Patents by Inventor Yen-Fang CHEN

Yen-Fang CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096712
    Abstract: Provided is a semiconductor device includes a gate electrode, a gate dielectric layer, a channel layer, an insulating layer, a first source/drain electrode and a second source/drain electrode, a second dielectric layer, and a stop segment. The gate electrode is located within a first dielectric layer that overlies a substrate. The gate dielectric layer is located over the gate electrode. The channel layer is located on the gate dielectric layer. The insulating layer is located over the channel layer. The first source/drain electrode and the second source/drain electrode are located in the insulating layer, and connected to the channel layer. The second dielectric layer is beside one of the first source/drain electrode and the second source/drain electrode. The stop segment is embedded in the second dielectric layer.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Wei Jiang, Chieh-Fang Chen, Yen-Chung Ho, Pin-Cheng Hsu, Feng-Cheng Yang, Chung-Te Lin
  • Patent number: 10847394
    Abstract: A wafer container includes a container body and a door. The container body has a pair of upright side walls, a top wall, a bottom wall and a rear wall cooperatively defining a container space with a front access opening. The door is removably engaged with the container body to close and seal the front access opening, and includes a front door panel, a rear door panel, and sealing means which is disposed at a periphery of the front door panel and configured to seal the gap between the door and the container body when the door is engaged with the container body to close the front access opening.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: November 24, 2020
    Assignee: CHUNG KING ENTERPRISE CO., LTD.
    Inventors: Ming-Long Chiu, Tsung-Yi Yang, Yen-Fang Chen, Chia-Ling Li
  • Patent number: 10475680
    Abstract: A wafer shipping box includes a case and a positioning unit. The case includes a base, a cover, and a receiving space defined by the base and the cover. The positioning unit is disposed in the receiving space and includes a lower retaining member connected to the base, an upper retaining member connected to the cover, and a cassette disposed therebetween. The cassette includes two upright holding walls spaced apart from each other, each of which has a plurality of lateral confining slots aligned in a front-rear direction. The lower retaining member is formed with a plurality of lower confining slots, each of which is defined by two slot walls interconnected at bottom ends thereof to form a slot bottom. The slot bottoms are respectively misaligned from central positions of the lateral confining slots along the front-rear direction.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: November 12, 2019
    Assignee: CHUNG KING ENTERPRISE CO., LTD.
    Inventors: Shih-Chin Huang, Xiang-Ying Chen, Yen-Fang Chen, Chang-Wei Chen
  • Publication number: 20190067044
    Abstract: A wafer shipping box includes a case and a positioning unit. The case includes a base, a cover, and a receiving space defined by the base and the cover. The positioning unit is disposed in the receiving space and includes a lower retaining member connected to the base, an upper retaining member connected to the cover, and a cassette disposed therebetween. The cassette includes two upright holding walls spaced apart from each other, each of which has a plurality of lateral confining slots aligned in a front-rear direction. The lower retaining member is formed with a plurality of lower confining slots, each of which is defined by two slot walls interconnected at bottom ends thereof to form a slot bottom. The slot bottoms are respectively misaligned from central positions of the lateral confining slots along the front-rear direction.
    Type: Application
    Filed: August 29, 2018
    Publication date: February 28, 2019
    Inventors: Shih-Chin HUANG, Xiang-Ying CHEN, Yen-Fang CHEN, Chang-Wei CHEN
  • Publication number: 20190067063
    Abstract: A wafer container includes a container body and a door. The container body has a pair of upright side walls, a top wall, a bottom wall and a rear wall cooperatively defining a container space with a front access opening. The door is removably engaged with the container body to close and seal the front access opening, and includes a front door panel, a rear door panel, and sealing means which is disposed at a periphery of the front door panel and configured to seal the gap between the door and the container body when the door is engaged with the container body to close the front access opening.
    Type: Application
    Filed: July 24, 2018
    Publication date: February 28, 2019
    Inventors: Ming-Long CHIU, Tsung-Yi YANG, Yen-Fang CHEN, Chia-Ling LI