Abstract: A method and a kit for evaluating the risk of diseases or conditions associated with atherosclerosis by detecting at least one genotype for single nucleotide polymorphism in a biological sample of a subject. The at least one genotype for the single nucleotide polymorphism may be a genotype for rs12657663 in CAMLG gene, a genotype for rs2273970 in GALNT2 gene, a genotype for rs643634 in SPINDOC gene, a genotype for rs737976 in THOC5 gene, or a genotype for rs9988179 in SAMD11 gene.

Abstract: A protective device for a central processing unit contains a supporter disposed on a central processing unit (CPU), wherein a window is formed in the central portion of the supporter; a plurality of predetermined support spring pieces are formed around the window for holding a heat sink to contact the CPU in a stable manner so that the heat produced by the CPU can be efficiently conducted to the heat sink.

Abstract: The present invention relates to a type of chips radiating structure, there being a radiating plate on the chips on an interface card, and a fixing unit on the radiating plate; wherein said fixing unit has a main unit to be mounted on the radiating plate and a number of pressing arms that extend from the main unit, said pressing arm has a through hole, serving to be inserted by a fastener which penetrates said hole and the fixing hole on the interface card, so that the radiating plate is fastened onto the chips; said fixing unit serves to securely fasten the radiating plate onto the chips, so designed that the radiating plate will quickly dissipate the heat energy generating from the chips, to ensure the normal operation of the chips.

Abstract: A cartridge type CPU module cooling structure includes a fixing plate fastened to upright mounting rods of a heat sink to hold down a CPU module on the heat sink, wherein the upright mounting rods of the heat sink each have a neck; the fixing plate has a plurality of projecting spring leaves respectively coupled to the upright mounting rods of the heat sink, and a plurality of mounting slots respectively extended to the spring leaves for permitting the spring leaves to be coupled to the upright mounting rods, the mounting slots each having an expanded insertion portion at one end through which one upright mounting rod of the heat sink is inserted to hold the fixing plate on the CPU module at a first position, and an elongated guide portion extended from the respective expanded insertion portion to a part of one spring leaf into which the neck of one upright mounting rod is engaged to hold the fixing plate on the CPU module at a second position, causing the respective spring leaf to deform and to impart a pres

Abstract: The present invention relates to a card type CPU fixing structure, characterized in that when said card type CPU (CELERON) is inserted in the main board of Pentium II framework, there is no need to change the support seat. All the user has to do is to fasten the fixing cover on the support seat, the channel on the inside of the fixing cover will press the card type CPU (CELERON) in position, so the card type CPU (CELERON) will not wobble. With the invention, the interchange between a cartridge type Pentium II CPU and a card type CPU (CELERON) can be made readily without having to replace the support seat of the main board. With the invention, the manufacturers of main boards will not have to produce additional compatible components after the card type CPU (CELERON) is put on the market, while the user will be able to replace the CPU easily and readily.

Abstract: An electronic component cooling apparatus fastened to a CPU package for dissipating heat, including a heat sink module retained in contact with the CPU package, the heat sink module having of radiating fins radially arranged at a top side and a plurality of retaining notches in corners, a fastening device fastened to the CPU package to hold down the heat sink module, the fastening device having a fixed hook and a movable hook at two opposite sides respectively hooked up with respective retainer blocks of the CPU package, and a fan unit module mounted on the heat sink module and controlled to cause currents of air for carrying heat away from the heat sink module.