Patents by Inventor Yeon Soo CHO

Yeon Soo CHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151361
    Abstract: A hydrogen supply method includes a two-side heat exchange mode in which both introducing a second fluid into a hydrogen storage part after the second fluid exchanges heat with a first fluid in a second heat exchanger in a state in which a compressor is driven to compress the first fluid and introducing the second fluid into the hydrogen storage part after the second fluid is heated or cooled in a thermal device are performed. The method also includes a one-side heat exchange mode in which one of introducing the second fluid into the hydrogen storage part after the second fluid exchanges heat with the first fluid in the second heat exchanger in a state in which the compressor is driven to compress the first fluid and introducing the second fluid into the hydrogen storage part after the second fluid is heated or cooled in the thermal device is performed.
    Type: Application
    Filed: August 30, 2023
    Publication date: May 9, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Yeon Ho Kim, Hoon Mo Park, Kyung Moon Lee, Dong Hoon Nam, Ji Hye Park, Young Jin Cho, Jea Wan Kim, Byeong Soo Shin, Ji Hoon Lee, Ho Young Jeong, Suk Hoon Hong, Man Hee Park, Yeong Jun Kim, Jae Yeon Kim, Ho Chan An
  • Publication number: 20240145346
    Abstract: A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to the substrate and both the semiconductor die and the substrate are at least partially covered by a package body. In some examples, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In some examples, through-mold vias are included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. In some examples, an interposer is electrically connected to the through-mold vias and may be covered by the package body and/or disposed in spaced relation thereto. In some examples, the interposer may not be electrically connected to the through-mold vias but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd
    Inventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
  • Patent number: 10495366
    Abstract: A refrigerator is provided. The refrigerator includes a body having a storage compartment, an ice making device, and an ice bucket to store the generated ice. The ice bucket includes an ice bucket body, an ice storage space inside the ice bucket body, and a spacing member to allow ice to be spaced apart from the ice bucket body toward the ice storage space to secure a flow path of cool air, so that the cool air smoothly flows inside the ice bucket body. A full-ice detecting sensor having an emitter and a receiver to receive optical signals is provided. A control unit determines a full-ice status by receiving an output value of signals received from the full-ice detecting sensor.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: December 3, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Jeong, Bong Su Son, Do Yun Jang, Yeon Soo Cho
  • Publication number: 20160054044
    Abstract: A refrigerator is provided. The refrigerator includes a body having a storage compartment, an ice making device, and an ice bucket to store the generated ice. The ice bucket includes an ice bucket body, an ice storage space inside the ice bucket body, and a spacing member to allow ice to be spaced apart from the ice bucket body toward the ice storage space to secure a flow path of cool air, so that the cool air smoothly flows inside the ice bucket body. A full-ice detecting sensor having an emitter and a receiver to receive optical signals is provided. A control unit determines a full-ice status by receiving an output value of signals received from the full-ice detecting sensor.
    Type: Application
    Filed: July 30, 2015
    Publication date: February 25, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin JEONG, Bong Su SON, Do Yun JANG, Yeon Soo CHO