Abstract: The disclosed techniques include a space filling device to be used with a wet bench in chemical replacement procedures. The space filling device has an overall density that is higher than the chemicals used to purge the wet bench. As such, when embedded into the wet bench, or more specifically, the chemical tank of the wet bench, the space filling device will occupy a portion of the interior volume space. As a result, less purging chemicals are used to fill and bath the wet bench.

Abstract: A driving device for use in a hub assembly includes a stationary ring, a connecting seat and a pawl unit, all of which surround an axis. The stationary ring has a plurality of angularly spaced-apart ratchet grooves that are symmetric. The connecting seat has a sprocket and at least one connecting portion, both of which are arranged along the axis. The pawl unit includes a ring-shaped coupling seat that is removably sleeved on the connecting seat and that has at least one coupling portion engaging removably the at least one connecting portion, and a plurality of angularly spaced-apart retaining grooves, each retaining a pawl and a resilient member for engaging a corresponding one of the ratchet grooves of the stationary ring.

Abstract: A driving device for use in a hub assembly includes a stationary ring, a connecting seat and a pawl unit, all of which surround an axis. The stationary ring has a plurality of angularly spaced-apart ratchet grooves that are symmetric. The connecting seat has a sprocket and at least one connecting portion, both of which are arranged along the axis. The pawl unit includes a ring-shaped coupling seat that is removably sleeved on the connecting seat and that has at least one coupling portion engaging removably the at least one connecting portion, and a plurality of angularly spaced-apart retaining grooves, each retaining a pawl and a resilient member for engaging a corresponding one of the ratchet grooves of the stationary ring.

Abstract: A semiconductor circuit pattern includes an angled conductive pattern having a line portion and a pad portion at an end of the line portion extending normal to the line portion on a first side of the line portion. The pad portion has a width greater than a width of the line portion. A spacing has a first portion adjacent the first side of the pad portion, and a second portion adjacent a second side of the pad portion opposite the first side. The first portion of the spacing has a width greater than the width of the second portion of the spacing.

Abstract: A semiconductor circuit pattern includes an angled conductive pattern having a line portion and a pad portion at an end of the line portion extending normal to the line portion on a first side of the line portion. The pad portion has a width greater than a width of the line portion. A spacing has a first portion adjacent the first side of the pad portion, and a second portion adjacent a second side of the pad portion opposite the first side. The first portion of the spacing has a width greater than the width of the second portion of the spacing.