Patents by Inventor Yen-Chun Liu
Yen-Chun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11984465Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, the image sensor comprises a boundary deep trench isolation (BDTI) structure disposed at boundary regions of a pixel region surrounding a photodiode. The BDTI structure has a ring shape from a top view and two columns surrounding the photodiode with the first depth from a cross-sectional view. A multiple deep trench isolation (MDTI) structure is disposed at inner regions of the pixel region overlying the photodiode, the MDTI structure extending from the back-side of the substrate to a second depth within the substrate smaller than the first depth. The MDTI structure has three columns with the second depth between the two columns of the BDTI structure from the cross-sectional view. The MDTI structure is a continuous integral unit having a ring shape.Type: GrantFiled: August 9, 2022Date of Patent: May 14, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang, Chun-Yuan Chen, Shen-Hui Hong
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Patent number: 11983475Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.Type: GrantFiled: February 7, 2023Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Pin-Dai Sue, Po-Hsiang Huang, Fong-Yuan Chang, Chi-Yu Lu, Sheng-Hsiung Chen, Chin-Chou Liu, Lee-Chung Lu, Yen-Hung Lin, Li-Chun Tien, Yi-Kan Cheng
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Publication number: 20240106104Abstract: An electronic device includes a device body and an antenna module disposed in the device body and including a conductive structure and a coaxial cable including a core wire, a shielding layer wrapping the core wire, and an outer jacket wrapping the shielding layer. The conductive structure includes a structure body and a slot formed on the structure body and penetrating the structure body in a thickness direction of the structure body. A section of the shielding layer extends from the outer jacket and is connected to the structure body. A physical portion of the structure body and the section of the shielding layer are respectively located on two opposite sides of the slot in a width direction of the slot. A section of the core wire extends from the section of the shielding layer and overlaps the slot and the physical portion in the thickness direction.Type: ApplicationFiled: September 8, 2023Publication date: March 28, 2024Applicant: COMPAL ELECTRONICS, INC.Inventors: Hung-Yu Yeh, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Chih-Heng Lin, Jui-Hung Lai
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Patent number: 11923886Abstract: An antenna device and a method for configuring the same are provided. The antenna device includes a grounding metal, a grounding part, a radiating part, a feeding part, a proximity sensor, and a sensing metal. The radiating part is electrically connected to the grounding metal through the grounding part. The feeding part is coupled to the grounding metal through a feeding point. The sensing metal is electrically connected to the proximity sensor. The sensing metal is separated from the radiating part at a distance. The distance is less than or equal to one thousandth of a wavelength corresponding to an operating frequency of the antenna device.Type: GrantFiled: August 27, 2021Date of Patent: March 5, 2024Assignee: COMPAL ELECTRONICS, INC.Inventors: Jhih-Ciang Chen, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Yan-Ming Lin, Jui-Hung Lai
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Publication number: 20230192888Abstract: Provided is a monoclonal antibody of matrix metalloproteinase 1. The monoclonal antibody has a heavy chain variable region with an amino sequence comprising i) CDR1 selected from the group consisting of SEQ ID NOs: 1, 7 and 13, ii) CDR2 selected from the group consisting of SEQ ID NOs: 2, 8 and 14, and iii) CDR3 selected from the group consisting of SEQ ID NOs: 3, 9 and 15. The monoclonal antibody also has a light chain variable region with an amino sequence comprising i) CDR1 selected from the group consisting of SEQ ID NOs: 4, 10 and 16, ii) CDR2 selected from the group consisting of SEQ ID NOs: to 5, 11 and 17, and iii) CDR3 selected from the group consisting of SEQ ID NOs: 6, 12 and 18. A polynucleotide encoding the monoclonal antibody and a complementary polynucleotide sequence thereof are provided as well. A detection kit and a detection method are also provided, wherein the detection kit contains the monoclonal antibody of the matrix metalloproteinase 1.Type: ApplicationFiled: February 27, 2020Publication date: June 22, 2023Inventors: Ya-Ting CHANG, Jau-Song YU, Jun-Sheng WANG, Shu-Fang WU, Chih-Ju CHEN, Yen-Chun LIU
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Publication number: 20220372189Abstract: A copolymer is formed by reacting (A) aromatic monomer, an oligomer thereof, or a polymer thereof, with (B) aliphatic monomer, an oligomer thereof, or a polymer thereof. The aromatic monomer has a chemical structure of in which each of R1 is independently H or CH3, and n=1-4.Type: ApplicationFiled: October 8, 2021Publication date: November 24, 2022Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wen-Pin TING, Kuei-Yi CHUANG, Shih-Yao LIANG, Yen-Chun LIU
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Patent number: 11476410Abstract: A semiconductor device includes a substrate having a magnetic random access memory (MRAM) region and a logic region, a first metal interconnection on the MRAM region, a second metal interconnection on the logic region, a stop layer extending from the first metal interconnection to the second metal interconnection, and a magnetic tunneling junction (MTJ) on the first metal interconnection. Preferably, the stop layer on the first metal interconnection and the stop layer on the second metal interconnection have different thicknesses.Type: GrantFiled: August 19, 2020Date of Patent: October 18, 2022Assignee: UNITED MICROELECTRONICS CORP.Inventors: Yu-Chun Chen, Yen-Chun Liu, Ya-Sheng Feng, Chiu-Jung Chiu, I-Ming Tseng, Yi-An Shih, Yi-Hui Lee, Chung-Liang Chu, Hsiu-Hao Hu
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Patent number: 11437162Abstract: A conductive material composition and a conductive material prepared therefrom are provided. The conductive material composition includes 40-80 parts by weight of disulfide resin having at least one terminal reactive functional group and 20-60 parts by weight of metal material. The terminal reactive functional group is independently acrylate group, methacrylate group, glycidyl group, oxiranyl group, oxetanyl group, or 3,4-epoxycyclohexyl group.Type: GrantFiled: December 31, 2019Date of Patent: September 6, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ying-Xuan Lai, Shou-Yi Ho, Yi-Chi Yang, Yen-Chun Liu
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Patent number: 11383195Abstract: A device for capturing particles includes a gas-guiding unit, a gas-guiding unit and a mist-elimination unit. The gas-guiding unit has opposing first and second ends. The mist-elimination unit is disposed at the second end. The liquid-circulation unit, disposed under the mist-elimination unit by surrounding the gas-guiding unit, includes through holes below the gas-guiding unit by a gap. A gas containing particles enters the channel via the first end and then the mist-elimination unit via the second end. While the gas flows into the channel, the liquid in the liquid-circulation unit is inhaled into the channel via the gap to form droplets containing particles. After the droplets are captured by the mist-elimination unit, the liquid formed at the mist-elimination unit flows down into the liquid-circulation unit to reform the liquid to be further inhaled back to the channel of the gas-guiding unit via the gap.Type: GrantFiled: June 18, 2020Date of Patent: July 12, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Tsung-Jen Ho, Sheng-Fu Huang, Yen-Chun Liu, Chun-Yi Chou
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Patent number: 11286333Abstract: A degradation method of thermosetting resin is provided. The method includes the following steps, for example, a first resin composition is provided. The resin in the first resin composition includes a carbon-nitrogen bond, an ether bond, an ester bond or a combination thereof. The first resin composition and a catalyst composition are mixed to perform a degradation reaction to form a second resin composition. The catalyst composition includes a transition metal compound and a group IIIA metal compound. The second resin composition includes a resin monomer or an oligomer thereof having functional groups. The functional group includes an amine group, a hydroxyl group, an ester group, an acid group or a combination thereof. A catalyst composition used in the degradation method and a resin composition obtained by the degradation method are also provided.Type: GrantFiled: December 26, 2019Date of Patent: March 29, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuei-Yi Chuang, Kuo-Chan Chiou, Yen-Chun Liu
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Publication number: 20220029087Abstract: A semiconductor device includes a substrate having a magnetic random access memory (MRAM) region and a logic region, a first metal interconnection on the MRAM region, a second metal interconnection on the logic region, a stop layer extending from the first metal interconnection to the second metal interconnection, and a magnetic tunneling junction (MTJ) on the first metal interconnection. Preferably, the stop layer on the first metal interconnection and the stop layer on the second metal interconnection have different thicknesses.Type: ApplicationFiled: August 19, 2020Publication date: January 27, 2022Inventors: Yu-Chun Chen, Yen-Chun Liu, Ya-Sheng Feng, Chiu-Jung Chiu, I-Ming Tseng, Yi-An Shih, Yi-Hui Lee, Chung-Liang Chu, Hsiu-Hao Hu
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Publication number: 20210202126Abstract: A conductive material composition and a conductive material prepared therefrom are provided. The conductive material composition includes 40-80 parts by weight of disulfide resin having at least one terminal reactive functional group and 20-60 parts by weight of metal material. The terminal reactive functional group is independently acrylate group, methacrylate group, glycidyl group, oxiranyl group, oxetanyl group, or 3,4-epoxycyclohexyl group.Type: ApplicationFiled: December 31, 2019Publication date: July 1, 2021Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ying-Xuan LAI, Shou-Yi HO, Yi-Chi YANG, Yen-Chun LIU
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Publication number: 20210189057Abstract: A degradation method of thermosetting resin is provided. The method includes the following steps, for example, a first resin composition is provided. The resin in the first resin composition includes a carbon-nitrogen bond, an ether bond, an ester bond or a combination thereof. The first resin composition and a catalyst composition are mixed to perform a degradation reaction to form a second resin composition. The catalyst composition includes a transition metal compound and a group IIIA metal compound. The second resin composition includes a resin monomer or an oligomer thereof having functional groups. The functional group includes an amine group, a hydroxyl group, an ester group, an acid group or a combination thereof. A catalyst composition used in the degradation method and a resin composition obtained by the degradation method are also provided.Type: ApplicationFiled: December 26, 2019Publication date: June 24, 2021Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuei-Yi CHUANG, Kuo-Chan CHIOU, Yen-Chun LIU
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Publication number: 20210154616Abstract: A device for capturing particles includes a gas-guiding unit, a gas-guiding unit and a mist-elimination unit. The gas-guiding unit has opposing first and second ends. The mist-elimination unit is disposed at the second end. The liquid-circulation unit, disposed under the mist-elimination unit by surrounding the gas-guiding unit, includes through holes below the gas-guiding unit by a gap. A gas containing particles enters the channel via the first end and then the mist-elimination unit via the second end. While the gas flows into the channel, the liquid in the liquid-circulation unit is inhaled into the channel via the gap to form droplets containing particles. After the droplets are captured by the mist-elimination unit, the liquid formed at the mist-elimination unit flows down into the liquid-circulation unit to reform the liquid to be further inhaled back to the channel of the gas-guiding unit via the gap.Type: ApplicationFiled: June 18, 2020Publication date: May 27, 2021Inventors: TSUNG-JEN HO, SHENG-FU HUANG, YEN-CHUN LIU, CHUN-YI CHOU
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Patent number: 11015018Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.Type: GrantFiled: September 28, 2018Date of Patent: May 25, 2021Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yen-Chun Liu, Min-Chian Wang, Hsiang-Yen Tsao, Kuo-Chan Chiou
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Publication number: 20210104339Abstract: A conductive composition and a method for fabricating a micro light-emitting diode (LED) display are provided. The conductive composition includes 5-90 parts by weight of monomer, 10-95 parts by weight of epoxy resin, and 50-150 parts by weight of conductive powder. The total weight of the monomer and the epoxy resin is 100 parts by weight. The monomer has n reactive functional groups, wherein n is 1, 2, 3 or 4. The monomer has a molecular weight equal to or less than 350. The epoxy resin has an epoxy equivalent weight (EEW) from 160 g/Eq to 3500 g/Eq. Furthermore, there is a specific relationship among the weight of monomer, the number of reactive functional groups, the molecular weight of monomer, the weight of epoxy resin, and the epoxy equivalent weight of epoxy resin.Type: ApplicationFiled: December 30, 2019Publication date: April 8, 2021Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Shou-Yi HO, Yen-Chun LIU, Kuo-Chan CHIOU, Hsien-Kuang LIN
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Publication number: 20210102886Abstract: This application relates generally to automated systems and methods for classifying subtypes of leukemia cells and other applications therefrom.Type: ApplicationFiled: October 6, 2020Publication date: April 8, 2021Inventors: Sara Monaghan, Michael Boyiadzis, Steven H. Swerdlow, Yen-Chun Liu, Bor-Sheng KO, Yu-Fen Wang, Chi-Chun Lee, Jeng-Lin Li, Ming-Ya Ko
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Publication number: 20190211138Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.Type: ApplicationFiled: September 28, 2018Publication date: July 11, 2019Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yen-Chun LIU, Min-Chian WANG, Hsiang-Yen TSAO, Kuo-Chan CHIOU
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Patent number: 10329468Abstract: A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X1 is X2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.Type: GrantFiled: February 18, 2016Date of Patent: June 25, 2019Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yen-Chun Liu, Hui-Wen Chang, Min-Chian Wang, Kuo-Chan Chiou
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Patent number: 10059866Abstract: An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4?-methylenedianiline, 4,4?-ethylenedianiline, 4,4?-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.Type: GrantFiled: December 18, 2015Date of Patent: August 28, 2018Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yen-Chun Liu, Hui-Wen Chang, Hsiang-Yen Tsao, Kuo-Chan Chiou