Abstract: An electronic package can include a substrate, a first die and a second die. The first die can include a first thickness and the second die can include a second thickness. The first and second dies can be coupled to the substrate. A mold can be disposed on the substrate and cover the first die and the second die. The mold can include a planar upper surface. A first via, having a first length, can be extended between the first die and the planar upper surface. A second via, having a second length, can be extended between the second die and the planar upper surface. In some examples, a third die can be communicatively coupled to the first die using the first via and the second die using the second via.

Abstract: A method and apparatus for PTT over IoT is described herein. During operation each IoT device will be assigned to a talkgroup. Some talkgroups may have a single IoT device assigned, and other talkgroups may have multiple IoT devices assigned. During operation, an action command to control an IoT device is received over a first talkgroup. Users that are geographically near the IoT device are determined and polled as to whether or not they agree with the action command. If users near the IoT device agree to the action command, then a command is issued to a first IoT device assigned to that talkgroup.

Abstract: Embodiments herein relate to out-of-band connections for remote diagnosis and repair of client devices. In various embodiments, a server for remote management of a client device may receive, a network packet including a request for a keyboard-video-mouse (KVM) remote management session that includes an identifier of a gateway device coupled to a local area network (LAN) of the client device to be remotely managed by the server. The server may use the identifier of the gateway device to assist in invoking an out-of-band (OOB) connection between the client device and the gateway device. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein relate to provision of keyboard, video, and mouse (KVM) connections. In various embodiments, a gateway apparatus may include a KVM remote connection manager, a local area network (LAN) port coupled with the KVM remote connection manage, and a wide area network (WAN) port coupled with the KVM remote connection manager, where the KVM remote connection manager includes a video encoder to encode an out-of-band redirected video stream received at the LAN port from a managed client device, destined for a remote management console, and send the encoded video stream to the remote management console via the WAN port. Other embodiments may be described and/or claimed.

Abstract: A method for training an analytics engine hosted by an edge server device is provided. The method includes determining a classification for data in an analytics engine hosted by an edge server and computing a confidence level for the classification. The confidence level is compared to a threshold. The data is sent to a cloud server if the confidence level is less than the threshold. A reclassification is received from the cloud server and the analytics engine is trained based, at least in part, on the data and the reclassification.

Abstract: Integrated circuit (IC) structures with extended conductive pathways, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, an IC structure may include a die having a device side and an opposing back side; a mold compound disposed at the back side; and a conductive pathway extending into the die from the back side and extending into the mold compound from the back side.

Abstract: Technologies to provide a gateway-assisted out-of-band (OOB) remote management session between a remote management service (RMS) and a managed client system are provided. In response to a fault being detected at a client computer system, a RMS receives a client initiated remote access (CIRA) packet from the client system. The CIRA packet includes client configuration information and a single hop network appliance identifier (SHNAI) associated with a network appliance that is a single hop away from the client system. The RMS inspects the SHNAI and the client configuration information, and identifies and copies suitable application(s) from a storage system to a local storage of the gateway indicated by the SHNAI. The RMS instructs/controls the client system to perform an IDE redirection to the gateway in order to provision the application(s) from the local storage of the gateway. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein relate to out-of-band connections for remote diagnosis and repair of client devices. In various embodiments, an apparatus for remote management of a client device may include a local area network (LAN) port, a wide area network (WAN) port, and a remote communications manager to provide to a remote management service, an identification of the apparatus as a gateway device for a LAN of the remote managed client computer. In embodiments, the identification may assist the remote management service in invoking the remote managed client computer to establish a remote management session via an out-of-band (OOB) channel with the gateway device. In embodiments, a gateway-assisted failover during a remote management session between a remote management console and a managed client device may be provided. Other embodiments may be described and/or claimed.

Abstract: A method and apparatus for PTT over IoT is described herein. During operation IoT devices will be dynamically added to a particular talkgroup. The particular devices added to the talkgroup will be based on a current public-safety event along with a location of the public-safety officer.

Abstract: An electronic package can include a substrate, a first die and a second die. The first die can include a first thickness and the second die can include a second thickness. The first and second dies can be coupled to the substrate. A mold can be disposed on the substrate and cover the first die and the second die. The mold can include a planar upper surface. A first via, having a first length, can be extended between the first die and the planar upper surface. A second via, having a second length, can be extended between the second die and the planar upper surface. In some examples, a third die can be communicatively coupled to the first die using the first via and the second die using the second via.

Abstract: A method and device for navigating between multiple talkgroups. The device includes a user input interface, a display, and an electronic processor communicatively coupled to the display. The processor is configured to generate, on the display, a graphical user interface, associate the communication device with a first talkgroup, present, on the display, a first application related to the first talkgroup, receive, via the user input interface, a user input indicative of a request to change talkgroups, associate, in response to the user input, the communication device with a second talkgroup, and present, on the display, a second application related to the second talkgroup.

Abstract: Disclosed herein are public safety systems and methods for providing private network access to a user device. An exemplary public safety system is configured to communicate with a plurality of private networks and a communications network. The exemplary public safety system is configured to receive an emergency notification identifying a first private network of the plurality of private networks. The exemplary public safety system is configured to select the first private network. The exemplary public safety system is configured to provision the first private network to accept a configuration credential. The exemplary public safety system is configured to send through the communications network the configuration credential to a user device, thereby provisioning a subscriber identification module (SIM) in the user device to access the first private network.

Abstract: A computing device and method for cloud-assisted perceptual computing is described. The computing device includes a sensor to collect data for perceptual computing. The computing device also includes an analytics determiner to calculate a disposition result based on the data collected by the sensor and to calculate a confidence level of the disposition result. The computing device compares the confidence level to a threshold and sends the data to a cloud computing device in response to the confidence level being below the threshold.

Abstract: An electronic package can include a substrate, a first die and a second die. The first die can include a first thickness and the second die can include a second thickness. The first and second dies can be coupled to the substrate. A mold can be disposed on the substrate and cover the first die and the second die. The mold can include a planar upper surface. A first via, having a first length, can be extended between the first die and the planar upper surface. A second via, having a second length, can be extended between the second die and the planar upper surface. In some examples, a third die can be communicatively coupled to the first die using the first via and the second die using the second via.

Abstract: Various systems and methods for configuring a pluggable computing device are described herein. A pluggable computing device may be configured to be compatible with a pluggable host system using a default communication channel to obtain configuration settings and configure a programmable logic device on the pluggable computing device. The pluggable computing device may perform chain of trust processing on the pluggable host system. The pluggable computing device may be disposed on a compute card, which may include a heat sink in a particular configuration.

Abstract: Integrated circuit (IC) structures with extended conductive pathways, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, an IC structure may include a die having a device side and an opposing back side; a mold compound disposed at the back side; and a conductive pathway extending into the die from the back side and extending into the mold compound from the back side.

Abstract: A method and apparatus for annotating video is provided herein. During the process of annotating a video, important text within a form is identified. Annotations are placed within the video that are related to the important text within the form. In addition to annotating the video with important text taken from the form, Information that is determined based on the text, may be taken from the video in order to help fill the form.

Abstract: A method and apparatus for annotating video is provided herein. During the process of annotating a video, important text within a form is identified. Annotations are placed within the video that are related to the important text within the form. In addition to annotating the video with important text taken from the form, Information that is determined based on the text, may be taken from the video in order to help fill the form.

Abstract: Techniques for video analytics of captured video content are described. An apparatus may comprise a flash memory, a serial bus, and a processor circuit coupled to the flash memory and the serial bus. The processor circuit may comprise a multi-core central processing unit (CPU) and an integrated graphics processing unit (GPU). The processor circuit may receive captured video content via a local communication link, perform video analytics on the captured video content; and send data associated with the performed video analytics to a network interface, for communication to a remote device via a network communication link. Other examples are described and claimed.

Abstract: Integrated circuit (IC) structures with extended conductive pathways, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, an IC structure may include a die having a device side and an opposing back side; a mold compound disposed at the back side; and a conductive pathway extending into the die from the back side and extending into the mold compound from the back side.