Abstract: A method and system to ensure correct firmware image execution in a computer system. The computer system has a processor executing a basic input/output system (BIOS) and a baseboard management controller (BMC). A first flash memory device is coupled to the processor storing a BIOS firmware image and a project name. A second flash memory device is coupled to the BMC storing a BMC firmware image and the project name. A programmable logic device is coupled to the first and second flash memory devices. The programmable logic device including a non-volatile memory storing a project name. The programmable logic device is configured to execute a Platform Firmware Resilience routine to compare the project name of the BIOS firmware image and the project name of the BMC firmware image with the stored project name before starting the BMC or executing the BIOS firmware image by the processor.

Abstract: An electronic device includes a device body and an antenna module disposed in the device body and including a conductive structure and a coaxial cable including a core wire, a shielding layer wrapping the core wire, and an outer jacket wrapping the shielding layer. The conductive structure includes a structure body and a slot formed on the structure body and penetrating the structure body in a thickness direction of the structure body. A section of the shielding layer extends from the outer jacket and is connected to the structure body. A physical portion of the structure body and the section of the shielding layer are respectively located on two opposite sides of the slot in a width direction of the slot. A section of the core wire extends from the section of the shielding layer and overlaps the slot and the physical portion in the thickness direction.

Abstract: A switch-type phase shifter including a phase shifting unit is provided. The phase shifting unit includes two half circuits and a first switch connected to the half circuits and receiving a first control signal. Each half circuit includes a first variable capacitor, a second variable capacitor, a second switch and a variable inductor. The two ends of the first variable capacitor are coupled to the input and the control nodes of the half circuit respectively. The two ends of the second variable capacitor are coupled to the output and control nodes of the half circuit respectively. The first and second ends of the second switch are coupled to the output and input nodes respectively, and the third end thereof is coupled to the control node and receives a second control signal. The two ends of the variable inductor are coupled to the input and output nodes respectively.

Abstract: A dual band beam generator comprises a Butler matrix, two first phase shifter and two second phase shifter. The Butler matrix includes first to eighth transceiver ports, the first to fourth transceiver ports are disposed at one side of the Butler matrix, and the fifth to eighth transceiver ports are disposed at an opposite side of the Butler matrix, two first ports of the two first phase shifters are respectively connected to the fifth and eighth transceiver ports of the Butler matrix, and two first ports of the two second phase shifters are respectively connected to the sixth and seventh transceiver ports of the Butler matrix.

Abstract: A phase shifter with broadband and a phase array module using the same are provided. The phase shifter includes at least one phase shifting unit. The phase shifting unit includes a first switch, a first capacitor, a second capacitor, a first inductor, a second switch, a second inductor, a first resistor and a second resistor. The first capacitor is connected between the first inductor and a second end of the first switch. The second capacitor is connected between the first inductor and a third end of the first switch. A second end of the second switch is connected to a ground end. The two ends of the second inductor are respectively connected to a ground end and a third end of the second switch. The first inductor is connected between the first capacitor and the third end of the second switch.

Abstract: The present invention provides an optically induced cell lysis biochip, which comprises: an upper substrate made of a transparent, electrically conductive material; a lower substrate made of a transparent, electrically conductive material; a photoconductive layer formed under the lower surface of the upper substrate or on the upper surface of the lower substrate; and a chamber formed between the upper substrate and the lower substrate. When there is an electric potential difference between the upper and lower substrates, a light spot illuminated on the photoconductive layer can cause the impedance of the illuminated area to decrease, thereby causing the electric current to center on the illuminated area of the photoconductive layer. Further, the electric current flowing through the illuminated area can induce the cell lysis process of a target cell.

Abstract: The present invention provides an optically induced cell lysis biochip, which comprises: an upper substrate made of a transparent, electrically conductive material; a lower substrate made of a transparent, electrically conductive material; a photoconductive layer formed under the lower surface of the upper substrate or on the upper surface of the lower substrate; and a chamber formed between the upper substrate and the lower substrate. When there is an electric potential difference between the upper and lower substrates, a light spot illuminated on the photoconductive layer can cause the impedance of the illuminated area to decrease, thereby causing the electric current to center on the illuminated area of the photoconductive layer. Further, the electric current flowing through the illuminated area can induce the cell lysis process of a target cell.

Abstract: A digital signal processor (DSP) is operable to receive a single-phase back electromotive force signal (back-EMF) fed back from a motor and control an inverter for driving the motor based on the single-phase back-EMF signal. The DSP includes an electrical angle building module, a rotation speed control module, and a pulse width modulation control module. In addition, the DSP further includes a field-weakening compensation module. The field-weakening compensation module is operable to automatically regulate an electrical angle based on a rotation speed of the motor and a set of predetermined compensation parameters so that the DSP can be operable to achieve an adaptive control. Furthermore, a motor control system and method are disclosed herein.

Abstract: An optically-induced dielectrophoresis chip including a substrate, a first electrode layer disposed on the substrate, and an interface modification layer disposed on the first electrode layer. A photo-conductive layer is disposed on the interface modification layer and includes an optical absorbent polymeric material. A barrier layer is disposed on the photo-conductive layer, and a compartment forming layer is disposed on the barrier layer defining a compartment. A second electrode layer covers the compartment forming layer.

Abstract: A digital signal processor (DSP) is operable to receive a single-phase back electromotive force signal (back-EMF) fed back from a motor and control an inverter for driving the motor based on the single-phase back-EMF signal. The DSP includes an electrical angle building module, a rotation speed control module, and a pulse width modulation control module. In addition, the DSP further includes a field-weakening compensation module. The field-weakening compensation module is operable to automatically regulate an electrical angle based on a rotation speed of the motor and a set of predetermined compensation parameters so that the DSP can be operable to achieve an adaptive control. Furthermore, a motor control system and method are disclosed herein.

Abstract: The present invention provides an optically induced cell lysis biochip, which comprises: an upper substrate made of a transparent, electrically conductive material; a lower substrate made of a transparent, electrically conductive material; a photoconductive layer formed under the lower surface of the upper substrate or on the upper surface of the lower substrate; and a chamber formed between the upper substrate and the lower substrate. When there is an electric potential difference between the upper and lower substrates, a light spot illuminated on the photoconductive layer can cause the impedance of the illuminated area to decrease, thereby causing the electric current to center on the illuminated area of the photoconductive layer. Further, the electric current flowing through the illuminated area can induce the cell lysis process of a target cell.

Abstract: An optically-induced dielectrophoresis chip includes a substrate, a first electrode layer disposed on the substrate, an interface modification layer disposed on the first electrode layer, a photo-conductive layer disposed on the interface modification layer and including an optical absorbent polymeric material, a barrier layer disposed on the photo-conductive layer, a compartment forming layer disposed on the barrier layer and defining a compartment, and a second electrode layer covering the compartment forming layer.

Abstract: A method of manufacturing a plastic biochip or a biosensor test strip, which is compatible with standard CD/DVD making processes. The method includes substrate injection press molding, followed by seamless magnetic biosensor sputtering. If necessary, the sputtered biosensor is cut off from the substrate.