Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: A bonding tool includes a gas supply line that may extend directly between valves associated with one or more gas supply tanks and a processing chamber such that gas supply line is uninterrupted without any intervening valves or other types of structures that might otherwise cause a pressure buildup in the gas supply line between the processing chamber and the valves associated with the one or more gas supply tanks. The pressure in the gas supply line may be maintained at or near the pressure in the processing chamber so that gas provided to the processing chamber through the gas supply line does not cause a pressure imbalance in the processing chamber, which might otherwise cause early or premature contact between semiconductor substrates that are to be bonded in the processing chamber.

Abstract: A connection structure applied to a fan for connecting a metal member with a shaft by means of laser. The connection structure includes a metal member and a shaft. The metal member has an opening, a first side and a second side. The opening is formed through a center of the metal member. The shaft is inserted in the opening. An outer circumference of the shaft is welded with a circumference of the opening on the first side to form at least one first welding section between the contact sections of the outer circumference of the shaft and the circumference of the opening on the first side. The first welding section is connected between the outer circumference of the shaft and the circumference of the opening on the first side to integrally connect the metal member with the shaft. The connection structure applied to the fan can lower cost.

Abstract: A connection structure applied to a fan for connecting a metal member with a shaft by means of laser. The connection structure includes a metal member and a shaft. The metal member has an opening, a first side and a second side. The opening is formed through a center of the metal member. The shaft is inserted in the opening. An outer circumference of the shaft is welded with a circumference of the opening on the first side to form at least one first welding section between the contact sections of the outer circumference of the shaft and the circumference of the opening on the first side. The first welding section is connected between the outer circumference of the shaft and the circumference of the opening on the first side to integrally connect the metal member with the shaft. The connection structure applied to the fan can lower cost.