes: a quantizer, a buffer module, a randomizer, and a reference module. The quantizer includes a comparator that generates a digital output based on a comparison of a reference potential with an input generated based on a sample of an analog signal. The buffer module stores the digital output for a predetermined delay period and outputs the digital output after the predetermined delay period as a delayed digital output. The randomizer randomizes the delayed digital output to generate a randomized digital output. The reference module modifies the reference potential based on the randomized digital output.

Abstract: A low-density parity-check code scaling method is disclosed. The method includes following steps: obtaining the original low-density parity-check matrix; forming the permutation matrices with the random row shift or the random column shift to the identity matrix; replacing the component codes by the permutation matrices and the all-zero matrix to form the extended low-density parity-check matrix; adjusting the code length and the code rate to form the global coupled low-density parity-check matrix; and outputting the global coupled low-density parity-check code.

Abstract: A method for generating encoded data includes: generating at least one local LDPC matrix and a global LDPC matrix, the global LDPC matrix relating to each of the at least one local LDPC matrix; repeatedly selecting one of the at least one local LDPC matrix as a target local LDPC matrix until a number t of the target local LDPC matrices are selected, where t is a user-defined number that is greater than one; generating a block matrix that includes the target local LDPC matrices; generating a primary LDPC matrix that includes a first primary matrix part relating to the block matrix, and a second primary matrix part relating to the global LDPC matrix; and encoding data based on the primary LDPC matrix.