Patents by Inventor Yen-Kun Wang

Yen-Kun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040083962
    Abstract: Processing gases reactive with each other are provided in parallel to a processing chamber through separate delivery lines including mass flow controllers devoted to each line. The parallel delivery lines meet in a mixing manifold located proximate to the processing chamber and relatively far downstream from the mass flow controllers and other flow-constricting components of the gas delivery system. The continuous high flow of gas provided by the devoted mass flow controllers may maintain a sufficiently high pressures on the delivery lines to prevent partial clogging from leading to a further drop in pressure and complete obstruction of the delivery line.
    Type: Application
    Filed: August 15, 2002
    Publication date: May 6, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Won Bang, Yen-Kun Wang, Steve Ghanayem
  • Publication number: 20020000195
    Abstract: Apparatus and method for delivering processing gas are provided. The apparatus for delivering processing gas from a vaporizer to a processing system comprises: a valve connected between the vaporizer and the processing system, the valve having a valve input connected to a vaporizer output and a first valve output connected to a processing system input and a second valve output connected to a bypass line; and a controller for switching the valve between the first valve output and the second valve output. The apparatus may further comprise: a second valve connected between a carrier gas source, a divert gas source and the vaporizer, the second valve having a first valve input connected to the carrier gas source, a second valve input connected to the divert gas source, and a valve output connected to a vaporizer input.
    Type: Application
    Filed: April 10, 2001
    Publication date: January 3, 2002
    Inventors: Won Bang, Yen Kun Wang, Yeh Jen Kao
  • Patent number: 6176198
    Abstract: The invention provides a deposition system and methods of depositing materials onto substrates. In one aspect, a modular processing chamber is provided which includes a chamber body defining a processing region. The chamber body includes a removable gas feedthrough, an electrical feedthrough, a gas distribution assembly mounted on a chamber lid and a microwave applicator for generating reactive gases remote from the processing region.
    Type: Grant
    Filed: November 2, 1998
    Date of Patent: January 23, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Yeh-Jen Kao, Fong M. Chang, Robert B. Majewski, John Parks, David Wanamaker, Yen-Kun Wang
  • Patent number: 6148761
    Abstract: A multi-channel faceplate 200, that in some embodiments is monolithic, is provided as a portion of a gas delivery system to a process chamber 100. At least two sets of gas pathways are disposed through a faceplate and allow for independent delivery of separate gases into a process chamber 100. In one embodiment, a first gas pathway, which includes a first set of vertical channels 226, is formed through the faceplate 200. A second gas pathway includes a second set of vertical channels 228, which is formed through a portion of the faceplate and connected to a set of interconnecting horizontal channels 222 in the faceplate 200, where the second gas pathway maintains fluidic separation from the first gas pathway, prior to the gases entering the process chamber 100.
    Type: Grant
    Filed: December 9, 1998
    Date of Patent: November 21, 2000
    Assignee: Applied Materials, Inc.
    Inventors: Robert Majewski, Yeh-Jen Kao, Yen Kun Wang
  • Patent number: 5968588
    Abstract: An apparatus for in-situ control of the flow of a liquid precursor into a deposition chamber comprises a liquid injection system having a liquid injection outlet connected to a chamber inlet line upstream of the deposition chamber. The liquid injection system includes a liquid precursor supply, a carrier gas supply, a vaporizer, and a controller managing flows of the liquid precursor and carrier gas to the chamber. A bypass line is connected to the chamber inlet line and includes a bypass valve, a sonic orifice, and a pressure gauge upstream of the sonic orifice. To calibrate the flow of the liquid precursor, a flow of carrier gas is directed into the bypass line at a carrier gas sonic flow rate. A first steady state pressure is measured with the pressure gauge. The liquid precursor is vaporized and directed to the flow of carrier gas into the bypass line. A second steady state pressure is measured with the pressure gauge.
    Type: Grant
    Filed: March 17, 1997
    Date of Patent: October 19, 1999
    Assignee: Applied Materials, Inc.
    Inventors: Visweswaren Sivaramakrishnan, Yen-Kun Wang, Fong Chang, Thanh Pham, Jeff Plante
  • Patent number: 5866795
    Abstract: An apparatus for controlling the flow of a liquid precursor into a deposition chamber comprises a liquid injection system having a liquid injection outlet connected to a chamber inlet line upstream of the deposition chamber. The liquid injection system includes a liquid precursor supply, a purge gas supply, a carrier gas supply, a liquid flow meter, and a controller managing flows of the liquid precursor and carrier gas to the chamber. A purge line is connected between the purge gas supply and the liquid flow meter and is used to trap a known mass of liquid precursor. To calibrate the flow of the liquid precursor, the purge gas is used to push the trapped liquid precursor through the liquid flow meter at a steady rate. The elapsed time for evacuating the trapped liquid precursor from the purge line is measured. Calibration information is computed using the mass of the trapped liquid precursor and the measured elapsed time based on the direct liquid measurement approach.
    Type: Grant
    Filed: March 17, 1997
    Date of Patent: February 2, 1999
    Assignee: Applied Materials, Inc.
    Inventors: Yen-Kun Wang, Fong Chang, Thanh Pham, Jeff Plante