Patents by Inventor Yen-Yun Chang
Yen-Yun Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11417149Abstract: A face recognition device and a face recognition method are provided. The face recognition device includes a camera module, a processor and a memory. The camera module obtains a first image of a recognition target and obtains a second image of the recognition target. The processor analyzes whether the first image meets an image condition to determine whether the recognition target is a real face. The memory stores a face database. When the processor determines that the first image meets the image condition, the processor analyzes a plurality of facial features in the second image, and the processor compares whether the second image matches face registration data in the face database according to the facial features to determine whether the second image passes recognition.Type: GrantFiled: August 18, 2020Date of Patent: August 16, 2022Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Kai-Hsun Chen, Pei-Hua Sun, Yen-Yun Chang
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Patent number: 11283231Abstract: A clamping module is adapted to clamp a memory module and insert or remove the memory module into/from a slot. The clamping module includes a main body, two jaw clamps and a blocking pressing plate. The two jaw clamps are movably disposed on the main body and adapted to move in relative to each other to clamp or release the memory module. The blocking pressing plate is movably disposed on the main body, wherein after the two jaw clamps clamp the memory module to a position in contact with the slot, the two jaw clamps moves away from each other so that the memory module is released and the blocking pressing plate moves from a first position to a second position in order to press the memory module so that the memory module is inserted into the slot.Type: GrantFiled: August 13, 2019Date of Patent: March 22, 2022Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Hsing-Feng Tsai, Yen-Yun Chang, Tsung-Ta Wu
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Patent number: 11191149Abstract: A heat dissipating assembly of M.2 expansion card is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed to the motherboard through the fixed portion. The locking member is detachably disposed on the at least one screw hole, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.Type: GrantFiled: January 8, 2020Date of Patent: November 30, 2021Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Yuan-Li Chien, Yen-Yun Chang
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Publication number: 20210326580Abstract: A face recognition device and a face recognition method are provided. The face recognition device includes a camera module, a processor and a memory. The camera module obtains a first image of a recognition target and obtains a second image of the recognition target. The processor analyzes whether the first image meets an image condition to determine whether the recognition target is a real face. The memory stores a face database. When the processor determines that the first image meets the image condition, the processor analyzes a plurality of facial features in the second image, and the processor compares whether the second image matches face registration data in the face database according to the facial features to determine whether the second image passes recognition.Type: ApplicationFiled: August 18, 2020Publication date: October 21, 2021Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.Inventors: Kai-Hsun Chen, Pei-Hua Sun, Yen-Yun Chang
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Publication number: 20200170101Abstract: A heat dissipating assembly of M.2 expansion card is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed to the motherboard through the fixed portion. The locking member is detachably disposed on the at least one screw hole, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.Type: ApplicationFiled: January 8, 2020Publication date: May 28, 2020Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.Inventors: Yuan-Li Chien, Yen-Yun Chang
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Publication number: 20200170100Abstract: A heat dissipating assembly of M.2 expansion card is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed to the motherboard through the fixed portion. The locking member is detachably disposed on the at least one screw hole, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.Type: ApplicationFiled: January 21, 2019Publication date: May 28, 2020Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.Inventors: Yuan-Li Chien, Yen-Yun Chang
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Publication number: 20200161823Abstract: A clamping module is adapted to clamp a memory module and insert or remove the memory module into/from a slot. The clamping module includes a main body, two jaw clamps and a blocking pressing plate. The two jaw clamps are movably disposed on the main body and adapted to move in relative to each other to clamp or release the memory module. The blocking pressing plate is movably disposed on the main body, wherein after the two jaw clamps clamp the memory module to a position in contact with the slot, the two jaw clamps moves away from each other so that the memory module is released and the blocking pressing plate moves from a first position to a second position in order to press the memory module so that the memory module is inserted into the slot.Type: ApplicationFiled: August 13, 2019Publication date: May 21, 2020Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.Inventors: Hsing-Feng Tsai, Yen-Yun Chang, Tsung-Ta Wu
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Patent number: 10645794Abstract: A heat dissipating assembly of M.2 expansion card is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed to the motherboard through the fixed portion. The locking member is detachably disposed on the at least one screw hole, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.Type: GrantFiled: January 21, 2019Date of Patent: May 5, 2020Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Yuan-Li Chien, Yen-Yun Chang
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Publication number: 20190369955Abstract: A voice-controlled display device comprises a display panel, a signal input port, two microphones, a microprocessor and a display controller. The signal input port is configured to receive a first video signal from a host. Each of the microphone comprises a sound-receiving terminal for receiving an external audio, wherein the sound-receiving terminal is disposed adjacent to the display panel and the sound-receiving terminal and the display panel are located on the same side of the voice-controlled display device. The microprocessor electrically connects to the microphones and the microprocessor performs a voice recognition procedure to obtain an instruction according to the external audio. The display controller electrically connects to the signal input port, the display panel and the microprocessor, wherein the display controller transforms the first video signal to a second video signal and the display panel display one of the first video signal and the second video signal.Type: ApplicationFiled: April 9, 2019Publication date: December 5, 2019Applicant: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Cheng-Lung LIN, Yen-Yun CHANG, Chic-Chen HUANG, Shih-Pin CHANG
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Patent number: 10203961Abstract: A BIOS control method for PCI-E lanes includes the following steps. A BIOS obtains information of whether a first expansion card and a second expansion card are respectively inserted in a first PCI-E slot and a second PCI-E slot, and if the second expansion card is inserted in the second PCI-E slot, then the BIOS instructs a CPU to reverse the order of PCI-E lanes electrically connected between the CPU and the second PCI-E slot.Type: GrantFiled: September 2, 2016Date of Patent: February 12, 2019Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Pei-Hua Sun, Yen-Yun Chang, Weiyuan Cheng
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Patent number: 10083145Abstract: A motherboard module having switchable PCI-E lanes includes a CPU, a first PCI-E slot, a second PCI-E slot, a first switch, and a second switch. 1st to a-th processor pin sets of the CPU are switchably electrically connected to 1st to a-th first PCI-E pin sets of the first PCI-E slot or (2N?a+1)th to 2N-th second PCI-E pin sets of the second PCI-E slot via the first switch to form PCI-E lanes whose number is a. (a+1)-th to 2N-th processor pin sets of the CPU are connected to the second input terminal of the second switch, and the second output terminal of the second switch is switchably electrically connected to (a+1)-th to 2N-th first PCI-E pin sets of the first PCI-E slot or 1st to (2N?a)th second PCI-E pin sets of the second PCI-E slot to form PCI-E lanes whose number is 2N?a, wherein 1<a<2N.Type: GrantFiled: September 2, 2016Date of Patent: September 25, 2018Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.Inventors: Pei-Hua Sun, Hon-Yeh Lee, Yen-Yun Chang
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Publication number: 20180011713Abstract: A BIOS control method for PCI-E lanes includes the following steps. A BIOS obtains information of whether a first expansion card and a second expansion card are respectively inserted in a first PCI-E slot and a second PCI-E slot, and if the second expansion card is inserted in the second PCI-E slot, then the BIOS instructs a CPU to reverse the order of PCI-E lanes electrically connected between the CPU and the second PCI-E slot.Type: ApplicationFiled: September 2, 2016Publication date: January 11, 2018Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.Inventors: Pei-Hua Sun, Yen-Yun Chang, Weiyuan Cheng
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Publication number: 20180011814Abstract: A motherboard module having switchable PCI-E lanes includes a CPU, a first PCI-E slot, a second PCI-E slot, a first switch, and a second switch. 1st to a-th processor pin sets of the CPU are switchably electrically connected to 1st to a-th first PCI-E pin sets of the first PCI-E slot or (2N?a+1)th to 2N-th second PCI-E pin sets of the second PCI-E slot via the first switch to form PCI-E lanes whose number is a. (a+1)-th to 2N-th processor pin sets of the CPU are connected to the second input terminal of the second switch, and the second output terminal of the second switch is switchably electrically connected to (a+1)-th to 2N-th first PCI-E pin sets of the first PCI-E slot or 1st to (2N?a)th second PCI-E pin sets of the second PCI-E slot to form PCI-E lanes whose number is 2N?a, wherein 1<a<2N.Type: ApplicationFiled: September 2, 2016Publication date: January 11, 2018Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.Inventors: Pei-Hua Sun, Hon-Yeh Lee, Yen-Yun Chang